SCHEMBL9433474

SCHEMBL9433474

COCc1c2ccccc2nc2ccccc12

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KDM4E B2RXH2 6/20 0.57
▸ ALDH1A1 P00352 4/20 0.57
▸ HPGD P15428 3/20 0.57
▸ GAA P10253 2/20 0.57
▸ POLB P06746 4/20 0.55
▸ GLA P06280 4/20 0.46
▸ MAOA P21397 2/20 0.45
▸ CASP1 P29466 2/20 0.45
▸ CASP7 P55210 2/20 0.45
▸ SMN1; SMN2 Q16637 2/20 0.45
▸ HSD17B10 Q99714 2/20 0.45
▸ NQO2 P16083 2/20 0.45
▸ CHRM2 P08172 1/20 0.45
▸ ADRA2A P08913 1/20 0.45
▸ ADORA3 P0DMS8 1/20 0.45
▸ CHRM1 P11229 1/20 0.45
▸ DRD1 P21728 1/20 0.45
▸ ACHE P22303 1/20 0.45
▸ SLC6A2 P23975 1/20 0.45
▸ ADRA1A P35348 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL600291 0.83 KDM4E (0.55) KDM4EALDH1A1HPGDGAAPOLB
SCHEMBL29450719 0.83 KDM4E (0.55) KDM4EALDH1A1HPGDGAAPOLB
SCHEMBL29808111 0.82 ALDH1A1 (0.43) KDM4EALDH1A1POLBSMN1; SMN2TDP1
SCHEMBL1334758 0.82 ALDH1A1 (0.43) KDM4EALDH1A1POLBSMN1; SMN2TDP1
SCHEMBL4646633 0.77 HTR2A (0.54) KDM4EALDH1A1HPGDPOLBGLA
SCHEMBL3343183 0.76 KDM4E (0.69) KDM4EALDH1A1HPGDGAAPOLB
SCHEMBL29446776 0.75 KDM4E (0.75) KDM4EALDH1A1HPGDGAAPOLB
SCHEMBL321444 0.75 KDM4E (0.75) KDM4EALDH1A1HPGDGAAPOLB
SCHEMBL15037542 0.75 ALDH1A1 (0.42) KDM4EALDH1A1HPGDPOLBSMN1; SMN2
SCHEMBL14130585 0.75 KDM4E (0.61) KDM4EALDH1A1HPGDGAAPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106233205-B Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package 日立化成株式会社 2020-06-23 — — CN claimed
EP-4388020-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING PATTERN Resonac Corporation (JP) 2024-06-26 — — EP disclosed
CN-118131567-A Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board 株式会社力森诺科 2024-06-04 — — CN disclosed
CN-118043365-A Polymer, photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for forming wiring pattern 株式会社力森诺科 2024-05-14 — — CN disclosed
CN-113412289-B Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board 株式会社力森诺科 2024-04-05 — — CN disclosed
CN-117099044-A Photosensitive resin film, method for forming resist pattern, and method for forming wiring pattern 株式会社力森诺科 2023-11-21 — — CN disclosed
CN-117083568-A Photosensitive element and method for manufacturing photosensitive element 株式会社力森诺科 2023-11-17 — — CN disclosed
WO-2023050062-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING PATTERN SHOWA DENKO MATERIALS CO., LTD. (JP) 2023-04-06 — — WO disclosed
CN-115087929-A Alkali-soluble resin, photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for forming wiring pattern 昭和电工材料株式会社 2022-09-20 — — CN disclosed
CN-114901454-A Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board 昭和电工材料株式会社 2022-08-12 — — CN disclosed
CN-114585974-A Photosensitive resin film, method for forming resist pattern, and method for forming wiring pattern 昭和电工材料株式会社 2022-06-03 — — CN disclosed
CN-113412289-A Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board 昭和电工材料株式会社 2021-09-17 — — CN disclosed
WO-2021132699-A1 ENERGY RAY-CURABLE COATING MATERIAL FOR THREE-DIMENSIONAL MOLDING, ENERGY RAY-CURABLE MATERIAL KIT FOR THREE-DIMENSIONAL MOLDING CONTAINING SAID SAME, THREE-DIMENSIONAL MOLDED PRODUCT OBTAINED USING SAME, AND METHOD FOR PRODUCING SAME クラレノリタケデンタル株式会社 2021-07-01 — — WO disclosed
WO-2021029039-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD 昭和電工マテリアルズ株式会社 2021-02-18 — — WO disclosed
CN-106233205-B Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package 日立化成株式会社 2020-06-23 — — CN disclosed
CN-102037406-A Photosensitive resin composition, photosensitive element, method for producing resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO LTD 2011-04-27 — — CN disclosed
US-20100290992-A1 NANOPARTICLE NUCLEIC ACID BINDING COMPOUND CONJUGATES FORMING I-MOTIFS ROCHE DIAGNOSTICS GMBH (DE) 2010-11-18 — — US disclosed
US-7485421-B2 Polyamide-oligonucleotide derivatives, their preparation and use HOECHST GMBH (DE) 2009-02-03 — — US disclosed
US-5334484-A Using an acridine compound as photoinitiator HITACHI CHEMICAL CO., LTD. (JP) 1994-08-02 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100290992-A1 NANOPARTICLE NUCLEIC ACID BINDING COMPOUND CONJUGATES FORMING I-MOTIFS POLM, IGF2BP1, POLRMT KDM4E 3791/4885ALDH1A1 1225/4885HPGD 4341/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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