SCHEMBL2869652

SCHEMBL2869652

CC(C)(CCCc1ccccc1)O[SiH3]

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 1/20 0.42
L3MBTL1 Q9Y468 1/20 0.41
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
POLB P06746 1/20 0.41
SIGMAR1 Q99720 4/20 0.41
MAOA P21397 1/20 0.41
NAAA Q02083 1/20 0.40
CHRM2 P08172 1/20 0.40
HTR1A P08908 1/20 0.40
ADRA2A P08913 1/20 0.40
CHRM1 P11229 1/20 0.40
DRD1 P21728 1/20 0.40
SLC6A2 P23975 1/20 0.40
SLC6A4 P31645 1/20 0.40
ADRA1A P35348 1/20 0.40
OPRM1 P35372 1/20 0.40
DRD3 P35462 1/20 0.40
SLC6A3 Q01959 1/20 0.40
KCNH2 Q12809 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4454982 0.96 L3MBTL1 (0.46) IDO1L3MBTL1SIGMAR1MAOANAAA
SCHEMBL28731688 0.94 SIGMAR1 (0.47) L3MBTL1SIGMAR1MAOA
SCHEMBL964291 0.88 ALDH1A1 (0.39) IDO1POLBSLC6A2AOC3
SCHEMBL15733746 0.81 TAAR1 (0.40) L3MBTL1SIGMAR1KCNH2AOC3
SCHEMBL27985918 0.80 IDO1 (0.39) IDO1L3MBTL1MEN1KMT2APOLB
SCHEMBL15737041 0.80 TAAR1 (0.46) IDO1SLC6A4SLC6A3
SCHEMBL15735630 0.79 TAAR1 (0.46) IDO1MEN1KMT2AKCNH2
SCHEMBL16714770 0.79 MAOA (0.61) MEN1KMT2ASIGMAR1MAOACHRM2
SCHEMBL16714737 0.79 MAOA (0.56) MEN1KMT2ASIGMAR1MAOACHRM2
SCHEMBL15733562 0.78 TAAR1 (0.40) L3MBTL1SIGMAR1KCNH2AOC3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12109812-B2 Ink jet printing method and ink jet printing apparatus SEIKO EPSON CORPORATION (JP) 2024-10-08 US disclosed
US-20220032618-A1 Ink Jet Printing Method And Ink Jet Printing Apparatus SEIKO EPSON CORPORATION (JP) 2022-02-03 US disclosed
US-10259208-B2 Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2019-04-16 US disclosed
US-9579852-B2 Method for manufacturing three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2017-02-28 US disclosed
US-20160339602-A1 METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE, THREE-DIMENSIONAL STRUCTURE MANUFACTURING APPARATUS, AND THREE-DIMENSIONAL STRUCTURE SEIKO EPSON CORPORATION (JP) 2016-11-24 US disclosed
US-20160263829-A1 THREE-DIMENSIONAL MODELING APPARATUS, MANUFACTURING METHOD, AND COMPUTER PROGRAM SEIKO EPSON CORPORATION (JP) 2016-09-15 US disclosed
US-9415545-B2 Method of manufacturing three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2016-08-16 US disclosed
US-20160107385-A1 THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING METHOD AND THREE-DIMENSIONAL SHAPED OBJECT SEIKO EPSON CORPORATION (JP) 2016-04-21 US disclosed
US-20150273765-A1 METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE AND THREE-DIMENSIONAL STRUCTURE SEIKO EPSON CORPORATION (JP) 2015-10-01 US disclosed
US-20150251352-A1 THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING DEVICE, METHOD FOR MANUFACTURING THREE-DIMENSIONAL SHAPED OBJECT, AND THREE-DIMENSIONAL SHAPED OBJECT SEIKO EPSON CORPORATION (JP) 2015-09-10 US disclosed
US-20090050020-A1 COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME JSR CORPORATION (JP) 2009-02-26 US disclosed
US-20080317943-A1 METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE SEIKO EPSON CORPORATION (JP) 2008-12-25 US disclosed
US-20080311285-A1 CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD SEIKO EPSON CORPORATION (JP) 2008-12-18 US disclosed
EP-1855159-A1 COMPOSITION FOR UNDERLAYER FILM OF RESIST AND PROCESS FOR PRODUCING THE SAME JSR Corporation (JP) 2007-11-14 EP disclosed
US-20060127563-A1 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2006-06-15 US disclosed
US-20060019034-A1 Process for producing chemical adsorption film and chemical adsorption film SEIKO EPSON CORPORATION (JP) 2006-01-26 US disclosed
US-20050287392-A1 Organic electroluminescent device, method for producing the same, and electronic apparatus SEIKO EPSON CORPORATION (JP) 2005-12-29 US disclosed
EP-1085022-A1 A method of manufacturing an acyloxysilane compound having functional groups bonded to silicon atoms via Si-C- bonds Dow Corning Asia, Ltd. (JP) 2001-03-21 EP disclosed
US-6060620-A Method for manufacturing an acyloxysilane compound having functional groups bonded to silicon atoms via SI--C bonds DOW CORNING ASIA, LTD. (JP) 2000-05-09 US disclosed
US-6048994-A Selective hydrosilylation method using hydrido (hydrocarbonoxy) silane DOW CORNING ASIA, LTD. (JP) 2000-04-11 US disclosed