Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DGKA | P23743 | 1/20 | 0.37 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.34 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | BLM | P54132 | 1/20 | 0.33 |
| ▸ | NAAA | Q02083 | 1/20 | 0.32 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.31 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.31 |
| ▸ | PGR | P06401 | 1/20 | 0.30 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.30 |
| ▸ | CHRM4 | P08173 | 1/20 | 0.30 |
| ▸ | HTR1A | P08908 | 1/20 | 0.30 |
| ▸ | CHRM5 | P08912 | 1/20 | 0.30 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.30 |
| ▸ | CHRNB2 | P17787 | 1/20 | 0.30 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.30 |
| ▸ | TBXA2R | P21731 | 1/20 | 0.30 |
| ▸ | CHRNB4 | P30926 | 1/20 | 0.30 |
| ▸ | CHRNA3 | P32297 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19433047 | 0.93 | ALDH1A1 (0.35) | DGKAADRA2AADRA1AMAPTBLM | |
| SCHEMBL1756074 | 0.91 | NAAA (0.43) | DGKAADRA2AADRA1ANAAATDP1 | |
| SCHEMBL27968609 | 0.83 | GAA (0.50) | CYP2C19SMN1; SMN2ALDH1A1 | |
| SCHEMBL869482 | 0.81 | MAPK1 (0.32) | — | |
| SCHEMBL8374682 | 0.79 | ALDH1A1 (0.38) | ADRA1ACYP2C19CHRM1TBXA2RALDH1A1 | |
| SCHEMBL15694063 | 0.79 | DGKA (0.39) | DGKAADRA2AADRA1AMAPTBLM | |
| SCHEMBL20734718 | 0.79 | GAA (0.41) | MAPTTDP1ALDH1A1 | |
| SCHEMBL23198173 | 0.78 | NAAA (0.34) | NAAA | |
| SCHEMBL28150175 | 0.78 | NAAA (0.38) | NAAATDP1 | |
| SCHEMBL2854781 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2436715-B1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO KK (JP) | 2016-08-24 | — | — | EP | claimed |
| US-8865801-B2 | Epoxy resin-based coating composition | SHOWA DENKO K.K. (JP) | 2014-10-21 | — | — | US | claimed |
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | claimed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | claimed |
| US-20120077903-A1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO K.K. (JP) | 2012-03-29 | — | — | US | claimed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | claimed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | claimed |
| WO-2024142769-A1 | RESIN COMPOSITION, COMPOSITE MATERIAL, AND CURED PRODUCTS OF THESE | 株式会社レゾナック | 2024-07-04 | — | — | WO | disclosed |
| CN-118255944-A | Resin composition, composite material, and cured product thereof | 株式会社力森诺科 | 2024-06-28 | — | — | CN | disclosed |
| US-20230099722-A1 | COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE SHEET, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER | FUJIFILM CORPORATION (JP) | 2023-03-30 | — | — | US | disclosed |
| US-20230058675-A1 | RADICALLY POLYMERIZABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF | SHOWA DENKO K.K. (JP) | 2023-02-23 | — | — | US | disclosed |
| WO-2022224988-A1 | RECESS FILLING MATERIAL KIT, CURED PRODUCT OF SAME, AND RECESS FILLING METHOD | 昭和電工株式会社 | 2022-10-27 | — | — | WO | disclosed |
| WO-2022224989-A1 | RECESS FILLING MATERIAL KIT, CURED PRODUCT THEREOF, AND METHOD FOR FILLING RECESS | 昭和電工株式会社 | 2022-10-27 | — | — | WO | disclosed |
| EP-2436715-B1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO KK (JP) | 2016-08-24 | — | — | EP | disclosed |
| US-8865801-B2 | Epoxy resin-based coating composition | SHOWA DENKO K.K. (JP) | 2014-10-21 | — | — | US | disclosed |
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | disclosed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | disclosed |
| US-20120077903-A1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO K.K. (JP) | 2012-03-29 | — | — | US | disclosed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | disclosed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | disclosed |