Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 12/20 | 0.65 |
| ▸ | TLR9 | Q9NR96 | 3/20 | 0.59 |
| ▸ | FAAH | O00519 | 2/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.42 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.42 |
| ▸ | PKM | P14618 | 1/20 | 0.42 |
| ▸ | CCR6 | P51684 | 1/20 | 0.42 |
| ▸ | ATM | Q13315 | 1/20 | 0.42 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.42 |
| ▸ | G6PD | P11413 | 1/20 | 0.42 |
| ▸ | NPC1 | O15118 | 1/20 | 0.39 |
| ▸ | RAB9A | P51151 | 1/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3691135 | 0.85 | MGLL (0.66) | MGLLTLR9FAAHALDH1A1PKM | |
| SCHEMBL9320871 | 0.82 | MGLL (0.71) | MGLLTLR9FAAHALDH1A1HSP90AA1 | |
| SCHEMBL9321659 | 0.81 | MGLL (0.56) | MGLLTLR9FAAHALDH1A1 | |
| SCHEMBL10398325 | 0.80 | MGLL (0.69) | MGLLTLR9FAAHALDH1A1HSP90AA1 | |
| SCHEMBL2837665 | 0.80 | MGLL (0.58) | MGLLTLR9FAAHALDH1A1SMN1; SMN2 | |
| SCHEMBL9324942 | 0.79 | MGLL (0.57) | MGLLTLR9FAAHALDH1A1HSP90AA1 | |
| SCHEMBL141734 | 0.78 | MGLL (1.00) | MGLLTLR9FAAHALDH1A1HSP90AA1 | |
| SCHEMBL29439366 | 0.78 | MGLL (1.00) | MGLLTLR9FAAHALDH1A1HSP90AA1 | |
| SCHEMBL15349922 | 0.77 | ALDH1A1 (0.54) | MGLLTLR9FAAHALDH1A1PKM | |
| SCHEMBL29754607 | 0.77 | MGLL (0.65) | MGLLTLR9FAAHALDH1A1HSP90AA1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116685634-A | Resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package | 株式会社力森诺科 | 2023-09-01 | — | — | CN | disclosed |