SCHEMBL29065787

SCHEMBL29065787

O=C1NC(=O)C(C(=O)c2cccc(N3C(=O)C=CC3=O)c2)=C1C(=O)c1cccc(N2C(=O)C=CC2=O)c1

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 10/20 0.53
FAAH O00519 4/20 0.53
HSP90AA1 P07900 4/20 0.49
MAPT P10636 2/20 0.49
MEN1 O00255 1/20 0.49
CYP1A2 P05177 1/20 0.49
CYP3A4 P08684 1/20 0.49
CYP2C9 P11712 1/20 0.49
CYP2C19 P33261 1/20 0.49
KMT2A Q03164 1/20 0.49
APOBEC3G Q9HC16 1/20 0.49
ALDH1A1 P00352 3/20 0.45
PKM P14618 2/20 0.45
HTT P42858 2/20 0.45
ATM Q13315 1/20 0.45
NSD2 O96028 1/20 0.44
G6PD P11413 1/20 0.44
KEAP1 Q14145 1/20 0.44
NFE2L2 Q16236 1/20 0.44
KDM4E B2RXH2 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8530013 0.85 MGLL (0.67) MGLLFAAHHSP90AA1MAPTMEN1
SCHEMBL7799644 0.81 MGLL (0.60) MGLLFAAHHSP90AA1MAPTMEN1
SCHEMBL29510746 0.77 PARP1 (0.65) MGLLFAAHHSP90AA1MAPTMEN1
SCHEMBL10515423 0.77 PARP1 (0.65) MGLLFAAHHSP90AA1MAPTMEN1
SCHEMBL522308 0.77 NSD2 (0.67) MGLLFAAHHSP90AA1MAPTMEN1
SCHEMBL11023896 0.77 MGLL (0.64) MGLLFAAHHSP90AA1MAPTMEN1
SCHEMBL32670837 0.77 NSD2 (0.67) MGLLFAAHHSP90AA1MAPTMEN1
SCHEMBL24529797 0.76 MGLL (0.62) MGLLFAAHHSP90AA1MAPTMEN1
SCHEMBL4363597 0.76 MGLL (0.62) MGLLFAAHHSP90AA1MAPTMEN1
SCHEMBL4594492 0.76 MGLL (0.62) MGLLFAAHHSP90AA1MAPTMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116685634-A Resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package 株式会社力森诺科 2023-09-01 CN disclosed