SCHEMBL2854781

SCHEMBL2854781

COC(=O)CC(C)(C)S

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8374682 0.81 ALDH1A1 (0.38)
SCHEMBL29891624 0.81
SCHEMBL167149 0.78
SCHEMBL667630 0.78 TSHR (0.50)
SCHEMBL869221 0.77 DGKA (0.37)
SCHEMBL585604 0.76
Ammonia Solution, Strong SCHEMBL3909004 0.76 TSHR (0.48)
SCHEMBL6826552 0.76
SCHEMBL7047649 0.76 HMGCR (0.50)
SCHEMBL9226097 0.75 TSHR (0.50)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11803122-B2 Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-31 US disclosed
US-11754926-B2 Method of forming resist pattern, resist composition and method of producing the same TOKYO OHKA KOGYO CO., LTD. (JP) 2023-09-12 US disclosed
US-20230273521-A1 CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-31 US disclosed
US-20230229084-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-20 US disclosed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US disclosed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP disclosed
US-8034959-B2 Methods of treating cancer with an antibody-drug conjugate MEDAREX, INC. (US) 2011-10-11 US disclosed
US-8034959-B2 Methods of treating cancer with an antibody-drug conjugate MEDAREX, INC. (US) 2011-10-11 US disclosed
US-7977465-B2 Peptidyl prodrugs and linkers and stabilizers useful therefor MEDAREX, INC. (US) 2011-07-12 US disclosed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US disclosed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP disclosed
US-RE41252-E1 Peptidyl prodrugs and linkers and stabilizers useful therefor MEDAREX, INC. (US) 2010-04-20 US disclosed
US-RE41252-E1 Peptidyl prodrugs and linkers and stabilizers useful therefor MEDAREX, INC. (US) 2010-04-20 US disclosed
US-20090209734-A1 PEPTIDYL PRODRUGS AND LINKERS AND STABILIZERS USEFUL THEREFOR MEDAREX, INC. (US) 2009-08-20 US disclosed
US-20090175888-A1 METHODS OF TREATING CANCER WITH AN ANTIBODY-DRUG CONJUGATE MEDAREX, INC. (US) 2009-07-09 US disclosed
US-7507420-B2 Peptidyl prodrugs and linkers and stabilizers useful therefor MEDAREX, INC. (US) 2009-03-24 US disclosed
US-7498302-B2 Disulfide prodrugs and linkers and stabilizers useful therefor MEDAREX, INC. (US) 2009-03-03 US disclosed