SCHEMBL28345174

SCHEMBL28345174

Cc1cccc(C)c1CN1C(=O)C=CC1=O

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 2/20 0.63
PTGS2 P35354 2/20 0.63
MGLL Q99685 10/20 0.50
FAAH O00519 4/20 0.50
GSK3A P49840 4/20 0.50
GSK3B P49841 4/20 0.50
ALDH1A1 P00352 2/20 0.43
LMNA P02545 2/20 0.43
MAPT P10636 2/20 0.43
NPSR1 Q6W5P4 2/20 0.43
GMNN O75496 1/20 0.43
THPO P40225 1/20 0.43
BLM P54132 1/20 0.43
PMP22 Q01453 1/20 0.43
HSP90AA1 P07900 2/20 0.37
TLR9 Q9NR96 1/20 0.37
TP53 P04637 1/20 0.37
PKM P14618 1/20 0.37
HPGD P15428 1/20 0.37
XBP1 P17861 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL720414 0.78 PTGS1 (1.00) PTGS1PTGS2MGLLFAAHGSK3A
SCHEMBL2087913 0.76 TSHR (0.55) ALDH1A1MAPTNPSR1PKMHPGD
SCHEMBL18974145 0.73 TGM2 (0.66) ALDH1A1MAPTTP53
SCHEMBL7224723 0.71 MGLL (0.60) PTGS1PTGS2MGLLFAAHGSK3A
SCHEMBL5930280 0.71 PTGS1 (0.58) PTGS1PTGS2MGLLFAAHGSK3A
SCHEMBL140975 0.70 MGLL (0.72) PTGS1PTGS2MGLLFAAHGSK3A
SCHEMBL2785687 0.69 PTGS1 (0.73) PTGS1PTGS2MGLLFAAHGSK3A
SCHEMBL4800190 0.68 MGLL (0.78) PTGS1PTGS2MGLLFAAHGSK3A
SCHEMBL146412 0.67 MGLL (1.00) PTGS1PTGS2MGLLFAAHGSK3A
SCHEMBL25435490 0.67 MGLL (1.00) PTGS1PTGS2MGLLFAAHGSK3A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114181511-B Resin composition and product thereof 台光电子材料股份有限公司 2024-06-25 CN claimed
CN-113736255-B Resin composition and product thereof 台光电子材料(昆山)有限公司 2023-07-14 CN claimed
CN-112210210-B Resin composition and product thereof 台光电子材料(昆山)有限公司 2023-04-25 CN claimed
CN-114672167-A Halogen-free flame-retardant resin composition, prepreg prepared from same and laminated board for printed circuit 广东生益科技股份有限公司 2022-06-28 CN claimed
CN-114456574-A Prepreg and product thereof 台光电子材料股份有限公司 2022-05-10 CN claimed
CN-113292824-B Long-chain alkyl polyphenyl ether resin composition and application thereof 珠海宏昌电子材料有限公司 2022-03-11 CN claimed
CN-113292824-A Long-chain alkyl polyphenyl ether resin composition and application thereof 珠海宏昌电子材料有限公司 2021-08-24 CN claimed
CN-114181511-B Resin composition and product thereof 台光电子材料股份有限公司 2024-06-25 CN disclosed
CN-117402478-A Resin composition and product thereof 台光电子材料股份有限公司 2024-01-16 CN disclosed
CN-117143445-A Resin composition and product thereof 台光电子材料股份有限公司 2023-12-01 CN disclosed
CN-116855062-A Resin composition and product thereof 台光电子材料股份有限公司 2023-10-10 CN disclosed
CN-113736255-B Resin composition and product thereof 台光电子材料(昆山)有限公司 2023-07-14 CN disclosed
CN-113444355-B Resin composition and product thereof 中山台光电子材料有限公司 2023-04-14 CN disclosed
CN-111171242-A Resin composition and articles made therefrom 台光电子材料股份有限公司 2020-05-19 CN disclosed
CN-111116814-A Prepolymer, method of making, resin composition, and articles thereof 台光电子材料(昆山)有限公司 2020-05-08 CN disclosed
CN-111004492-A Resin composition and article made therefrom 台光电子材料股份有限公司 2020-04-14 CN disclosed
CN-110938234-A Flame-retardant compound, method for producing same, resin composition, and article thereof 中山台光电子材料有限公司 2020-03-31 CN disclosed
CN-110922536-A Pre-polymerized resin and application thereof 台光电子材料(昆山)有限公司 2020-03-27 CN disclosed
CN-110655536-A Phosphorus-containing compound, phosphorus-containing flame retardant, preparation method and product thereof 台光电子材料(昆山)有限公司 2020-01-07 CN disclosed
CN-110643145-A Resin composition and article made therefrom 中山台光电子材料有限公司 2020-01-03 CN disclosed