Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PDE3B | Q13370 | 1/20 | 0.35 |
| ▸ | PDE3A | Q14432 | 1/20 | 0.35 |
| ▸ | P2RY12 | Q9H244 | 1/20 | 0.35 |
| ▸ | TYMP | P19971 | 2/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27786893 | 0.77 | CYP2C9 (0.37) | TYMP | |
| SCHEMBL5090318 | 0.72 | PDE3B (0.31) | PDE3BPDE3AP2RY12 | |
| SCHEMBL13413739 | 0.71 | MMP9 (0.36) | TYMP | |
| Glycerin SCHEMBL28078451 | 0.70 | LMNA (0.53) | PDE3BPDE3AP2RY12TYMP | |
| SCHEMBL28498010 | 0.68 | PDE3B (0.30) | PDE3BPDE3AP2RY12 | |
| SCHEMBL11695516 | 0.68 | THRB (0.34) | TYMP | |
| SCHEMBL9743284 | 0.66 | TYMP (0.31) | TYMP | |
| SCHEMBL25427034 | 0.65 | SMN1; SMN2 (0.35) | — | |
| SCHEMBL28006864 | 0.65 | ALOX12 (0.35) | — | |
| SCHEMBL11698657 | 0.63 | TYMP (0.30) | TYMP |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-106008927-A | Rapidly curing adhesives using encapsulated catalyst and focused ultrasound | 波音公司 | 2016-10-12 | — | — | CN | claimed |
| CN-104212375-B | Adhesive sheet and dicing/die bonding film | 日东电工株式会社 | 2019-04-02 | — | — | CN | disclosed |
| CN-109071777-A | Carbon fiber-reinforced resin composition, carbon fiber-reinforced resin composition, solidfied material | 昭和电工株式会社 | 2018-12-21 | — | — | CN | disclosed |
| CN-108884082-A | Monoglycidyl isocyanurate compound and method for producing same | 日产化学株式会社 | 2018-11-23 | — | — | CN | disclosed |
| CN-105916844-B | Compound and composition epoxy resin containing it | 株式会社艾迪科 | 2018-09-11 | — | — | CN | disclosed |
| CN-103649835-B | The composition of formation EUV lithography resist lower membrane with condensation based polymer | 日产化学工业株式会社 | 2018-02-06 | — | — | CN | disclosed |
| CN-103975003-B | Carbon fiber forming blank, moulding material and carbon fibre reinforced composite | 东丽株式会社 | 2017-07-28 | — | — | CN | disclosed |
| CN-103649217-B | Curable epoxy resin composition | 株式会社大赛璐 | 2017-02-15 | — | — | CN | disclosed |
| CN-106189897-A | Diced chip bonding film, the manufacture method of semiconductor device and semiconductor device | 日东电工株式会社 | 2016-12-07 | — | — | CN | disclosed |
| CN-106167687-A | Adhesive sheet, dicing tape integrated adhesive sheet, thin film, the manufacture method of semiconductor device and semiconductor device | 日东电工株式会社 | 2016-11-30 | — | — | CN | disclosed |
| CN-106008927-A | Rapidly curing adhesives using encapsulated catalyst and focused ultrasound | 波音公司 | 2016-10-12 | — | — | CN | disclosed |
| CN-104169361-B | Thermoplastic resin composition and molded form thereof | 第毛织株式会社 | 2016-10-12 | — | — | CN | disclosed |
| CN-103649218-B | Curable epoxy resin composition | DAICEL CORP. (JP) | 2016-05-11 | — | — | CN | disclosed |