SCHEMBL28981975

SCHEMBL28981975

CCCCC(C#N)c1ccc(OC)c2ccccc12

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
IMPDH2 P12268 1/20 0.45
IMPDH1 P20839 1/20 0.45
IDO1 P14902 1/20 0.38
EP300 Q09472 1/20 0.37
KAT8 Q9H7Z6 1/20 0.37
SLC2A1 P11166 2/20 0.36
CNR2 P34972 3/20 0.36
HPGDS O60760 1/20 0.35
AR P10275 1/20 0.35
TSHR P16473 3/20 0.34
MEN1 O00255 1/20 0.34
GLA P06280 1/20 0.34
KMT2A Q03164 1/20 0.34
SIGMAR1 Q99720 1/20 0.34
NQO1 P15559 1/20 0.33
LMNA P02545 1/20 0.33
POLB P06746 1/20 0.33
MAPT P10636 1/20 0.33
HTT P42858 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18284609 0.80 PPARG (0.40) TSHRMEN1KMT2APOLBMAPT
SCHEMBL11074712 0.76 SMN1; SMN2 (0.40) CNR2TSHRMAPT
SCHEMBL9854623 0.73 BCHE (0.39) IDO1EP300KAT8CNR2HPGDS
SCHEMBL27659183 0.72 ACHE (0.47) ARTSHRMEN1KMT2ALMNA
SCHEMBL9854628 0.72 CAPN1 (0.38) CNR2GLAMAPTNPSR1
SCHEMBL11357537 0.70 LTA4H (0.41) LMNAPOLBMAPTNPSR1GAA
SCHEMBL16486495 0.70 CYP1A2 (0.39) LMNAPOLBMAPTGAAL3MBTL1
SCHEMBL11863611 0.70 CCR1 (0.48) MEN1KMT2ANPSR1L3MBTL1
SCHEMBL9835141 0.70 PPARG (0.42) MEN1KMT2ALMNAMAPTNPSR1
SCHEMBL13719606 0.69 IDO1 (0.55) IMPDH2IMPDH1IDO1EP300KAT8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112204105-B Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2023-04-14 CN disclosed
CN-114867711-B Compound and method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-04-11 CN disclosed