SCHEMBL29083012

SCHEMBL29083012

Cc1cccc2c1O[PH](=O)c1c(-c3ccccc3)cccc1-2

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PDCD1 Q15116 1/20 0.40
CD274 Q9NZQ7 1/20 0.40
ADORA3 P0DMS8 1/20 0.37
ADORA2A P29274 1/20 0.37
ADORA1 P30542 1/20 0.37
ALDH1A1 P00352 3/20 0.35
NPC1 O15118 2/20 0.35
RAB9A P51151 2/20 0.35
SMN1; SMN2 Q16637 2/20 0.35
HPGD P15428 1/20 0.35
TSHR P16473 1/20 0.35
KDM4E B2RXH2 2/20 0.35
ENPP3 O14638 1/20 0.33
ENPP1 P22413 1/20 0.33
MAPT P10636 1/20 0.33
SCN8A Q9UQD0 1/20 0.33
HTR7 P34969 4/20 0.33
MYC P01106 1/20 0.33
CYP2A6 P11509 1/20 0.33
CYP2B6 P20813 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30594718 1.00 PDCD1 (0.40) PDCD1CD274ADORA3ADORA2AADORA1
SCHEMBL7108086 0.87 PDCD1 (0.33) PDCD1CD274ALDH1A1HPGDTSHR
SCHEMBL7108192 0.85 ACHE (0.33) ALDH1A1MYCCA1CA2CA9
SCHEMBL30688091 0.77 PDCD1 (0.33) PDCD1CD274ALDH1A1HPGDKDM4E
SCHEMBL30165037 0.77 MYC (0.33) NPC1RAB9ASMN1; SMN2TSHRKDM4E
SCHEMBL2430825 0.77 MYC (0.33) NPC1RAB9ASMN1; SMN2TSHRKDM4E
SCHEMBL7103414 0.77 PDCD1 (0.33) PDCD1CD274ALDH1A1HPGDKDM4E
SCHEMBL30165005 0.70 HNF4A (0.33) ALDH1A1HPGDTSHRCYP2A6LMNA
SCHEMBL28371515 0.69 NPC1 (0.35) ALDH1A1NPC1RAB9ASMN1; SMN2HPGD
SCHEMBL30612770 0.64 CA12 (0.54) PDCD1CD274ALDH1A1NPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110951048-B Phosphorus-containing hardener, epoxy resin composition, cured product, prepreg, and laminate 日铁化学材料株式会社 2023-09-29 CN disclosed