SCHEMBL2869579

SCHEMBL2869579

CCCCCCCCCCCCCCCCCCCCCCCCC(CC)C[Si](Cl)(Cl)Cl

nearest known ligand 0.46

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.46
ALDH1A1 P00352 3/20 0.41
TDP1 Q9NUW8 1/20 0.41
CYP3A4 P08684 2/20 0.40
TSHR P16473 2/20 0.40
L3MBTL1 Q9Y468 1/20 0.38
FDPS P14324 4/20 0.38
DNM1 Q05193 2/20 0.36
PRSS1 P07477 1/20 0.36
PRSS2 P07478 1/20 0.36
PRSS3 P35030 1/20 0.36
LAP3 P28838 1/20 0.35
THRB P10828 1/20 0.35
OPRM1 P35372 1/20 0.34
SMPD1 P17405 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29001284 1.00 LMNA (0.46) LMNAALDH1A1TDP1CYP3A4TSHR
SCHEMBL6332954 0.91 LMNA (0.50) LMNAALDH1A1TSHRFDPSDNM1
SCHEMBL14760005 0.91 LMNA (0.50) LMNAALDH1A1TSHRFDPSDNM1
SCHEMBL4937119 0.91 LMNA (0.50) LMNAALDH1A1TSHRFDPSDNM1
SCHEMBL8342910 0.91 LMNA (0.50) LMNAALDH1A1TSHRFDPSDNM1
SCHEMBL2686734 0.91 ALDH1A1 (0.50) LMNAALDH1A1TDP1CYP3A4TSHR
SCHEMBL2872482 0.85 LMNA (0.45) LMNAALDH1A1TDP1CYP3A4TSHR
SCHEMBL10422652 0.78 LMNA (0.62) LMNAALDH1A1TDP1CYP3A4TSHR
SCHEMBL996309 0.78 LMNA (0.62) LMNAALDH1A1TDP1CYP3A4TSHR
SCHEMBL22027598 0.78 LMNA (0.62) LMNAALDH1A1TDP1CYP3A4TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220032618-A1 Ink Jet Printing Method And Ink Jet Printing Apparatus SEIKO EPSON CORPORATION (JP) 2022-02-03 US disclosed
US-10259208-B2 Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2019-04-16 US disclosed
US-9956726-B2 Apparatus for producing three-dimensional structure, method of producing three-dimensional structure, and three-dimensional structure SEIKO EPSON CORPORATION (JP) 2018-05-01 US disclosed
US-9732204-B2 Ultraviolet ray curable ink composition for use in ink jet method and printed object SEIKO EPSON CORPORATION (JP) 2017-08-15 US disclosed
US-9579852-B2 Method for manufacturing three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2017-02-28 US disclosed
US-9528019-B2 Ultraviolet-curable inkjet composition and material SEIKO EPSON CORPORATION (JP) 2016-12-27 US disclosed
US-20160339602-A1 METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE, THREE-DIMENSIONAL STRUCTURE MANUFACTURING APPARATUS, AND THREE-DIMENSIONAL STRUCTURE SEIKO EPSON CORPORATION (JP) 2016-11-24 US disclosed
US-20160272833-A1 ULTRAVIOLET-CURABLE INKJET COMPOSITION AND MATERIAL SEIKO EPSON CORPORATION (JP) 2016-09-22 US disclosed
US-20160263829-A1 THREE-DIMENSIONAL MODELING APPARATUS, MANUFACTURING METHOD, AND COMPUTER PROGRAM SEIKO EPSON CORPORATION (JP) 2016-09-15 US disclosed
US-9415545-B2 Method of manufacturing three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2016-08-16 US disclosed
US-8322033-B2 Method for forming a conductive post for a multilayered wiring substrate SEIKO EPSON CORPORATION (JP) 2012-12-04 US disclosed
US-7776397-B2 Process for producing chemical adsorption film and chemical adsorption film SEIKO EPSON CORPORATION (JP) 2010-08-17 US disclosed
US-20090077798-A1 METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-26 US disclosed
US-20090071706-A1 METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-19 US disclosed
US-7500895-B2 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2009-03-10 US disclosed
US-20080317943-A1 METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE SEIKO EPSON CORPORATION (JP) 2008-12-25 US disclosed
US-20080311285-A1 CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD SEIKO EPSON CORPORATION (JP) 2008-12-18 US disclosed
US-20060127563-A1 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2006-06-15 US disclosed
US-20060019034-A1 Process for producing chemical adsorption film and chemical adsorption film SEIKO EPSON CORPORATION (JP) 2006-01-26 US disclosed
US-20050287392-A1 Organic electroluminescent device, method for producing the same, and electronic apparatus SEIKO EPSON CORPORATION (JP) 2005-12-29 US disclosed