Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28850264 | 0.77 | TAS2R14 (0.37) | — | |
| SCHEMBL1635186 | 0.76 | ASPH (0.46) | SORT1ASPH | |
| SCHEMBL28155006 | 0.74 | ASPH (0.37) | SORT1ASPH | |
| SCHEMBL28488951 | 0.70 | GLRA3 (0.39) | SORT1ASPH | |
| SCHEMBL21631883 | 0.70 | ALDH1A1 (0.42) | SORT1 | |
| Benzenepentacarboxylic Acid SCHEMBL432193 | 0.66 | ALDH1A1 (0.43) | — | |
| Mellitic Acid SCHEMBL11153446 | 0.66 | ALDH1A1 (0.43) | — | |
| Benzenepentacarboxylic Acid SCHEMBL27910397 | 0.64 | ALDH1A1 (0.48) | — | |
| Benzenepentacarboxylic Acid SCHEMBL9181397 | 0.64 | ALDH1A1 (0.41) | — | |
| Benzenepentacarboxylic Acid SCHEMBL9725032 | 0.63 | ALDH1A1 (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112980385-B | Adhesive composition, related articles of adhesive composition, and methods of making the same | 荒川化学工业株式会社 | 2024-06-18 | — | — | CN | disclosed |
| CN-108690194-B | Polyimide, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same | 荒川化学工业株式会社 | 2022-11-01 | — | — | CN | disclosed |
| CN-108690193-B | Polyimide, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same | 荒川化学工业株式会社 | 2022-09-09 | — | — | CN | disclosed |
| CN-108690552-B | Adhesive, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same | 荒川化学工业株式会社 | 2022-04-19 | — | — | CN | disclosed |
| CN-112980385-A | Adhesive composition, related article of adhesive composition and method of making the same | 荒川化学工业株式会社 | 2021-06-18 | — | — | CN | disclosed |
| CN-112011308-A | Composition, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same | 荒川化学工业株式会社 | 2020-12-01 | — | — | CN | disclosed |