Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | RORC | P51449 | 1/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.33 |
| ▸ | ESR1 | P03372 | 2/20 | 0.32 |
| ▸ | AR | P10275 | 1/20 | 0.30 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3421381 | 1.00 | RORC (0.39) | RORCL3MBTL1ESR1ARESR2 | |
| SCHEMBL8961828 | 0.84 | RORC (0.56) | RORCL3MBTL1 | |
| SCHEMBL30003058 | 0.79 | ESR1 (0.44) | L3MBTL1ESR1ARESR2 | |
| SCHEMBL3418379 | 0.79 | ESR1 (0.44) | L3MBTL1ESR1ARESR2 | |
| SCHEMBL29664065 | 0.79 | ESR1 (0.44) | L3MBTL1ESR1ARESR2 | |
| SCHEMBL22812981 | 0.77 | ALDH1A1 (0.40) | L3MBTL1 | |
| SCHEMBL28852756 | 0.77 | LMNA (0.34) | — | |
| SCHEMBL8961762 | 0.76 | ESR1 (0.33) | ESR1ARESR2 | |
| SCHEMBL3416065 | 0.76 | ESR1 (0.33) | ESR1ESR2 | |
| SCHEMBL3421076 | 0.76 | THRB (0.40) | RORCAR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023095613-A1 | CYCLIC ORGANOSILOXANE CONTAINING IMIDE BOND AND POLYMERIZABLE UNSATURATED BOND, AND CURABLE RESIN COMPOSITION COMPRISING SAID CYCLIC ORGANOSILOXANE | 信越化学工業株式会社 | 2023-06-01 | — | — | WO | disclosed |
| WO-2022264994-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2022-12-22 | — | — | WO | disclosed |
| WO-2022264984-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2022-12-22 | — | — | WO | disclosed |
| WO-2022264987-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE | 三菱瓦斯化学株式会社 | 2022-12-22 | — | — | WO | disclosed |
| CN-115175951-A | Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | 三菱瓦斯化学株式会社 | 2022-10-11 | — | — | CN | disclosed |
| WO-2022201619-A1 | THERMALLY CURABLE RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD LAMINATE, MULTILAYERED PRINTED WIRING BOARD, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE, AND SEMICONDUCTOR DEVICE | 日本化薬株式会社 | 2022-09-29 | — | — | WO | disclosed |
| WO-2022201621-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | 日本化薬株式会社 | 2022-09-29 | — | — | WO | disclosed |
| WO-2022124129-A1 | RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAYERED BOARD, AND PRINTED WIRING BOARD | 三菱瓦斯化学株式会社 | 2022-06-16 | — | — | WO | disclosed |
| WO-2022124130-A1 | COPPER-CLAD LAMINATED BOARD AND PRINTED WIRING BOARD | 三菱瓦斯化学株式会社 | 2022-06-16 | — | — | WO | disclosed |