SCHEMBL2804399

SCHEMBL2804399

Nc1ccc(CCO[SiH3])cc1

nearest known ligand 0.59

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
GFER P55789 1/20 0.59
MAOB P27338 4/20 0.50
MAOA P21397 2/20 0.50
NPC1 O15118 2/20 0.48
RAB9A P51151 2/20 0.48
ALDH1A1 P00352 1/20 0.46
CYP3A4 P08684 1/20 0.46
TSHR P16473 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
LOXL2 Q9Y4K0 1/20 0.44
CYP19A1 P11511 5/20 0.44
RECQL P46063 1/20 0.42
MEN1 O00255 1/20 0.38
MAPT P10636 1/20 0.38
KMT2A Q03164 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14349913 0.78 GFER (0.62) GFERMAOBMAOANPC1RAB9A
SCHEMBL5659 0.76 GFER (0.59) GFERMAOBMAOANPC1RAB9A
SCHEMBL3481791 0.76 CYP1A2 (0.50) ALDH1A1TDP1MEN1MAPTKMT2A
SCHEMBL187043 0.76 GFER (1.00) GFERMAOBMAOAALDH1A1CYP3A4
SCHEMBL8164156 0.76 GFER (1.00) GFERMAOBMAOAALDH1A1CYP3A4
SCHEMBL3482833 0.76 GFER (1.00) GFERMAOBMAOAALDH1A1CYP3A4
SCHEMBL523683 0.75 CA1 (0.48) MAOBMAOANPC1RAB9AALDH1A1
SCHEMBL8579307 0.75 ALDH1A1 (0.50) GFERMAOBMAOARAB9AALDH1A1
Hydrochloric Acid SCHEMBL11206003 0.74 GFER (0.56) GFERMAOBMAOANPC1RAB9A
SCHEMBL2865197 0.74 MAOB (0.59) MAOBMAOANPC1RAB9AALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12109812-B2 Ink jet printing method and ink jet printing apparatus SEIKO EPSON CORPORATION (JP) 2024-10-08 US disclosed
CN-114055975-A Ink jet recording method and ink jet recording apparatus 精工爱普生株式会社 2022-02-18 CN disclosed
US-20220032618-A1 Ink Jet Printing Method And Ink Jet Printing Apparatus SEIKO EPSON CORPORATION (JP) 2022-02-03 US disclosed
US-10259208-B2 Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2019-04-16 US disclosed
US-9579852-B2 Method for manufacturing three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2017-02-28 US disclosed
US-20160339602-A1 METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE, THREE-DIMENSIONAL STRUCTURE MANUFACTURING APPARATUS, AND THREE-DIMENSIONAL STRUCTURE SEIKO EPSON CORPORATION (JP) 2016-11-24 US disclosed
US-20160263829-A1 THREE-DIMENSIONAL MODELING APPARATUS, MANUFACTURING METHOD, AND COMPUTER PROGRAM SEIKO EPSON CORPORATION (JP) 2016-09-15 US disclosed
US-9415545-B2 Method of manufacturing three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2016-08-16 US disclosed
US-20160107385-A1 THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING METHOD AND THREE-DIMENSIONAL SHAPED OBJECT SEIKO EPSON CORPORATION (JP) 2016-04-21 US disclosed
US-20150273765-A1 METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE AND THREE-DIMENSIONAL STRUCTURE SEIKO EPSON CORPORATION (JP) 2015-10-01 US disclosed
US-7776397-B2 Process for producing chemical adsorption film and chemical adsorption film SEIKO EPSON CORPORATION (JP) 2010-08-17 US disclosed
EP-2168757-A1 METHOD FOR PRODUCING PLASTIC LENS Hoya Corporation (JP) 2010-03-31 EP disclosed
US-20090077798-A1 METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-26 US disclosed
US-20090071706-A1 METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-19 US disclosed
US-7500895-B2 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2009-03-10 US disclosed
US-20080317943-A1 METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE SEIKO EPSON CORPORATION (JP) 2008-12-25 US disclosed
US-20080311285-A1 CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD SEIKO EPSON CORPORATION (JP) 2008-12-18 US disclosed
US-20060127563-A1 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2006-06-15 US disclosed
US-20060019034-A1 Process for producing chemical adsorption film and chemical adsorption film SEIKO EPSON CORPORATION (JP) 2006-01-26 US disclosed
US-20050287392-A1 Organic electroluminescent device, method for producing the same, and electronic apparatus SEIKO EPSON CORPORATION (JP) 2005-12-29 US disclosed