SCHEMBL3021068

SCHEMBL3021068

CCN(C(=O)Nc1c[nH]c(C)n1)c1c[nH]c(C)n1

nearest known ligand 0.34

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.34
KMT2A Q03164 1/20 0.34
KDM4E B2RXH2 1/20 0.33
HPGD P15428 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3036337 0.77 ALDH1A1 (0.30)
SCHEMBL19720097 0.71 L3MBTL1 (0.44) KDM4E
SCHEMBL27425089 0.64 TAS2R38 (0.33) MEN1KMT2A
SCHEMBL30281178 0.62 SMN1; SMN2 (0.40) HPGD
SCHEMBL7812188 0.60
SCHEMBL28261844 0.60 GAA (0.43) MEN1KMT2AKDM4E
SCHEMBL28287069 0.56 P2RX7 (0.49) MEN1KMT2AKDM4E
SCHEMBL1040746 0.55 NOTUM (0.32)
Alcohol SCHEMBL28482767 0.55 KDM4E (0.30) KDM4E
SCHEMBL682587 0.55 USP2 (0.49) MEN1KMT2AKDM4EHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023286767-A1 THERMOCONDUCTIVE MATERIAL COMPOSITION 株式会社大阪ソーダ 2023-01-19 WO disclosed
US-10982029-B2 Acrylic rubber composition DENKA COMPANY LIMITED (JP) 2021-04-20 US disclosed
EP-3483213-B1 ACRYLIC RUBBER COMPOSITION DENKA COMPANY LTD (JP) 2021-04-07 EP disclosed
EP-3483212-B1 ACRYLIC RUBBER COMPOSITION DENKA COMPANY LTD (JP) 2021-03-10 EP disclosed
US-20190300633-A1 ACRYLIC RUBBER COMPOSITION DENKA COMPANY LIMITED (JP) 2019-10-03 US disclosed
EP-3483213-A1 ACRYLIC RUBBER COMPOSITION Denka Company Limited (JP) 2019-05-15 EP disclosed
EP-3483212-A1 ACRYLIC RUBBER COMPOSITION Denka Company Limited (JP) 2019-05-15 EP disclosed
US-10086593-B2 Laminate body, cross-linked product, and molded member DENKA COMPANY LIMITED (JP) 2018-10-02 US disclosed
US-9873781-B2 Acrylic rubber composition, acrylic rubber molded product, and method for producing same DAIKIN INDUSTRIES, LTD. (JP) 2018-01-23 US disclosed
EP-2762306-B1 LAMINATE BODY, CROSS-LINKED PRODUCT, AND MOLDED MEMBER DENKA COMPANY LTD (JP) 2017-12-27 EP disclosed
US-5609956-A (PIPERAZINYLETHYLAMINO)CARBONYL-CONTAINING ACRYLONITRILE-BUTADIENE COPOLYMER, MALEIMIDE COMPOUND TOMOEGAWA PAPER CO., LTD. (JP) 1997-03-11 US disclosed
EP-0747399-A2 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO. LTD. (JP) 1996-12-11 EP disclosed
US-5512628-A COMBINING A PIPERAZINYLETHYLAMINOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE COPOLYMER WITH A MALEIMIDE CONTAINING COMPOUND IN AN ORGANIC SOLVENT; CURABLE TOMOEGAWA PAPER CO., LTD. (JP) 1996-04-30 US disclosed
US-5510189-A COMPRISING A PIPERAZINYLETHYLAMINOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE COPOLYMER AND A MALEIMIDE COMPOUND; ADHERED AND CURED AT LOW TEMPERATURE; HEAT RESISTANCE TOMOEGAWA PAPER CO., LTD. (JP) 1996-04-23 US disclosed
US-5500294-A MODIFIED ACRYLONITRILE-BUTADIENE COPOLYMER TOMOEGAWA PAPER CO., LTD. (JP) 1996-03-19 US disclosed
US-5494757-A BLEND OF A PIPERAZINYLETHYLAMIDOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE TERPOLYMER AND A MALEIMIDE RESIN TOMOEGAWA PAPER CO., LTD. (JP) 1996-02-27 US disclosed
US-5446080-A Piperazinylethylaminocarbonyl containing acrylonitrile-butadiene copolymer and bismaleimide compound TOMOEGAWA PAPER CO., LTD. (JP) 1995-08-29 US disclosed
EP-0651040-A1 Liquid adhesive for electronic parts and process for forming insulating adhesive layer using the same TOMOEGAWA PAPER CO. LTD. (JP) 1995-05-03 EP disclosed
EP-0649892-A1 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO. LTD. (JP) 1995-04-26 EP disclosed
EP-0649893-A1 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO. LTD. (JP) 1995-04-26 EP disclosed