SCHEMBL29720375

SCHEMBL29720375

Nc1cccc(OC2(Oc3cccc(N)c3)C=CC(c3ccccc3)=CC2)c1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 3/20 0.41
MAOA P21397 2/20 0.38
CYP3A4 P08684 2/20 0.36
ALDH1A1 P00352 2/20 0.36
TP53 P04637 1/20 0.33
MAPT P10636 2/20 0.32
POLB P06746 1/20 0.32
HSP90AA1 P07900 1/20 0.32
CYP19A1 P11511 1/20 0.32
ATAD2 Q6PL18 1/20 0.31
MECP2 P51608 1/20 0.31
KDM4E B2RXH2 1/20 0.31
MEN1 O00255 1/20 0.31
LMNA P02545 1/20 0.31
HPGD P15428 1/20 0.31
KMT2A Q03164 1/20 0.31
ATM Q13315 1/20 0.31
PRMT1 Q99873 1/20 0.31
MAP4K4 O95819 2/20 0.30
ASIC3 Q9UHC3 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1270085 1.00 MAOB (0.41) MAOBMAOACYP3A4ALDH1A1TP53
SCHEMBL1119438 0.95 MAOB (0.38) MAOBMAOACYP3A4ALDH1A1TP53
SCHEMBL10382629 0.85
SCHEMBL1119476 0.85 MAOA (0.37) MAOBMAOACYP3A4ALDH1A1MAPT
SCHEMBL713923 0.81 ALOX15 (0.33) CYP3A4ALDH1A1MAPTPOLBHSP90AA1
SCHEMBL8741879 0.80
SCHEMBL8741841 0.80 SLC6A2 (0.34) TSHR
SCHEMBL28110907 0.80 PTGDR2 (0.32) MAOAALDH1A1TP53MAPTPOLB
SCHEMBL30540113 0.79 MGLL (0.49) ALDH1A1MAPTHSP90AA1HPGDKMT2A
SCHEMBL486519 0.79 MGLL (0.49) ALDH1A1MAPTHSP90AA1HPGDKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119823379-A Thermosetting polyimide resin, product, preparation method, molding method and application 中国科学院化学研究所 2025-04-15 CN disclosed
CN-118956151-A Thermosetting polyimide composite material and preparation and selective laser sintering forming method thereof 中国科学院化学研究所 2024-11-15 CN disclosed
WO-2024048740-A1 RESIN COMPOSITION 旭化成株式会社 2024-03-07 WO disclosed
CN-117510843-A Fused deposition 3D printing thermoplastic polyimide and preparation method and application thereof 中国科学院化学研究所 2024-02-06 CN disclosed
CN-110088680-B Double-layer photosensitive layer roll 旭化成株式会社 2022-12-30 CN disclosed
CN-115185157-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2022-10-14 CN disclosed
WO-2022153967-A1 METAL REMOVAL METHOD USING METAL REMOVAL FILTER FOR REMOVING METAL IMPURITY FROM PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2022-07-21 WO disclosed
WO-2022154020-A1 POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING SAME 旭化成株式会社 2022-07-21 WO disclosed