Dichlorphenamide

Dichlorphenamide

SCHEMBL298941

NCc1ccc(S(N)(=O)=O)cc1.NS(=O)(=O)c1cc(Cl)c(Cl)c(S(N)(=O)=O)c1

nearest known ligand 0.70

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

CA1CA12CA2CA4

The experimentally established mechanism targets of Dichlorphenamide. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA2 known ✓ P00918 15/20 0.70
CA1 known ✓ P00915 14/20 0.70
CA12 known ✓ O43570 9/20 0.70
CA4 known ✓ P22748 7/20 0.70
CA9 Q16790 11/20 0.70
CA7 P43166 7/20 0.70
CA14 Q9ULX7 7/20 0.70
CA6 P23280 6/20 0.70
CA5A P35218 6/20 0.70
CA5B Q9Y2D0 6/20 0.70
CA13 Q8N1Q1 2/20 0.70
LMNA P02545 1/20 0.70
CYP2C9 P11712 1/20 0.70
MAPT P10636 1/20 0.59
POLB P06746 1/20 0.51
APEX1 P27695 1/20 0.51
TDP1 Q9NUW8 1/20 0.51
L3MBTL1 Q9Y468 1/20 0.51
KDM4E B2RXH2 1/20 0.51
SMN1; SMN2 Q16637 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Dichlorphenamide SCHEMBL112376 0.83 CA1 (1.00) CA2CA1CA9CA12CA7
Dichlorphenamide SCHEMBL29355725 0.83 CA1 (1.00) CA2CA1CA9CA12CA7
Dichlorphenamide SCHEMBL7040074 0.82 CA1 (0.96) CA2CA1CA9CA12CA7
Dichlorphenamide SCHEMBL7034594 0.82 CA1 (0.96) CA2CA1CA9CA12CA7
Dichlorphenamide SCHEMBL4312398 0.82 CA1 (0.96) CA2CA1CA9CA12CA7
Mafenide SCHEMBL41628 0.78 CA2 (1.00) CA2CA1CA9CA12CA7
Mafenide SCHEMBL9295695 0.78 CA2 (1.00) CA2CA1CA9CA12CA7
Mafenide SCHEMBL425524 0.76 CA2 (1.00) CA2CA1CA9CA12CA7
Mafenide SCHEMBL1203324 0.76 CA2 (1.00) CA2CA1CA9CA12CA7
Mafenide SCHEMBL686407 0.74 CA2 (0.95) CA2CA1CA9CA12CA7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103080256-B Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films BASF SE 2015-06-24 CN disclosed
US-20130200039-A1 AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N'-HYDROXY-DIAZENIUM OXIDE SALTS BASF SE (DE) 2013-08-08 US disclosed
EP-2613910-A1 PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC FILMS AND POLYSILICON AND/OR SILICON NITRIDE FILMS BASF SE (DE) 2013-07-17 EP disclosed
EP-2614122-A1 AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N'-HYDROXY-DIAZENIUM OXIDE SALTS BASF SE (DE) 2013-07-17 EP disclosed
US-20130168348-A1 AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS BASF SE (DE) 2013-07-04 US disclosed
US-20130171824-A1 PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC FILMS AND POLYSILICON AND/OR SILICON NITRIDE FILMS BASF SE (DE) 2013-07-04 US disclosed
CN-103080256-A Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films BASF SE 2013-05-01 CN disclosed
WO-2012032466-A1 AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N'-HYDROXY-DIAZENIUM OXIDE SALTS BASF SE (DE) 2012-03-15 WO disclosed
WO-2012032451-A1 AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS BASF SE (DE) 2012-03-15 WO disclosed
WO-2012032467-A1 PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC FILMS AND POLYSILICON AND/OR SILICON NITRIDE FILMS BASF SE (DE) 2012-03-15 WO disclosed
EP-2428541-A1 Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films BASF SE (DE) 2012-03-14 EP disclosed