Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 7/20 | 0.55 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.55 |
| ▸ | GAA | P10253 | 4/20 | 0.55 |
| ▸ | HPGD | P15428 | 3/20 | 0.55 |
| ▸ | GLA | P06280 | 5/20 | 0.48 |
| ▸ | POLB | P06746 | 5/20 | 0.48 |
| ▸ | MAOA | P21397 | 2/20 | 0.48 |
| ▸ | CASP1 | P29466 | 2/20 | 0.48 |
| ▸ | CASP7 | P55210 | 2/20 | 0.48 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.48 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.48 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.48 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.48 |
| ▸ | ADORA3 | P0DMS8 | 1/20 | 0.48 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.48 |
| ▸ | NQO2 | P16083 | 1/20 | 0.48 |
| ▸ | DRD1 | P21728 | 1/20 | 0.48 |
| ▸ | ACHE | P22303 | 1/20 | 0.48 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.48 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL600291 | 1.00 | KDM4E (0.55) | KDM4EALDH1A1GAAHPGDGLA | |
| SCHEMBL22325718 | 0.89 | KDM4E (0.55) | KDM4EALDH1A1GAAHPGDGLA | |
| SCHEMBL9433474 | 0.83 | KDM4E (0.57) | KDM4EALDH1A1GAAHPGDGLA | |
| SCHEMBL28108593 | 0.78 | KDM4E (0.62) | KDM4EALDH1A1GAAHPGDGLA | |
| SCHEMBL321444 | 0.78 | KDM4E (0.75) | KDM4EALDH1A1GAAHPGDGLA | |
| SCHEMBL14130585 | 0.78 | KDM4E (0.61) | KDM4EALDH1A1GAAHPGDGLA | |
| SCHEMBL29446776 | 0.78 | KDM4E (0.75) | KDM4EALDH1A1GAAHPGDGLA | |
| SCHEMBL28603154 | 0.78 | KDM4E (0.47) | KDM4EALDH1A1GAAHPGDGLA | |
| SCHEMBL12187271 | 0.74 | HTR2A (0.58) | KDM4EALDH1A1GAAHPGDGLA | |
| SCHEMBL3343183 | 0.74 | KDM4E (0.69) | KDM4EALDH1A1GAAHPGDGLA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115087929-B | Alkali-soluble resin, photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for forming wiring pattern | 株式会社力森诺科 | 2026-05-19 | — | — | CN | disclosed |
| CN-120202439-A | Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | 株式会社力森诺科 | 2025-06-24 | — | — | CN | disclosed |
| CN-118401894-A | Photosensitive element and method for forming resist pattern | 株式会社力森诺科 | 2024-07-26 | — | — | CN | disclosed |
| EP-4388020-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING PATTERN | Resonac Corporation (JP) | 2024-06-26 | — | — | EP | disclosed |
| CN-118131567-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | 株式会社力森诺科 | 2024-06-04 | — | — | CN | disclosed |
| CN-118043365-A | Polymer, photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for forming wiring pattern | 株式会社力森诺科 | 2024-05-14 | — | — | CN | disclosed |
| CN-113412289-B | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | 株式会社力森诺科 | 2024-04-05 | — | — | CN | disclosed |
| CN-117099044-A | Photosensitive resin film, method for forming resist pattern, and method for forming wiring pattern | 株式会社力森诺科 | 2023-11-21 | — | — | CN | disclosed |
| CN-117083568-A | Photosensitive element and method for manufacturing photosensitive element | 株式会社力森诺科 | 2023-11-17 | — | — | CN | disclosed |
| WO-2023050062-A1 | POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING PATTERN | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2023-04-06 | — | — | WO | disclosed |
| WO-2022201432-A1 | PHOTOSENSITIVE RESIN FILM, RESIST PATTERN FORMING METHOD, AND METHOD FOR FORMING WIRING PATTERN | 昭和電工マテリアルズ株式会社 | 2022-09-29 | — | — | WO | disclosed |
| CN-115087929-A | Alkali-soluble resin, photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for forming wiring pattern | 昭和电工材料株式会社 | 2022-09-20 | — | — | CN | disclosed |
| CN-114901454-A | Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | 昭和电工材料株式会社 | 2022-08-12 | — | — | CN | disclosed |
| CN-114585974-A | Photosensitive resin film, method for forming resist pattern, and method for forming wiring pattern | 昭和电工材料株式会社 | 2022-06-03 | — | — | CN | disclosed |
| WO-2022113161-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 昭和電工マテリアルズ株式会社 | 2022-06-02 | — | — | WO | disclosed |
| WO-2022113829-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD | 昭和電工マテリアルズ株式会社 | 2022-06-02 | — | — | WO | disclosed |
| WO-2022030052-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 昭和電工マテリアルズ株式会社 | 2022-02-10 | — | — | WO | disclosed |