⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30435995 | 0.71 | ADORA2A (0.39) | — | |
| SCHEMBL12661014 | 0.70 | HSP90AA1 (0.32) | — | |
| SCHEMBL3798661 | 0.67 | PDE3B (0.33) | — | |
| SCHEMBL1821183 | 0.67 | PDE3B (0.33) | — | |
| SCHEMBL30218779 | 0.61 | SMN1; SMN2 (0.47) | — | |
| SCHEMBL16990219 | 0.61 | KDM4E (0.46) | — | |
| SCHEMBL3479871 | 0.61 | PDE3B (0.34) | — | |
| SCHEMBL580727 | 0.61 | — | — | |
| SCHEMBL1706734 | 0.61 | BCHE (0.43) | — | |
| SCHEMBL13760597 | 0.60 | XDH (0.41) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 94 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110753881-B | Alkali-developable photosensitive resin composition, dry film, cured product, and printed wiring board | 太阳控股株式会社 | 2024-06-21 | — | — | CN | disclosed |
| CN-117999516-A | Photosensitive resin composition, dry film, cured product, and printed wiring board | 太阳控股株式会社 | 2024-05-07 | — | — | CN | disclosed |
| CN-117908328-A | Photosensitive resin composition, dry film, cured product, and printed wiring board | 太阳控股株式会社 | 2024-04-19 | — | — | CN | disclosed |
| CN-117850164-A | Curable resin composition, dry film, cured product, and printed wiring board | 太阳控股株式会社 | 2024-04-09 | — | — | CN | disclosed |
| CN-117413372-A | LED mounting substrate and LED mounting substrate | 太阳控股株式会社 | 2024-01-16 | — | — | CN | disclosed |
| CN-109143779-B | Photosensitive film laminate and cured product thereof | 太阳控股株式会社 | 2024-01-05 | — | — | CN | disclosed |
| CN-108227378-B | Heat-curable solder resist composition, dry film thereof, cured product thereof, and printed wiring board | 太阳油墨（苏州）有限公司 | 2023-12-15 | — | — | CN | disclosed |
| CN-117099486-A | Laminated curable resin structure, dry film, cured product, and electronic component | 太阳油墨制造株式会社 | 2023-11-21 | — | — | CN | disclosed |
| CN-115403609-B | Preparation method of tris [3- (trimethoxysilyl) propyl ] isocyanurate | 江苏瑞洋安泰新材料科技有限公司 | 2023-11-03 | — | — | CN | disclosed |
| WO-2023190475-A1 | MOUNTING SUBSTRATE, CONNECTION STRUCTURE, AND ELECTRONIC COMPONENT | 太陽ホールディングス株式会社 | 2023-10-05 | — | — | WO | disclosed |
| CN-1926174-A | Active energy ray-curable resin, photocurable and thermosetting resin composition containing the same, and cured product thereof | TAIYO INK MFG CO (JP) | 2007-03-07 | — | — | CN | disclosed |
| WO-2006071640-A2 | PHOTOLYTIC POLYMER SURFACE MODIFICATION | THE REGENTS OF THE UNIVERSITY OF COLORADO (US) | 2006-07-06 | — | — | WO | disclosed |
| CN-1779568-A | Hardenable resin composition, hardened body thereof, and printed wiring board | TAIYO INK MFG CO LTD (JP) | 2006-05-31 | — | — | CN | disclosed |
| CN-1697858-A | Photo-curable and thermosetting resin composition | TAIYO INK MFG CO LTD (JP) | 2005-11-16 | — | — | CN | disclosed |
| CN-1225504-C | Flame retardant resin composition | TORAY INDUSTRIES (JP) | 2005-11-02 | — | — | CN | disclosed |
| US-20050116387-A1 | Component packaging apparatus, systems, and methods | DAVISON PETER A (US) | 2005-06-02 | — | — | US | disclosed |
| US-20050116299-A1 | Component packaging apparatus, systems, and methods | INTEL CORPORATION | 2005-06-02 | — | — | US | disclosed |
| CN-1472253-A | Optical solidifying-thermo solidifying resin composition and its solidified products | 太阳油墨制造株式会社 | 2004-02-04 | — | — | CN | disclosed |
| CN-1302179-A | Method for manufacturing multilayer printed circuit board using adhesive film | AJINOMOTO KK (JP) | 2001-07-04 | — | — | CN | disclosed |
| EP-0279407-A2 | Electroconductive polymer film and method for producing the same | MITSUI MINING COMPANY, LIMITED (JP) | 1988-08-24 | — | — | EP | disclosed |