Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3482415 | 0.83 | ALDH1A1 (0.35) | ALDH1A1 | |
| SCHEMBL2864359 | 0.83 | ACHE (0.31) | ALDH1A1 | |
| SCHEMBL15734222 | 0.81 | CA12 (0.32) | — | |
| SCHEMBL397346 | 0.80 | CA12 (0.30) | — | |
| SCHEMBL15738793 | 0.79 | TUBB1 (0.33) | — | |
| SCHEMBL13239724 | 0.76 | NR1H2 (0.40) | — | |
| SCHEMBL15738264 | 0.75 | NOTUM (0.37) | — | |
| SCHEMBL15341258 | 0.74 | RIPK1 (0.30) | — | |
| SCHEMBL2860931 | 0.73 | ALDH1A1 (0.30) | ALDH1A1 | |
| SCHEMBL6436993 | 0.73 | ESR2 (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2154708-B1 | High-temperature bonding composition, substrate bonding method, and 3-D semiconductor device | SHINETSU CHEMICAL CO (JP) | 2017-07-26 | — | — | EP | disclosed |
| US-9260458-B2 | Method of producing an organic silicon compound | DOW CORNING CORPORATION (US) | 2016-02-16 | — | — | US | disclosed |
| US-20150141689-A1 | Method Of Producing An Organic Silicon Compound | DOW TORAY CO., LTD. (JP) | 2015-05-21 | — | — | US | disclosed |
| US-8277600-B2 | High-temperature bonding composition, substrate bonding method, and 3-D semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-10-02 | — | — | US | disclosed |
| US-20100040895-A1 | HIGH-TEMPERATURE BONDING COMPOSITION, SUBSTRATE BONDING METHOD, AND 3-D SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-02-18 | — | — | US | disclosed |
| EP-2154708-A1 | High-temperature bonding composition, substrate bonding method, and 3-D semiconductor device | Shin-Etsu Chemical Co., Ltd. (JP) | 2010-02-17 | — | — | EP | disclosed |