SCHEMBL283175

SCHEMBL283175

Nc1ccc2c(c1N)C(c1ccccc1)c1ccccc1-2

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.38
LMNA P02545 1/20 0.38
TP53 P04637 1/20 0.38
CYP1A2 P05177 1/20 0.38
CYP3A4 P08684 1/20 0.38
MAPK1 P28482 1/20 0.38
HTR2B P41595 1/20 0.38
MAOA P21397 3/20 0.37
MAOB P27338 3/20 0.37
ALDH1A1 P00352 3/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
HSD17B10 Q99714 1/20 0.36
ADRA2C P18825 1/20 0.35
PTGS2 P35354 1/20 0.35
HRH1 P35367 1/20 0.35
HTR3A P46098 1/20 0.35
PDE4D Q08499 1/20 0.35
HTR2A P28223 1/20 0.34
CYP19A1 P11511 1/20 0.34
KDM4E B2RXH2 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15158321 0.90 SMN1; SMN2 (0.37) MAPTLMNATP53CYP3A4MAPK1
SCHEMBL29377413 0.81 ALDH1A1 (0.44) MAPTLMNATP53CYP1A2CYP3A4
SCHEMBL115552 0.81 ALDH1A1 (0.44) MAPTLMNATP53CYP1A2CYP3A4
SCHEMBL15283069 0.81 ALDH1A1 (0.41) MAPTLMNATP53CYP1A2CYP3A4
SCHEMBL25171318 0.76 LMNA (0.54) MAPTLMNATP53CYP1A2CYP3A4
SCHEMBL70993 0.76 LMNA (0.54) MAPTLMNATP53CYP1A2CYP3A4
SCHEMBL29370508 0.76 LMNA (0.54) MAPTLMNATP53CYP1A2CYP3A4
Benzene SCHEMBL27791155 0.76 LMNA (0.54) MAPTLMNATP53CYP1A2CYP3A4
SCHEMBL150218 0.74 CHRNB2 (0.44) MAPTLMNATP53CYP1A2CYP3A4
SCHEMBL30287378 0.74 CHRNB2 (0.44) MAPTLMNATP53CYP1A2CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 97 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3778693-B1 CURABLE RESIN COMPOSITION, ADHESIVE AGENT, ADHESIVE FILM, CIRCUIT SUBSTRATE, INTERLAYER INSULATING MATERIAL, AND PRINTED WIRING BOARD SEKISUI CHEMICAL CO LTD (JP) 2025-09-17 EP disclosed
WO-2025095037-A1 RESIN WIRING BOARD AND STRETCHABLE DEVICE TDK株式会社 2025-05-08 WO disclosed
WO-2025095038-A1 RESIN WIRING SUBSTRATE AND STRETCHABLE DEVICE TDK株式会社 2025-05-08 WO disclosed
WO-2025063189-A1 ORGANIC EL DISPLAY DEVICE 東レ株式会社 2025-03-27 WO disclosed
US-12139576-B2 Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board SEKISUI CHEMICAL CO., LTD. (JP) 2024-11-12 US disclosed
WO-2024204339-A1 POSITIVE PHOTOSENSITIVE PIGMENT COMPOSITION, CURED PRODUCT, AND ORGANIC EL DISPLAY DEVICE 東レ株式会社 2024-10-03 WO disclosed
EP-4324865-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE AGENT, AND ADHESIVE FILM SEKISUI CHEMICAL CO., LTD. (JP) 2024-02-21 EP disclosed
EP-4324895-A1 INSULATING RESIN SHEET, MULTILAYER BODY AND SEMICONDUCTOR DEVICE SEKISUI CHEMICAL CO., LTD. (JP) 2024-02-21 EP disclosed
US-11885694-B2 Temperature sensor element SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2024-01-30 US disclosed
US-11802177-B2 Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agent SEKISUI CHEMICAL CO., LTD. (JP) 2023-10-31 US disclosed
US-20140008751-A1 TRIAZINE RING-CONTAINING POLYMER AND FILM-FORMING COMPOSITION COMPRISING SAME NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2014-01-09 US disclosed
US-8618243-B2 Triazine ring-containing polymer and film-forming composition comprising same NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2013-12-31 US disclosed
US-20130289203-A1 TRIAZINE RING-CONTAINING POLYMER AND FILM-FORMING COMPOSITION CONTAINING SAME NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2013-10-31 US disclosed
US-20130281620-A1 FILM-FORMING COMPOSITION NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2013-10-24 US disclosed
EP-2636697-A1 TRIAZINE RING-CONTAINING POLYMER AND FILM-FORMING COMPOSITION CONTAINING SAME Nissan Chemical Industries, Ltd. (JP) 2013-09-11 EP disclosed
EP-2636704-A1 FILM-FORMING COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2013-09-11 EP disclosed
EP-2628769-A1 FILM-FORMING COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2013-08-21 EP disclosed
US-20130154043-A1 FILM-FORMING COMPOSITION NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2013-06-20 US disclosed
EP-2428529-A1 TRIAZINE RING-CONTAINING POLYMER AND FILM-FORMING COMPOSITION COMPRISING SAME Nissan Chemical Industries, Ltd. (JP) 2012-03-14 EP disclosed
US-20120049308-A1 TRIAZINE RING-CONTAINING POLYMER AND FILM-FORMING COMPOSITION COMPRISING SAME NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2012-03-01 US disclosed