SCHEMBL297848

SCHEMBL297848

Nc1ccccc1Oc1ccc(C(F)(F)C(F)(F)C(F)F)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 2/20 0.45
RCE1 Q9Y256 1/20 0.45
IKBKB O14920 3/20 0.43
BRAF P15056 1/20 0.43
L3MBTL1 Q9Y468 4/20 0.42
RAB9A P51151 1/20 0.42
MAPT P10636 3/20 0.41
KDM4E B2RXH2 1/20 0.41
CRHBP P24387 1/20 0.41
CRHR2 Q13324 1/20 0.41
LMNA P02545 1/20 0.40
ATM Q13315 1/20 0.40
ALDH1A1 P00352 3/20 0.40
LTA4H P09960 1/20 0.39
CYP1A2 P05177 3/20 0.38
CYP2C19 P33261 3/20 0.38
CYP3A4 P08684 2/20 0.38
TLR4 O00206 1/20 0.38
NPSR1 Q6W5P4 1/20 0.37
ADRA2B P18089 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8402938 0.82 GAA (0.45) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL641043 0.80 L3MBTL1 (0.57) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL3146069 0.79 ALDH1A1 (0.52) GAARAB9AMAPTALDH1A1CYP3A4
SCHEMBL19056222 0.79 GAA (0.45) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL10435288 0.78 KDM4E (0.43) GAARCE1IKBKBBRAFMAPT
SCHEMBL653256 0.78 GAA (0.50) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL8541418 0.77 NR4A1 (0.53) GAAL3MBTL1RAB9AMAPTLMNA
SCHEMBL2285909 0.76 GAA (0.69) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL4858880 0.76 GAA (0.45) GAARCE1IKBKBBRAFL3MBTL1
SCHEMBL297850 0.76 NCOA1 (0.44) GAAL3MBTL1RAB9AMAPTALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116891570-A Polyamic acid, polyimide, metal-clad laminate, and circuit board 日铁化学材料株式会社 2023-10-17 CN disclosed
CN-113874420-B Resin film and metal-clad laminate 日铁化学材料株式会社 2023-09-26 CN disclosed
CN-116353168-A Resin laminate, circuit board, electronic component, and electronic device 日铁化学材料株式会社 2023-06-30 CN disclosed
CN-116367413-A Metal-clad laminate and circuit board 日铁化学材料株式会社 2023-06-30 CN disclosed
CN-113874420-A Resin film, metal-clad laminate, and method for producing same 日铁化学材料株式会社 2021-12-31 CN disclosed
EP-1471103-B1 PROCESS FOR PRODUCING POROUS POLYIMIDE RESIN AND POROUS POLYIMIDE RESIN NITTO DENKO CORP (JP) 2012-03-14 EP disclosed
US-7450803-B2 Optical waveguide HITACHI CHEMICAL COMPANY, LTD. (JP) 2008-11-11 US disclosed
US-20070086705-A1 Optical waveguide HITACHI CHEMICAL COMPANY, LTD. (JP) 2007-04-19 US disclosed
US-7022377-B2 Method for producing porous polyimide resin and porous polymide resin NITTO DENKO CORPORATION (JP) 2006-04-04 US disclosed
EP-1471103-A1 PROCESS FOR PRODUCING POROUS POLYIMIDE RESIN AND POROUS POLYIMIDE RESIN NITTO DENKO CORPORATION (JP) 2004-10-27 EP disclosed
US-20040101626-A1 Process for producing porous polyimide resin and porous polymide resin NITTO DENKO CORPORATION (JP) 2004-05-27 US disclosed
US-5342895-A Polyamide-polybutadiene-acrylonitrile TOMOEGAWA PAPER CO., LTD. (JP) 1994-08-30 US disclosed