SCHEMBL2901468

SCHEMBL2901468

Cc1cc(Oc2ccc(-c3ccc(O)cc3)cc2)cc(Oc2ccc(-c3ccc(O)cc3)cc2)n1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR2 Q92731 3/20 0.45
MEN1 O00255 3/20 0.45
KMT2A Q03164 3/20 0.45
ESR1 P03372 2/20 0.45
LMNA P02545 2/20 0.44
SMN1; SMN2 Q16637 2/20 0.44
MAPT P10636 3/20 0.43
LTA4H P09960 3/20 0.43
HPGD P15428 2/20 0.43
MAPK1 P28482 2/20 0.43
L3MBTL1 Q9Y468 2/20 0.43
CYP1A2 P05177 2/20 0.43
CYP2C9 P11712 2/20 0.43
CYP2C19 P33261 2/20 0.43
ATM Q13315 1/20 0.43
TSHR P16473 4/20 0.43
NPSR1 Q6W5P4 2/20 0.43
NPC1 O15118 2/20 0.43
HSD17B10 Q99714 2/20 0.42
ALDH1A1 P00352 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5634255 0.95 MEN1 (0.50) ESR2MEN1KMT2AESR1LMNA
SCHEMBL2900905 0.84 ALDH1A1 (0.42) ESR2MEN1KMT2AESR1LMNA
SCHEMBL2906590 0.83 ALDH1A1 (0.54) ESR2MEN1KMT2ALMNASMN1; SMN2
SCHEMBL2906573 0.81 HPGD (0.49) ESR2MEN1KMT2AESR1LMNA
SCHEMBL2906444 0.77 ALDH1A1 (0.58) ESR2MEN1KMT2AESR1LMNA
SCHEMBL2905883 0.75 HPGD (0.53) ESR2MEN1KMT2AESR1LMNA
SCHEMBL14148732 0.74 ESR2 (0.82) ESR2MEN1KMT2AESR1LTA4H
SCHEMBL9581090 0.74 ESR2 (0.82) ESR2MEN1KMT2AESR1LTA4H
SCHEMBL2196668 0.74 ESR2 (0.82) ESR2MEN1KMT2AESR1LTA4H
SCHEMBL21495883 0.74 ESR2 (0.82) ESR2MEN1KMT2AESR1LTA4H

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1636209-B1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL CO (JP) 2010-08-11 EP disclosed
US-7279574-B2 Epoxy compound and cured epoxy resin product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-10-09 US disclosed
US-20060159929-A1 Epoxy compound and cured epoxy resin product HITACHI, LTD. (JP) 2006-07-20 US disclosed
EP-1636209-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT Sumitomo Chemical Company, Limited (JP) 2006-03-22 EP disclosed
WO-2004113327-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2004-12-29 WO disclosed