SCHEMBL28593264

SCHEMBL28593264

[CH2][Si](c1ccccc1)(c1ccccc1)c1ccccc1.[Zr]

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.35
ESR2 Q92731 1/20 0.35
ALDH1A1 P00352 3/20 0.33
TSHR P16473 4/20 0.32
NPC1 O15118 1/20 0.32
MAPK1 P28482 1/20 0.32
RAB9A P51151 1/20 0.32
NOTUM Q6P988 1/20 0.30
CA1 P00915 2/20 0.30
CA2 P00918 2/20 0.30
CA9 Q16790 2/20 0.30
TDP1 Q9NUW8 2/20 0.30
CA12 O43570 1/20 0.30
GLA P06280 1/20 0.30
CA3 P07451 1/20 0.30
CA4 P22748 1/20 0.30
CA14 Q9ULX7 1/20 0.30
LMNA P02545 1/20 0.30
ALOX12 P18054 1/20 0.30
ACHE P22303 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL439491 0.97 ESR1 (0.36) ESR1ESR2ALDH1A1TSHRNPC1
SCHEMBL852151 0.71 ESR1 (0.44) ESR1ESR2ALDH1A1TSHRNPC1
SCHEMBL9339604 0.71 ESR1 (0.44) ESR1ESR2ALDH1A1TSHRNPC1
SCHEMBL464991 0.67 ALDH1A1 (0.40) ESR1ESR2ALDH1A1TSHRNPC1
SCHEMBL242095 0.67 ALDH1A1 (0.40) ESR1ESR2ALDH1A1TSHRNPC1
SCHEMBL28580119 0.67 ESR1 (0.40) ESR1ESR2ALDH1A1TSHRNPC1
SCHEMBL27473457 0.67 ESR1 (0.67) ESR1ESR2ALDH1A1TSHRNPC1
SCHEMBL21693937 0.65 TP53 (0.38) ESR1ESR2ALDH1A1TSHRLMNA
Ethylene SCHEMBL25342007 0.65 ESR1 (0.44) ESR1ESR2ALDH1A1TSHRNPC1
SCHEMBL434194 0.65 ESR1 (0.44) ESR1ESR2ALDH1A1TSHRNPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113168093-B Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2024-04-30 CN disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 CN disclosed
CN-113383273-A Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2021-09-10 CN disclosed
CN-113168093-A Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2021-07-23 CN disclosed