SCHEMBL297850

SCHEMBL297850

Nc1ccc(Oc2ccccc2C(F)(F)C(F)(F)C(F)F)cc1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NCOA1 Q15788 1/20 0.44
NCOA3 Q9Y6Q9 1/20 0.44
MAOA P21397 2/20 0.42
ALDH1A1 P00352 5/20 0.38
TDP1 Q9NUW8 2/20 0.38
CYP3A4 P08684 1/20 0.38
TSHR P16473 1/20 0.38
LTA4H P09960 1/20 0.36
PTGS2 P35354 1/20 0.36
MAPT P10636 4/20 0.36
MEN1 O00255 3/20 0.36
KMT2A Q03164 3/20 0.36
MITF O75030 1/20 0.36
GAA P10253 1/20 0.36
GFER P55789 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
NLRP1 Q9C000 1/20 0.36
NOD2 Q9HC29 1/20 0.36
NPC1 O15118 2/20 0.36
RAB9A P51151 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28363281 0.82 NCOA1 (0.44) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL10435288 0.81 KDM4E (0.43) ALDH1A1TDP1CYP3A4MAPTGAA
SCHEMBL10435286 0.81 ADORA2A (0.38) NCOA1NCOA3MAOAALDH1A1CYP3A4
SCHEMBL476252 0.80 NCOA1 (0.51) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL29553142 0.80 NCOA1 (0.51) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL5583604 0.80 NCOA1 (0.45) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL6244073 0.78 KDM4E (0.33) ALDH1A1TDP1MAPT
SCHEMBL721404 0.78 NCOA1 (0.49) NCOA1NCOA3MAOAALDH1A1TDP1
SCHEMBL297848 0.76 GAA (0.45) NCOA1NCOA3ALDH1A1TDP1CYP3A4
SCHEMBL3146069 0.76 ALDH1A1 (0.52) MAOAALDH1A1TDP1CYP3A4TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113637449-B High-frequency adhesive and protective film for high-frequency copper-clad plate prepared from same 余鹏飞 2023-05-26 CN claimed
CN-113637449-A High-frequency adhesive and protective film prepared from same and used for high-frequency copper-clad plate 湖北恒驰电子科技有限公司 2021-11-12 CN claimed
EP-1326138-B1 NEGATIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION AND METHOD OF FORMING IMAGE FROM THE SAME PI R & D CO LTD (JP) 2014-11-05 EP claimed
US-7648815-B2 Solvent solubility; adhesive; heat resistance; dielectric film pattern PI R&D CO., LTD. (JP) 2010-01-19 US claimed
CN-113637449-B High-frequency adhesive and protective film for high-frequency copper-clad plate prepared from same 余鹏飞 2023-05-26 CN disclosed
CN-113637449-A High-frequency adhesive and protective film prepared from same and used for high-frequency copper-clad plate 湖北恒驰电子科技有限公司 2021-11-12 CN disclosed
EP-1471103-B1 PROCESS FOR PRODUCING POROUS POLYIMIDE RESIN AND POROUS POLYIMIDE RESIN NITTO DENKO CORP (JP) 2012-03-14 EP disclosed
US-7022377-B2 Method for producing porous polyimide resin and porous polymide resin NITTO DENKO CORPORATION (JP) 2006-04-04 US disclosed
EP-1471103-A1 PROCESS FOR PRODUCING POROUS POLYIMIDE RESIN AND POROUS POLYIMIDE RESIN NITTO DENKO CORPORATION (JP) 2004-10-27 EP disclosed
US-20040101626-A1 Process for producing porous polyimide resin and porous polymide resin NITTO DENKO CORPORATION (JP) 2004-05-27 US disclosed
US-5342895-A Polyamide-polybutadiene-acrylonitrile TOMOEGAWA PAPER CO., LTD. (JP) 1994-08-30 US disclosed