SCHEMBL759679

SCHEMBL759679

Cc1cc(O)c(C(c2ccc(O)c(O)c2)c2cc(C3CCCCC3)c(C)cc2O)cc1C1CCCCC1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 4/20 0.39
HIF1A Q16665 3/20 0.39
ADRB2 P07550 4/20 0.38
NUDT1 P36639 1/20 0.36
BACE1 P56817 1/20 0.36
HSP90AA1 P07900 1/20 0.36
MAPT P10636 6/20 0.33
TDP1 Q9NUW8 6/20 0.33
KDM4E B2RXH2 6/20 0.33
MTOR P42345 3/20 0.33
LMNA P02545 3/20 0.33
ADRB1 P08588 3/20 0.33
TSHR P16473 3/20 0.33
ADRB3 P13945 2/20 0.33
NFKB1 P19838 2/20 0.33
KMT2A Q03164 2/20 0.33
MAPK1 P28482 2/20 0.33
PSMB5 P28074 1/20 0.33
MEN1 O00255 1/20 0.33
ALDH1A1 P00352 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29375621 1.00 HSD17B10 (0.39) HSD17B10HIF1AADRB2NUDT1BACE1
SCHEMBL30374860 0.89 HIF1A (0.39) HSD17B10HIF1AADRB2NUDT1BACE1
SCHEMBL29375152 0.89 HIF1A (0.39) HSD17B10HIF1AADRB2NUDT1BACE1
SCHEMBL36430 0.89 HIF1A (0.39) HSD17B10HIF1AADRB2NUDT1BACE1
SCHEMBL761688 0.88 NUDT1 (0.34) NUDT1BACE1HSP90AA1PSMB5
SCHEMBL29372576 0.88 NUDT1 (0.34) NUDT1BACE1HSP90AA1PSMB5
SCHEMBL28462503 0.87 HIF1A (0.41) HSD17B10HIF1AADRB2NUDT1BACE1
SCHEMBL29484425 0.80 GABRA1 (0.35) HIF1ANUDT1BACE1HSP90AA1MAPT
SCHEMBL760343 0.80 GABRA1 (0.35) HIF1ANUDT1BACE1HSP90AA1MAPT
SCHEMBL9138946 0.80 TRPA1 (0.42) NUDT1BACE1HSP90AA1TDP1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 115 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5501936-A IMPROVED RESOLUTION OF VERY FINE PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 1996-03-26 US claimed
CN-116360213-A Resin composition and photoresist patterning method using the same 深圳市容大感光科技股份有限公司 2023-06-30 CN disclosed
EP-2980058-B1 COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND TOKYO OHKA KOGYO CO LTD (JP) 2023-05-03 EP disclosed
CN-111217946-B Composition comprising a compound containing a vinyl group 东京应化工业株式会社 2022-12-06 CN disclosed
CN-107561863-B Positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2022-09-16 CN disclosed
CN-107870516-B Positive photosensitive resin composition, patterned film and method for manufacturing bump 奇美实业股份有限公司 2022-08-02 CN disclosed
CN-107179652-B Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2022-02-08 CN disclosed
US-11142629-B2 Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element TOKYO OHKA KOGYO CO., LTD. (JP) 2021-10-12 US disclosed
CN-106154750-B Photosensitive polysiloxane composition, protective film and element with protective film 奇美实业股份有限公司 2021-09-14 CN disclosed
CN-106918989-B Photosensitive polysiloxane composition, protective film and module with protective film 奇美实业股份有限公司 2020-07-31 CN disclosed
US-5738968-A Positive photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1998-04-14 US disclosed
US-5728504-A Positive photoresist compositions and multilayer resist materials using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1998-03-17 US disclosed
US-5702861-A BLEND OF ALKALI SOLUBLE RESIN, QUINONE DIAZIDE COMPOUND AND AN AROMATIC POLYHYDROXY COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1997-12-30 US disclosed
US-5601961-A QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL TOKYO OHKA KOGYO CO., LTD. (JP) 1997-02-11 US disclosed
US-5576138-A MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1996-11-19 US disclosed
US-5501936-A IMPROVED RESOLUTION OF VERY FINE PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 1996-03-26 US disclosed
US-5501936-A IMPROVED RESOLUTION OF VERY FINE PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 1996-03-26 US disclosed
US-5478692-A Fine patterning for electronics TOKYO OHKA KOGYO CO., LTD. (JP) 1995-12-26 US disclosed
US-5434031-A Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive TOKYO OHKA KOGYO CO., LTD. (JP) 1995-07-18 US disclosed
US-5401605-A Positive working photosensitive resin composition containing 1,2-naphthoquinone diazide esterification product of triphenylmethane compound TOKYO OHKA KOGYO CO., LTD. (JP) 1995-03-28 US disclosed