SCHEMBL5634255

SCHEMBL5634255

Cc1cc(Oc2ccc(O)cc2)cc(Oc2ccc(O)cc2)n1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.50
KMT2A Q03164 3/20 0.50
ESR1 P03372 1/20 0.50
ESR2 Q92731 1/20 0.50
LMNA P02545 3/20 0.48
SMN1; SMN2 Q16637 2/20 0.48
LTA4H P09960 5/20 0.47
TSHR P16473 4/20 0.46
MAPT P10636 3/20 0.46
NPSR1 Q6W5P4 3/20 0.46
NPC1 O15118 2/20 0.46
ALDH1A1 P00352 3/20 0.45
HPGD P15428 2/20 0.45
KDM4E B2RXH2 1/20 0.45
HSD17B10 Q99714 1/20 0.45
MAPK1 P28482 2/20 0.44
L3MBTL1 Q9Y468 2/20 0.44
NR1H2 P55055 1/20 0.44
BAX Q07812 1/20 0.44
RAB9A P51151 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2901468 0.95 ESR2 (0.45) MEN1KMT2AESR1ESR2LMNA
SCHEMBL2900905 0.88 ALDH1A1 (0.42) MEN1KMT2AESR1ESR2LMNA
SCHEMBL2906444 0.81 ALDH1A1 (0.58) MEN1KMT2AESR1ESR2LMNA
SCHEMBL2905883 0.79 HPGD (0.53) MEN1KMT2AESR1ESR2LMNA
SCHEMBL2906590 0.77 ALDH1A1 (0.54) MEN1KMT2AESR2LMNASMN1; SMN2
SCHEMBL28519338 0.76 MEN1 (0.46) MEN1KMT2AESR1ESR2LMNA
SCHEMBL2906573 0.75 HPGD (0.49) MEN1KMT2AESR1ESR2LMNA
SCHEMBL3409718 0.73 ALDH1A1 (0.58) MEN1KMT2ALMNASMN1; SMN2TSHR
SCHEMBL16551547 0.73 MEN1 (0.82) MEN1KMT2AESR1ESR2LMNA
SCHEMBL10874484 0.72 ALDH1A1 (0.65) MEN1KMT2AESR1ESR2SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7279574-B2 Epoxy compound and cured epoxy resin product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-10-09 US disclosed
US-20060159929-A1 Epoxy compound and cured epoxy resin product HITACHI, LTD. (JP) 2006-07-20 US disclosed