SCHEMBL28836760

SCHEMBL28836760

C=CCOCN1C(=O)C=CC1=O

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 8/20 0.43
ALDH1A1 P00352 5/20 0.39
FAAH O00519 4/20 0.39
MAPT P10636 3/20 0.39
NPSR1 Q6W5P4 3/20 0.39
BLM P54132 2/20 0.39
LMNA P02545 2/20 0.39
GMNN O75496 1/20 0.39
THPO P40225 1/20 0.39
PMP22 Q01453 1/20 0.39
PKM P14618 2/20 0.39
POLB P06746 1/20 0.39
CTDSP1 Q9GZU7 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
HPGD P15428 2/20 0.38
CYP1A2 P05177 1/20 0.38
CYP2C19 P33261 1/20 0.38
WRN Q14191 1/20 0.38
HIF1A Q16665 1/20 0.38
HSP90AA1 P07900 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL145760 0.78 MGLL (0.56) MGLLALDH1A1FAAHMAPTNPSR1
SCHEMBL9940339 0.75 ALDH1A1 (0.59) ALDH1A1MAPTNPSR1PKMPOLB
SCHEMBL22264531 0.74 MGLL (0.52) MGLLALDH1A1FAAHMAPTNPSR1
SCHEMBL88581 0.72 CASP3 (0.48) MGLLALDH1A1FAAHMAPTNPSR1
SCHEMBL28365540 0.70 MGLL (0.56) MGLLALDH1A1FAAHMAPTNPSR1
SCHEMBL17160561 0.70 ALDH1A1 (0.31) ALDH1A1LMNAPKMPOLBCTDSP1
SCHEMBL17160640 0.69 POLB (0.52) ALDH1A1LMNAPOLBSMN1; SMN2
SCHEMBL4859512 0.68 MGLL (0.54) MGLLALDH1A1FAAHMAPTNPSR1
SCHEMBL2454775 0.68 MGLL (0.38) MGLLALDH1A1FAAHMAPTNPSR1
SCHEMBL8747671 0.67 ALDH1A1 (0.53) MGLLALDH1A1FAAHMAPTNPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110941142-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-05-25 CN disclosed
CN-110941142-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2020-03-31 CN disclosed
CN-106104381-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2019-12-13 CN disclosed
CN-106104381-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2016-11-09 CN disclosed