Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HPGD | P15428 | 2/20 | 0.43 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.43 |
| ▸ | LMNA | P02545 | 1/20 | 0.43 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.43 |
| ▸ | IDO1 | P14902 | 1/20 | 0.38 |
| ▸ | CA9 | Q16790 | 4/20 | 0.38 |
| ▸ | CA12 | O43570 | 3/20 | 0.38 |
| ▸ | HCRTR1 | O43613 | 1/20 | 0.37 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.36 |
| ▸ | AURKA | O14965 | 1/20 | 0.36 |
| ▸ | AURKB | Q96GD4 | 1/20 | 0.36 |
| ▸ | EGFR | P00533 | 1/20 | 0.35 |
| ▸ | CDK2 | P24941 | 1/20 | 0.35 |
| ▸ | NAAA | Q02083 | 1/20 | 0.35 |
| ▸ | TTR | P02766 | 1/20 | 0.34 |
| ▸ | MEN1 | O00255 | 2/20 | 0.34 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.34 |
| ▸ | RECQL | P46063 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8592352 | 0.79 | ITGB1 (0.42) | HPGDLMNACA9CA12MEN1 | |
| SCHEMBL6885169 | 0.76 | GABRA1 (0.47) | HIF1AIDO1ALDH1A1TSHRCYP2C19 | |
| SCHEMBL7520863 | 0.75 | L3MBTL1 (0.50) | HSD17B10IDO1CA9CA12CDK2 | |
| SCHEMBL1955296 | 0.74 | IDO1 (0.51) | HPGDHSD17B10IDO1CA9CA12 | |
| SCHEMBL9489915 | 0.74 | TTR (0.45) | CA9CA12TTRMEN1KMT2A | |
| SCHEMBL20810767 | 0.73 | IDO1 (0.42) | HPGDHSD17B10LMNAIDO1CDK2 | |
| SCHEMBL27750868 | 0.71 | HPGD (0.42) | HPGDHSD17B10LMNAHIF1ACA9 | |
| SCHEMBL5710728 | 0.70 | HPGD (0.42) | HPGDHSD17B10LMNAHIF1AAURKA | |
| Diethylamine SCHEMBL28384655 | 0.70 | LMNA (0.57) | HPGDHSD17B10LMNAHIF1AAURKA | |
| SCHEMBL2991540 | 0.70 | PTGES2 (0.45) | CA9CA12KMT2ATDP1CISD1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2022145136-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, PRODUCTION METHOD FOR CURED PRODUCT, SEMICONDUCTOR DEVICE, AND COMPOUND | 富士フイルム株式会社 | 2022-07-07 | — | — | WO | disclosed |
| WO-2022145356-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, CURED PRODUCT MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-07-07 | — | — | WO | disclosed |
| WO-2022145355-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED OBJECT, METHOD FOR PRODUCING CURED OBJECT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-07-07 | — | — | WO | disclosed |
| WO-2022070730-A1 | METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-04-07 | — | — | WO | disclosed |
| WO-2022071226-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, CURED PRODUCT PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-04-07 | — | — | WO | disclosed |
| WO-2022065337-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, CURED PRODUCT PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-31 | — | — | WO | disclosed |
| WO-2022065338-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, CURED PRODUCT PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-31 | — | — | WO | disclosed |
| WO-2022059621-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-24 | — | — | WO | disclosed |
| WO-2022059622-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-24 | — | — | WO | disclosed |
| WO-2022050041-A1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022050135-A1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022050278-A1 | CURABLE RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, SEMICONDUCTOR DEVICE, AND PHOTOBASE GENERATOR | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022045124-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| WO-2022045123-A1 | METHOD FOR PRODUCING POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING CURABLE RESIN COMPOSITION | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| WO-2022045120-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR MANUFACTURING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| WO-2022045059-A1 | RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| WO-2022045060-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |