SCHEMBL28656347

SCHEMBL28656347

Cc1ccc(OP(=O)(O)O)c(O)c1

nearest known ligand 0.50

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
INPPL1 O15357 11/20 0.50
INPP5A Q14642 6/20 0.50
INPP5B P32019 2/20 0.50
AKT1 P31749 1/20 0.50
TRPA1 O75762 2/20 0.45
SRC P12931 1/20 0.41
CA1 P00915 1/20 0.39
CA2 P00918 1/20 0.39
CA9 Q16790 1/20 0.39
TP53 P04637 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
LMNA P02545 1/20 0.38
CHRM1 P11229 1/20 0.38
SLC6A2 P23975 1/20 0.38
ADRA1A P35348 1/20 0.38
HTR2B P41595 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL109597 0.82 INPPL1 (0.52) INPPL1INPP5AINPP5BAKT1SRC
SCHEMBL27559347 0.81 INPPL1 (0.50) INPPL1INPP5AINPP5BAKT1SRC
SCHEMBL20711881 0.80 TRPA1 (0.37) TRPA1CA1CA2CA9TP53
SCHEMBL11360950 0.79 INPPL1 (0.48) INPPL1INPP5AINPP5BAKT1TDP1
SCHEMBL14403284 0.79 ACHE (0.61) INPPL1INPP5AINPP5BAKT1SRC
SCHEMBL14274128 0.79 INPPL1 (0.52) INPPL1INPP5AINPP5BAKT1SRC
SCHEMBL7591862 0.79 INPPL1 (0.48) INPPL1INPP5AINPP5BAKT1SRC
SCHEMBL8620844 0.78 INPPL1 (0.52) INPPL1INPP5AINPP5BAKT1SRC
SCHEMBL9723869 0.78 INPPL1 (0.47) INPPL1INPP5AINPP5BAKT1SRC
SCHEMBL8389196 0.77 INPPL1 (0.67) INPPL1INPP5AINPP5BAKT1SRC

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113402850-B Low-dielectric-constant and low-warpage epoxy plastic packaging material composition, preparation and application 深圳先进电子材料国际创新研究院 2022-04-19 CN disclosed
CN-113402850-A Low-dielectric-constant and low-warpage epoxy plastic packaging material composition, preparation and application 深圳先进电子材料国际创新研究院 2021-09-17 CN disclosed