SCHEMBL29639747

SCHEMBL29639747

Cc1cccc(C(=O)CO)c1

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 3/20 0.59
TDP1 Q9NUW8 1/20 0.59
PARP1 P09874 1/20 0.59
HDAC8 Q9BY41 1/20 0.55
HDAC6 Q9UBN7 1/20 0.55
CTNNB1 P35222 4/20 0.54
WNT3A P56704 4/20 0.54
SMN1; SMN2 Q16637 2/20 0.52
MEN1 O00255 2/20 0.50
KMT2A Q03164 2/20 0.50
NPC1 O15118 1/20 0.50
RAB9A P51151 1/20 0.50
KDM4E B2RXH2 1/20 0.50
LMNA P02545 1/20 0.50
MAPT P10636 1/20 0.50
HTT P42858 1/20 0.50
NPSR1 Q6W5P4 1/20 0.50
KCNK3 O14649 1/20 0.50
KCNH2 Q12809 1/20 0.50
KCNK9 Q9NPC2 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL910158 1.00 HPGD (0.59) HPGDTDP1PARP1HDAC8HDAC6
SCHEMBL9037216 0.88 HPGD (0.53) HPGDTDP1PARP1HDAC8HDAC6
SCHEMBL28728190 0.85 MEN1 (0.64) HPGDTDP1PARP1HDAC8HDAC6
SCHEMBL29062364 0.85 CTNNB1 (0.70) HPGDTDP1PARP1HDAC8HDAC6
SCHEMBL30089541 0.85 CTNNB1 (0.70) HPGDTDP1PARP1HDAC8HDAC6
SCHEMBL29456641 0.85 MEN1 (0.64) HPGDTDP1PARP1HDAC8HDAC6
SCHEMBL12235278 0.84 TDP1 (0.48) HPGDTDP1SMN1; SMN2MEN1KMT2A
SCHEMBL634002 0.83 HPGD (0.59) HPGDTDP1PARP1HDAC8HDAC6
SCHEMBL6934563 0.82 PARP1 (0.62) HPGDTDP1PARP1HDAC8HDAC6
SCHEMBL5883556 0.82 TRPA1 (0.57) HPGDTDP1PARP1HDAC8HDAC6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023164289-A2 SHAPE MORPHING HYDROGEL ACTUATORS AND CONSTRUCTS CASE WESTERN RESERVE UNIVERSITY (US) 2023-08-31 WO disclosed
CN-111793194-B Medium-low temperature latent curing epoxy resin system and preparation method thereof 北京化工大学 2022-09-20 CN disclosed
CN-114502659-A Resin composition, resin sheet, cured film, method for producing cured film, semiconductor device, organic EL display device, and display device 东丽株式会社 2022-05-13 CN disclosed