SCHEMBL2931696

SCHEMBL2931696

CCOC(=O)c1c2c(c(C(=O)OCC)n1Cc1ccccc1)OCCO2

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.54
MAPK1 P28482 2/20 0.54
TSHR P16473 3/20 0.53
MAPT P10636 5/20 0.48
LMNA P02545 4/20 0.48
SMN1; SMN2 Q16637 3/20 0.48
MEN1 O00255 1/20 0.48
KMT2A Q03164 1/20 0.48
POLB P06746 2/20 0.47
ATM Q13315 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
GAA P10253 3/20 0.47
KDM4E B2RXH2 2/20 0.46
PKM P14618 1/20 0.46
HPGD P15428 1/20 0.46
CASP1 P29466 1/20 0.46
CASP7 P55210 1/20 0.46
HSD17B10 Q99714 1/20 0.46
L3MBTL1 Q9Y468 1/20 0.46
TDP2 O95551 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2930130 0.86 TSHR (0.48) ALDH1A1MAPK1TSHRMAPTLMNA
SCHEMBL2723479 0.86 MAPK8 (0.51) ALDH1A1MAPTLMNASMN1; SMN2KMT2A
SCHEMBL15550285 0.86 KMT2A (0.47) ALDH1A1MAPK1TSHRMAPTLMNA
SCHEMBL182493 0.83 MAPT (0.62) ALDH1A1MAPK1TSHRMAPTLMNA
SCHEMBL2934311 0.83 MAPK8 (0.48) ALDH1A1MAPTLMNASMN1; SMN2KMT2A
SCHEMBL215969 0.81 TSHR (0.44) ALDH1A1MAPK1TSHRMAPTLMNA
SCHEMBL182627 0.81 CCR2 (0.46) ALDH1A1TSHRMAPTLMNASMN1; SMN2
SCHEMBL182752 0.81 TSHR (0.43) ALDH1A1MAPK1TSHRMAPTLMNA
SCHEMBL23174424 0.75 TSHR (0.62) ALDH1A1MAPK1TSHRMAPTLMNA
SCHEMBL6292813 0.75 TSHR (0.56) ALDH1A1MAPK1TSHRMAPTLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3253583-B1 THERMAL MANAGEMENT MATERIALS CONTAINING PHASE CHANGE MATERIALS LATENT HEAT SOLUTIONS LLC (US) 2023-11-29 EP disclosed
EP-3254331-B1 SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTROCHEMICAL DEVICE THERMAL MANAGEMENT LATENT HEAT SOLUTIONS LLC (US) 2023-05-10 EP disclosed
EP-4086082-A1 THERMAL MANAGEMENT MATERIAL FOR THERMAL MANAGEMENT Latent Heat Solutions, LLC (US) 2022-11-09 EP disclosed
US-11411262-B2 Systems, structures and materials for electrochemical device thermal management LATENT HEAT SOLUTIONS, LLC (US) 2022-08-09 US disclosed
CN-111354879-A Systems, structures and materials for electrochemical device thermal management 全球网络视野有限责任公司 2020-06-30 CN disclosed
US-10431858-B2 Systems, structures and materials for electrochemical device thermal management LATENT HEAT SOLUTIONS, LLC 2019-10-01 US disclosed
EP-2877803-B1 SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTRONIC DEVICE COOLING OUTLAST TECH LLC (US) 2019-05-29 EP disclosed
US-10003053-B2 Systems, structures and materials for electrochemical device thermal management GLOBAL WEB HORIZONS, LLC (US) 2018-06-19 US disclosed
WO-2016126815-A1 THERMAL MANAGEMENT FILMS CONTAINING PHASE CHANGE MATERIALS Outlast Technologies, LLC (US) 2016-08-11 WO disclosed
WO-2016126817-A1 SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTROCHEMICAL DEVICE THERMAL MANAGEMENT Outlast Technologies, LLC (US) 2016-08-11 WO disclosed
US-20160212841-A1 SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTRONIC DEVICE COOLING Outlast Technologies, LLC 2016-07-21 US disclosed
US-9392730-B2 Systems, structures and materials for electronic device cooling Outlast Technologies, LLC (US) 2016-07-12 US disclosed
EP-2877803-A2 SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTRONIC DEVICE COOLING Outlast Technologies LLC (US) 2015-06-03 EP disclosed
US-20140043754-A1 SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTRONIC DEVICE COOLING OUTLAST TECHNOLOGIES LLC (US) 2014-02-13 US disclosed
WO-2014018491-A2 SYSTEMS, STRUCTURES AND MATERIALS FOR ELECTRONIC DEVICE COOLING Outlast Technologies, LLC (US) 2014-01-30 WO disclosed
US-8587945-B1 Systems structures and materials for electronic device cooling OUTLAST TECHNOLOGIES LLC (US) 2013-11-19 US disclosed
EP-1461341-B1 PROCESS FOR PREPARING A HETEROAROMATIC COMPOUND SUBSTITUTED WITH ONE OR MORE ETHER GROUPS AGFA GEVAERT (BE) 2010-01-27 EP disclosed
EP-1461341-B1 PROCESS FOR PREPARING A HETEROAROMATIC COMPOUND SUBSTITUTED WITH ONE OR MORE ETHER GROUPS AGFA GEVAERT (BE) 2010-01-27 EP disclosed
US-6734312-B2 CONDENSING HYDROXY- GROUP OF A COMPOUND HAVING HETEROAROMATIC NUCLEUS, WITH AN ALCOHOL CONTAINING ONE OR MORE PRIMARY OR SECONDARY ALCOHOL GROUPS, OPTIONALLY USING THE REDOX COUPLE OF A TRIARYL- OR TRIALKYLPHOSPHINE AND AN AZODIOXO-COMPOUND AGFA-GEVAERT (BE) 2004-05-11 US disclosed
US-20030162958-A1 Process for preparing a compound containing a heteroaromatic group with one or more ether substituents AGFA-GEVAERT (BE) 2003-08-28 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20030162958-A1 Process for preparing a compound containing a heteroaromatic group with one or more ether substituents ADH1C, ADH1A, CYP2E1 ALDH1A1 500/4885MAPK1 2582/4885TSHR 1485/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.