SCHEMBL29131802

SCHEMBL29131802

N#Cc1ccc(C(=O)c2ccc(O)c(O)c2O)c(C(=O)c2ccccc2)c1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 1/20 0.49
KDM4E B2RXH2 4/20 0.46
MAPT P10636 3/20 0.46
ALOX15 P16050 3/20 0.46
HSD17B10 Q99714 3/20 0.46
ALDH1A1 P00352 3/20 0.46
HPGD P15428 3/20 0.46
MEN1 O00255 2/20 0.46
KMT2A Q03164 2/20 0.46
RECQL P46063 2/20 0.46
ALOX12 P18054 1/20 0.46
USP2 O75604 1/20 0.44
GAA P10253 1/20 0.44
KEAP1 Q14145 1/20 0.44
NFE2L2 Q16236 1/20 0.44
MAPK1 P28482 2/20 0.43
XDH P47989 1/20 0.41
SLC22A12 Q96S37 1/20 0.41
KDM4C Q9H3R0 1/20 0.40
SELL P14151 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30669862 0.93 HDAC1 (0.53) HDAC1KDM4EMAPTALOX15HSD17B10
SCHEMBL7328069 0.84 HNF4A (0.50) KDM4EMAPTHSD17B10ALDH1A1HPGD
SCHEMBL7066561 0.81 MEN1 (0.62) KDM4EMAPTHSD17B10ALDH1A1HPGD
SCHEMBL93423 0.81 HDAC1 (0.66) HDAC1KDM4EMAPTALOX15HSD17B10
SCHEMBL29366285 0.81 HDAC1 (0.66) HDAC1KDM4EMAPTALOX15HSD17B10
SCHEMBL27811794 0.81 HDAC1 (0.66) HDAC1KDM4EMAPTALOX15HSD17B10
SCHEMBL10768257 0.79 HDAC1 (0.61) HDAC1KDM4EMAPTALOX15HSD17B10
SCHEMBL29131799 0.79 HDAC1 (0.53) HDAC1KDM4EMAPTALOX15HSD17B10
Benzophenone SCHEMBL28066611 0.79 HDAC1 (0.63) HDAC1KDM4EMAPTALOX15HSD17B10
SCHEMBL6554490 0.79 F2 (0.47) KDM4EMAPTHSD17B10ALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117099045-A Negative photosensitive resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2023-11-21 CN disclosed