Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
| ▸ | GLA | P06280 | 1/20 | 0.30 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3021068 | 0.77 | MEN1 (0.34) | — | |
| SCHEMBL4790338 | 0.71 | TSHR (0.31) | ALDH1A1GLATSHR | |
| SCHEMBL753557 | 0.71 | — | — | |
| SCHEMBL16448086 | 0.68 | TAAR1 (0.35) | ALDH1A1GLATSHR | |
| SCHEMBL28573909 | 0.67 | — | — | |
| SCHEMBL3861670 | 0.66 | — | — | |
| Urea SCHEMBL28179593 | 0.66 | HTT (0.36) | — | |
| SCHEMBL15059410 | 0.64 | POLB (0.50) | ALDH1A1GLATSHR | |
| SCHEMBL30528370 | 0.64 | POLB (0.50) | ALDH1A1GLATSHR | |
| SCHEMBL14743144 | 0.64 | LMNA (0.56) | ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 186 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108410134-B | Epoxy resin composition for fiber composite material and application thereof | 苏州银禧新能源复合材料有限公司 | 2021-04-20 | — | — | CN | claimed |
| EP-0942028-B1 | Epoxy resin composition | AJINOMOTO KK (JP) | 2004-11-24 | — | — | EP | claimed |
| US-6232426-B1 | BLEND CONTAINING A THIOL, COMPOUND, LATENT CURING AGENT AND BORATE EATER | AJINOMOTO CO., INC. (JP) | 2001-05-15 | — | — | US | claimed |
| EP-0421389-A2 | Imidazole compound-containing hardening agent composition, method of preparing the same and thermosetting epoxy resin composition | SOMAR CORPORATION (JP) | 1991-04-10 | — | — | EP | claimed |
| JP-2075676-A | — | — | None | — | — | JP | disclosed |
| JP-2034626-A | — | — | None | — | — | JP | disclosed |
| JP-63030471-A | — | — | None | — | — | JP | disclosed |
| EP-4748869-A1 | EPOXY RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED ARTICLE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| EP-4748870-A1 | EPOXY RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | Namics Corporation (JP) | 2026-05-27 | — | — | EP | disclosed |
| WO-2026100231-A1 | CURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT | ナミックス株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12577331-B2 | Resin composition | NAMICS CORPORATION (JP) | 2026-03-17 | — | — | US | disclosed |
| EP-4692055-A1 | THIOL COMPOUND | AJINOMOTO CO., INC. (JP) | 2026-02-11 | — | — | EP | disclosed |
| EP-0651040-A1 | Liquid adhesive for electronic parts and process for forming insulating adhesive layer using the same | TOMOEGAWA PAPER CO. LTD. (JP) | 1995-05-03 | — | — | EP | disclosed |
| EP-0649892-A1 | Adhesive tape for electronic parts and liquid adhesive | TOMOEGAWA PAPER CO. LTD. (JP) | 1995-04-26 | — | — | EP | disclosed |
| EP-0649893-A1 | Adhesive tape for electronic parts and liquid adhesive | TOMOEGAWA PAPER CO. LTD. (JP) | 1995-04-26 | — | — | EP | disclosed |
| US-5244939-A | Improved adhesion | SOMAR CORPORATION (JP) | 1993-09-14 | — | — | US | disclosed |
| EP-0421389-A2 | Imidazole compound-containing hardening agent composition, method of preparing the same and thermosetting epoxy resin composition | SOMAR CORPORATION (JP) | 1991-04-10 | — | — | EP | disclosed |
| JP-H0275676-A | THERMOSETTING EPOXY RESIN VARNISH | MITSUBISHI PETROCHEM CO LTD | 1990-03-15 | — | — | JP | disclosed |
| JP-H0234626-A | INJECTION MOLDING MATERIAL | MITSUBISHI PETROCHEM CO LTD | 1990-02-05 | — | — | JP | disclosed |
| JP-S6330471-A | NOVEL IMIDAZOLEUREA COMPOUND, SYNTHESIS THEREOF AND CURING METHOD FOR POLYEPOXY RESIN USING SAID COMPOUND | SHIKOKU CHEM CORP | 1988-02-09 | — | — | JP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12577331-B2 | Resin composition | SEM1, MCCC2, GRIN1 | ALDH1A1 84/4885GLA 4062/4885TSHR 4821/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.