SCHEMBL29375152

SCHEMBL29375152

Cc1cc(O)c(C2CCCCC2)cc1C(c1ccc(O)c(O)c1)c1cc(C2CCCCC2)c(O)cc1C

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HIF1A Q16665 3/20 0.39
HSD17B10 Q99714 3/20 0.39
NUDT1 P36639 1/20 0.39
BACE1 P56817 1/20 0.39
HSP90AA1 P07900 1/20 0.39
ADRB2 P07550 3/20 0.38
QDPR P09417 1/20 0.33
MAPT P10636 5/20 0.33
TDP1 Q9NUW8 5/20 0.33
KDM4E B2RXH2 4/20 0.33
MTOR P42345 3/20 0.33
LMNA P02545 3/20 0.33
ADRB1 P08588 2/20 0.33
ADRB3 P13945 2/20 0.33
TSHR P16473 2/20 0.33
NFKB1 P19838 2/20 0.33
KMT2A Q03164 2/20 0.33
PSMB5 P28074 1/20 0.33
MEN1 O00255 1/20 0.33
ALDH1A1 P00352 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL36430 1.00 HIF1A (0.39) HIF1AHSD17B10NUDT1BACE1HSP90AA1
SCHEMBL30374860 1.00 HIF1A (0.39) HIF1AHSD17B10NUDT1BACE1HSP90AA1
SCHEMBL759679 0.89 HSD17B10 (0.39) HIF1AHSD17B10NUDT1BACE1HSP90AA1
SCHEMBL29375621 0.89 HSD17B10 (0.39) HIF1AHSD17B10NUDT1BACE1HSP90AA1
SCHEMBL36658 0.88 NUDT1 (0.37) NUDT1BACE1HSP90AA1PSMB5
SCHEMBL29372915 0.88 NUDT1 (0.37) NUDT1BACE1HSP90AA1PSMB5
SCHEMBL2864394 0.88 NUDT1 (0.37) NUDT1BACE1HSP90AA1KDM4ELMNA
SCHEMBL29499852 0.88 NUDT1 (0.37) NUDT1BACE1HSP90AA1PSMB5
SCHEMBL28462503 0.87 HIF1A (0.41) HIF1AHSD17B10NUDT1BACE1HSP90AA1
SCHEMBL2201745 0.86 TRPM8 (0.42) QDPRMAPTLMNATSHRNFKB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119620544-A Photosensitive resin composition, dry film, photosensitive dry film, resist film, molded substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2025-03-14 CN disclosed
CN-119361563-A Laminate and method for manufacturing electronic component 东京应化工业株式会社 2025-01-24 CN disclosed
CN-110317174-B Hydrogen barrier agent, composition for forming hydrogen barrier film, method for producing hydrogen barrier film, and electronic device 东京应化工业株式会社 2024-10-22 CN disclosed
CN-118732397-A Positive photoresist composition and method for producing resist pattern 常州强力先端电子材料有限公司 2024-10-01 CN disclosed
CN-117939914-A Structure, display element, pattern for partition wall, and method for forming the same 东京应化工业株式会社 2024-04-26 CN disclosed
CN-114207038-B Resin composition, method for producing cured product, pattern cured product, interlayer insulating film, covercoat, surface protective film, and electronic component 艾曲迪微系统股份有限公司 2024-03-22 CN disclosed
CN-111205648-B Curable composition, cured product, microlens, and optical element 东京应化工业株式会社 2023-12-08 CN disclosed
CN-111324013-B Chemically amplified positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2023-12-01 CN disclosed
CN-117106358-A Composition for forming separation layer, support substrate with separation layer, laminate, method for producing laminate, and method for producing electronic component 东京应化工业株式会社 2023-11-24 CN disclosed
CN-111381438-B Chemically amplified positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2023-06-20 CN disclosed
CN-106933034-B Positive photoresist composition 东京应化工业株式会社 2023-01-06 CN disclosed
CN-111217946-B Composition comprising a compound containing a vinyl group 东京应化工业株式会社 2022-12-06 CN disclosed
CN-115437214-A Chemically amplified positive photosensitive resin composition, protective film, and element having protective film 奇美实业股份有限公司 2022-12-06 CN disclosed
CN-108693710-B Positive photosensitive polysiloxane composition 奇美实业股份有限公司 2022-12-02 CN disclosed
CN-108884574-B Coating agent for forming metal oxide film and method for producing substrate having metal oxide film 东京应化工业株式会社 2022-10-14 CN disclosed
CN-107561863-B Positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2022-09-16 CN disclosed
CN-107870516-B Positive photosensitive resin composition, patterned film and method for manufacturing bump 奇美实业股份有限公司 2022-08-02 CN disclosed
CN-114207038-A Resin composition, method for producing cured product, patterned cured product, interlayer insulating film, covercoat, surface protective film, and electronic component 艾曲迪微系统股份有限公司 2022-03-18 CN disclosed
CN-106715597-B Resin composition, method for producing heat-resistant resin film, and display device 东丽株式会社 2022-03-01 CN disclosed
CN-107179652-B Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2022-02-08 CN disclosed