SCHEMBL2905433

SCHEMBL2905433

Oc1ccc(Oc2cc(Oc3ccc(O)cc3)ncn2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.54
KMT2A Q03164 1/20 0.54
ESR1 P03372 1/20 0.54
ESR2 Q92731 1/20 0.54
SMN1; SMN2 Q16637 3/20 0.47
NPC1 O15118 1/20 0.47
CYP1A2 P05177 1/20 0.47
CYP2C9 P11712 1/20 0.47
CYP2C19 P33261 1/20 0.47
RAB9A P51151 1/20 0.47
LTA4H P09960 6/20 0.46
NR1H2 P55055 1/20 0.46
BAX Q07812 1/20 0.46
MAPK1 P28482 1/20 0.44
KMO O15229 1/20 0.42
L3MBTL1 Q9Y468 1/20 0.41
CASP3 P42574 1/20 0.41
SENP8 Q96LD8 1/20 0.41
SENP7 Q9BQF6 1/20 0.41
SENP6 Q9GZR1 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2905557 0.94 ESR2 (0.48) MEN1KMT2AESR1ESR2SMN1; SMN2
SCHEMBL2906411 0.84 CYP1A2 (0.42) MEN1KMT2AESR1ESR2SMN1; SMN2
SCHEMBL2904468 0.78 MEN1 (0.54) MEN1KMT2AESR1ESR2LTA4H
SCHEMBL8217612 0.77 SMN1; SMN2 (0.71) MEN1KMT2ASMN1; SMN2NPC1CYP1A2
SCHEMBL2898802 0.76 LTA4H (0.60) MEN1KMT2AESR1ESR2CYP1A2
SCHEMBL5686657 0.75 LTA4H (0.54) MEN1KMT2AESR1ESR2NPC1
SCHEMBL5686902 0.75 DRD1 (0.50) MEN1KMT2AESR1ESR2LTA4H
SCHEMBL22315230 0.75 LTA4H (0.47) MEN1KMT2ASMN1; SMN2NPC1CYP1A2
SCHEMBL10055730 0.75 ALDH1A1 (0.45) MEN1KMT2ASMN1; SMN2NPC1CYP1A2
SCHEMBL2904670 0.75 MEN1 (0.62) MEN1KMT2AESR1ESR2NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1636209-B1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL CO (JP) 2010-08-11 EP disclosed
US-7279574-B2 Epoxy compound and cured epoxy resin product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-10-09 US disclosed
US-20060159929-A1 Epoxy compound and cured epoxy resin product HITACHI, LTD. (JP) 2006-07-20 US disclosed