SCHEMBL306063

SCHEMBL306063

Clc1ccccc1-c1nc(-c2ccccc2)c(-c2ccccc2)[nH]1

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPK13 O15264 8/20 0.67
MAPK12 P53778 8/20 0.67
MAPK11 Q15759 8/20 0.67
MAPK14 Q16539 8/20 0.67
RAF1 P04049 6/20 0.67
MGAM O43451 1/20 0.67
KDM4E B2RXH2 3/20 0.61
POLB P06746 2/20 0.61
MAPK9 P45984 1/20 0.57
GCGR P47871 2/20 0.55
TEK Q02763 1/20 0.55
NT5E P21589 1/20 0.55
ALDH1A1 P00352 2/20 0.54
NPC1 O15118 2/20 0.54
RAB9A P51151 2/20 0.54
GPR55 Q9Y2T6 1/20 0.54
MEN1 O00255 2/20 0.53
KMT2A Q03164 2/20 0.53
CYP1A2 P05177 2/20 0.53
CYP3A4 P08684 2/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1040038 1.00 MAPK13 (0.67) MAPK13MAPK12MAPK11MAPK14RAF1
SCHEMBL29360656 1.00 MAPK13 (0.67) MAPK13MAPK12MAPK11MAPK14RAF1
SCHEMBL22507473 0.93 MAPK14 (0.76) MAPK13MAPK12MAPK11MAPK14RAF1
SCHEMBL6468974 0.93 MAPK14 (0.80) MAPK13MAPK12MAPK11MAPK14RAF1
SCHEMBL10719284 0.89 MGAM (0.61) MAPK13MAPK12MAPK11MAPK14RAF1
SCHEMBL3284066 0.88 TEK (0.57) MAPK13MAPK12MAPK11MAPK14RAF1
SCHEMBL20536998 0.88 MGAM (0.60) MAPK13MAPK12MAPK11MAPK14RAF1
SCHEMBL17133348 0.88 MGAM (0.77) MAPK13MAPK12MAPK11MAPK14RAF1
SCHEMBL30514842 0.87 MAPK13 (0.67) MAPK13MAPK12MAPK11MAPK14RAF1
SCHEMBL10078946 0.87 MAPK13 (0.86) MAPK13MAPK12MAPK11MAPK14RAF1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 825 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4321541-B1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2025-08-06 EP claimed
US-20250237947-A1 Dry Film Resist, Photosensitive Dry Film, and Copper Clad Laminate HANGZHOU FIRST ELECTRONIC MATERIAL CO., LTD (CN) 2025-07-24 US claimed
EP-4321541-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-02-14 EP claimed
CN-117529509-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-02-06 CN claimed
WO-2023185530-A1 DRY FILM RESIST, PHOTOSENSITIVE DRY FILM, AND COPPER CLAD LAMINATE 杭州福斯特电子材料有限公司 2023-10-05 WO claimed
WO-2022264985-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2022-12-22 WO claimed
CN-111922553-A Copper surface protective agent for advanced wafer packaging field and preparation method thereof 深圳市创智成功科技有限公司 2020-11-13 CN claimed
CN-107971655-B High-heat-resistance organic solder flux and application thereof 永星化工(上海)有限公司 2019-12-27 CN claimed
CN-109426072-A Barrier resin composition, the manufacturing method of photocuring isolation film and electronic component 胡网加成股份有限公司 2019-03-05 CN claimed
US-6251571-B1 MIXTURE OF OXIDIZER, DYE AND HYDROXYLAMINE E. I. DU PONT DE NEMOURS AND COMPANY 2001-06-26 US claimed
US-6180319-B1 APPLYING AQUEOUS-DEVELOPABLE PHOTORESIST COMPRISING PHOTOINITIATOR TO SURFACE OF SUBSTRATE; IMAGEWISE EXPOSING TO ACTINIC RADIATION TO PRODUCE EXPOSED AND NON-EXPOSED AREAS IN PHOTORESIST; TREATING WITH SAMPLE OF ALKALINE SOLUTION E. I. DU PONT DE NEMOURS AND COMPANY 2001-01-30 US claimed
EP-1062546-A1 PROCESS FOR THE CONTINUOUS LIQUID PROCESSING OF PHOTOSENSITIVE COMPOSITIONS HAVING REDUCED LEVELS OF RESIDUES E.I. DUPONT DE NEMOURS AND COMPANY (US) 2000-12-27 EP claimed
WO-1999046644-A1 PROCESS FOR THE CONTINUOUS LIQUID PROCESSING OF PHOTOSENSITIVE COMPOSITIONS HAVING REDUCED LEVELS OF RESIDUES E.I. DU PONT DE NEMOURS AND COMPANY (US) 1999-09-16 WO claimed
US-5153100-A Hexaarylbisimidazole and-or p-dialkylaminophenyl carbonyl compound E. I. DU PONT DE NEMOURS AND COMPANY (US) 1992-10-06 US claimed
EP-0475153-A1 Borate coinitiators for photopolymerizable compositions E.I. DU PONT DE NEMOURS AND COMPANY (US) 1992-03-18 EP claimed
EP-0215453-B1 PHOTOIMAGING COMPOSITION CONTAINING ADMIXTURE OF LEUCO DYE AND 2,4,5-TRIPHENYLIMIDAZOLYL DIMER E.I. DU PONT DE NEMOURS AND COMPANY (US) 1989-09-13 EP claimed
US-4622286-A Photoimaging composition containing admixture of leuco dye and 2,4,5-triphenylimidazolyl dimer E. I. DU PONT DE NEMOURS AND COMPANY (US) 1986-11-11 US claimed
EP-4749682-A1 CURABLE COMPOSITION, FILM FORMING METHOD, AND METHOD FOR PRODUCING ARTICLE Canon Kabushiki Kaisha (JP) 2026-05-27 EP disclosed
US-4078934-A Photosensitive, image-forming composition containing a leuco 2,3-disubstituted-1-indanone and a photooxidant E. I. DU PONT DE NEMOURS AND COMPANY (US) 1978-03-14 US disclosed
US-3992450-A PHOTOSENSITIVE COMPOSITIONS E. I. DU PONT DE NEMOURS AND COMPANY (US) 1976-11-16 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20250237947-A1 Dry Film Resist, Photosensitive Dry Film, and Copper Clad Laminate PADI2, PADI4, PADI1 MAPK13 2751/4885MAPK12 2296/4885MAPK11 3018/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.