SCHEMBL30435995

SCHEMBL30435995

CCn1c(=O)[nH]c(=O)n(-c2ncncn2)c1=O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ADORA2A P29274 10/20 0.39
PDE4A P27815 9/20 0.39
PDE4B Q07343 9/20 0.39
PDE4C Q08493 9/20 0.39
PDE4D Q08499 9/20 0.39
CYP1A2 P05177 3/20 0.36
MEN1 O00255 3/20 0.36
KMT2A Q03164 3/20 0.36
BLM P54132 2/20 0.34
LMNA P02545 1/20 0.34
CYP3A4 P08684 1/20 0.34
CYP2D6 P10635 1/20 0.34
TSHR P16473 1/20 0.34
NFKB1 P19838 1/20 0.34
PMP22 Q01453 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
ADORA2B P29275 6/20 0.33
POLB P06746 1/20 0.33
MAPT P10636 1/20 0.33
ALDH1A1 P00352 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL633733 0.72 CYP1A2 (0.47) ADORA2APDE4APDE4BPDE4CPDE4D
SCHEMBL1821188 0.71
SCHEMBL11684045 0.70 PGR (0.54) CYP1A2MEN1KMT2APOLBMAPT
SCHEMBL11680403 0.68 SMN1; SMN2 (0.50) CYP1A2MEN1KMT2ABLMLMNA
SCHEMBL28671352 0.66 PDE4A (0.46) ADORA2APDE4APDE4BPDE4CPDE4D
SCHEMBL14085060 0.65 LGMN (0.44) ADORA2APDE4APDE4BPDE4CPDE4D
SCHEMBL11767854 0.64 PKM (0.44) MEN1KMT2ALMNASMN1; SMN2POLB
SCHEMBL872621 0.64 CYP1A2 (0.40) ADORA2APDE4APDE4BPDE4CPDE4D
SCHEMBL11772410 0.63 PKM (0.45) CYP1A2MEN1KMT2ABLMLMNA
SCHEMBL11771017 0.62 KMT2A (0.42) ADORA2ACYP1A2MEN1KMT2ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117813360-A Adhesive composition and method for producing adhesive composition 东洋纺株式会社 2024-04-02 CN disclosed
CN-117178021-A Epoxy resin composition 株式会社KCC 2023-12-05 CN disclosed
CN-116195040-A Method for manufacturing semiconductor device and film-like adhesive 株式会社力森诺科 2023-05-30 CN disclosed