SCHEMBL600291

SCHEMBL600291

c1ccc2c(COCc3c4ccccc4nc4ccccc34)c3ccccc3nc2c1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KDM4E B2RXH2 7/20 0.55
▸ ALDH1A1 P00352 6/20 0.55
▸ GAA P10253 4/20 0.55
▸ HPGD P15428 3/20 0.55
▸ GLA P06280 5/20 0.48
▸ POLB P06746 5/20 0.48
▸ MAOA P21397 2/20 0.48
▸ CASP1 P29466 2/20 0.48
▸ CASP7 P55210 2/20 0.48
▸ SMN1; SMN2 Q16637 2/20 0.48
▸ HSD17B10 Q99714 2/20 0.48
▸ CHRM2 P08172 1/20 0.48
▸ ADRA2A P08913 1/20 0.48
▸ ADORA3 P0DMS8 1/20 0.48
▸ CHRM1 P11229 1/20 0.48
▸ NQO2 P16083 1/20 0.48
▸ DRD1 P21728 1/20 0.48
▸ ACHE P22303 1/20 0.48
▸ SLC6A2 P23975 1/20 0.48
▸ ADRA1A P35348 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29450719 1.00 KDM4E (0.55) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL22325718 0.89 KDM4E (0.55) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL9433474 0.83 KDM4E (0.57) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL28108593 0.78 KDM4E (0.62) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL321444 0.78 KDM4E (0.75) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL14130585 0.78 KDM4E (0.61) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL29446776 0.78 KDM4E (0.75) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL28603154 0.78 KDM4E (0.47) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL12187271 0.74 HTR2A (0.58) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL3343183 0.74 KDM4E (0.69) KDM4EALDH1A1GAAHPGDGLA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026105768-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING PATTERN 株式会社レゾナック 2026-05-21 — — WO disclosed
US-12560867-B2 Photosensitive element and method for producing photosensitive element RESONAC CORPORATION (JP) 2026-02-24 — — US disclosed
US-20250306461-A1 PHOTOSENSITIVE ELEMENT AND METHOD FOR FORMING RESIST PATTERN RESONAC CORPORATION (JP) 2025-10-02 — — US disclosed
US-20250278024-A1 PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD RESONAC CORPORATION (JP) 2025-09-04 — — US disclosed
US-20240392048-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING PATTERN RESONAC CORP (JP) 2024-11-28 — — US disclosed
WO-2024176541-A1 PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 株式会社レゾナック 2024-08-29 — — WO disclosed
WO-2024176305-A1 PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 株式会社レゾナック 2024-08-29 — — WO disclosed
WO-2024135501-A1 PHOTOSENSITIVE ELEMENT AND METHOD FOR FORMING RESIST PATTERN 株式会社レゾナック 2024-06-27 — — WO disclosed
WO-2024116513-A1 PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 株式会社レゾナック 2024-06-06 — — WO disclosed
WO-2024116247-A1 PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 株式会社レゾナック 2024-06-06 — — WO disclosed
US-9235121-B2 Photosensitive resin composition, photosensitive film, permanent resist and method for producing permanent resist HITACHI CHEMICAL COMPANY, LTD. (JP) 2016-01-12 — — US disclosed
CN-105182688-A Photosensitive Resin Composition, Photosensitive Element, Resist Pattern Manufacturing Method, And Printed Circuit Board Manufacturing Method HITACHI CHEMICAL CO LTD 2015-12-23 — — CN disclosed
US-20140154628-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, PERMANENT RESIST AND METHOD FOR PRODUCING PERMANENT RESIST RESONAC CORPORATION (JP) 2014-06-05 — — US disclosed
EP-2284611-B1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD HITACHI CHEMICAL CO LTD (JP) 2013-11-20 — — EP disclosed
US-8460853-B2 Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-06-11 — — US disclosed
US-20120040290-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMATION METHOD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD EACH UTILIZING SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-02-16 — — US disclosed
US-20110081616-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-04-07 — — US disclosed
EP-2284611-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD Hitachi Chemical Company, Ltd. (JP) 2011-02-16 — — EP disclosed
EP-0503076-B1 PHOTOPOLYMERIZABLE COMPOSITION AND PHOTOPOLYMERIZABLE ELEMENT HITACHI CHEMICAL CO LTD (JP) 1997-12-03 — — EP disclosed
EP-0503076-A1 PHOTOPOLYMERIZABLE COMPOSITION AND PHOTOPOLYMERIZABLE ELEMENT HITACHI CHEMICAL CO., LTD. (JP) 1992-09-16 — — EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12560867-B2 Photosensitive element and method for producing photosensitive element TERB1, PRDM9, PRPF8 KDM4E 575/4885ALDH1A1 3248/4885GAA 4425/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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