SCHEMBL307038

SCHEMBL307038

Clc1ccccc1-c1nc(-c2ccccc2)c(-c2ccccc2)n1C1(c2ccccc2Cl)N=C(c2ccccc2)C(c2ccccc2)=N1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 2/20 0.37
CYP2A6 P11509 1/20 0.34
LMNA P02545 3/20 0.34
KDM4E B2RXH2 2/20 0.33
AKT1 P31749 2/20 0.33
AKT2 P31751 2/20 0.33
KMT2A Q03164 1/20 0.33
HPGD P15428 1/20 0.33
PKM P14618 1/20 0.33
ALDH1A1 P00352 2/20 0.33
BCHE P06276 1/20 0.33
ACHE P22303 1/20 0.33
DPP4 P27487 1/20 0.33
MAPK13 O15264 1/20 0.33
RAF1 P04049 1/20 0.33
MAPK12 P53778 1/20 0.33
MAPK11 Q15759 1/20 0.33
MAPK14 Q16539 1/20 0.33
PTGS1 P23219 1/20 0.33
PTGS2 P35354 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29359500 1.00 HSD11B1 (0.37) HSD11B1CYP2A6LMNAKDM4EAKT1
SCHEMBL29749791 1.00 HSD11B1 (0.37) HSD11B1CYP2A6LMNAKDM4EAKT1
SCHEMBL13645037 0.93 HSD11B1 (0.37) HSD11B1CYP2A6LMNAKDM4EAKT1
SCHEMBL3094986 0.92 L3MBTL1 (0.39) HSD11B1LMNAKDM4EKMT2AHPGD
SCHEMBL15926080 0.92 AKT1 (0.34) HSD11B1KDM4EAKT1AKT2KMT2A
SCHEMBL13707049 0.92 HSD11B1 (0.38) HSD11B1CYP2A6LMNAAKT1AKT2
SCHEMBL30358509 0.92 L3MBTL1 (0.39) HSD11B1LMNAKDM4EKMT2AHPGD
SCHEMBL3094974 0.91 GAA (0.33) HSD11B1LMNAKDM4EKMT2AALDH1A1
SCHEMBL30358506 0.91 GAA (0.33) HSD11B1LMNAKDM4EKMT2AALDH1A1
SCHEMBL16355186 0.91 KDM4E (0.43) LMNAKDM4EHPGDALDH1A1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1866 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250167153-A1 METHOD OF FORMING REDISTRIBUTION PAD AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SAMSUNG ELECTRONICS CO., LTD. (KR) 2025-05-22 US claimed
CN-119987134-A Acrylic acid negative photoresist and preparation method and application thereof 江苏艾森半导体材料股份有限公司 2025-05-13 CN claimed
CN-115576171-B Negative photosensitive resin composition and method for preparing cured pattern 徐州博康信息化学品有限公司 2025-04-11 CN claimed
CN-119752458-A Liquid crystal layer material, grating device, preparation method and display device 广东粤港澳大湾区国家纳米科技创新研究院 2025-04-04 CN claimed
CN-119684517-A Photo-cured volume holographic polymer material, grating and preparation method thereof 广纳四维(广东)光电科技有限公司 2025-03-25 CN claimed
CN-119684516-A Photo-cured volume holographic polymer material, grating and preparation method thereof 广纳四维(广东)光电科技有限公司 2025-03-25 CN claimed
US-20240377736-A1 PHOTOSENSITIVE COMPOSITION ARKEMA FRANCE (FR) 2024-11-14 US claimed
US-20240374769-A1 LIGHT ACTIVATED CLEANING COMPOSITION THE PROCTER & GAMBLE COMPANY 2024-11-14 US claimed
CN-118011730-B Photosensitive dry film coating and preparation method thereof 珠海市容大感光科技有限公司 2024-10-22 CN claimed
CN-118798746-A Financial data analysis management system based on big data 北京朗杰科技有限公司 2024-10-18 CN claimed
EP-2852374-A1 PROCESS FOR DYEING KERATIN FIBRES COMPRISING A DYE/PIGMENT, A PHOTOACTIVE COMPOUND AND A LIGHT SOURCE L'Oréal (FR) 2015-04-01 EP claimed
US-8945815-B2 Alkaline soluble resin and light sensible resin composition comprising same and use thereof BOE TECHNOLOGY GROUP CO., LTD. (CN) 2015-02-03 US claimed
US-8828918-B2 Semiconductor surface treating agent composition and method for treating semiconductor surface using the semiconductor surface treating agent composition WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2014-09-09 US claimed
WO-2013174871-A1 PROCESS FOR DYEING KERATIN FIBRES COMPRISING A DYE/PIGMENT, A PHOTOACTIVE COMPOUND AND A LIGHT SOURCE L'OREAL (FR) 2013-11-28 WO claimed
US-20130171566-A1 ALKALINE SOLUBIE RESIN AND LIGHT SENSIBLE RESIN COMPOSITION COMPRISING SAME AND USE THEREOF BOE TECHNOLOGY GROUP CO., LTD. (CN) 2013-07-04 US claimed
US-7932300-B2 Energy beam curable type ink jet printing ink JSR CORPORATION (JP) 2011-04-26 US claimed
US-20110021655-A1 THERMALLY AND ACTINICALLY CURABLE ADHESIVE COMPOSITION E.I. DU PONT DE NEMOURS AND COMPANY (US) 2011-01-27 US claimed
EP-0706091-B2 Liquid photoimageable resist MACDERMID IMAGING TECHNOLOGY (US) 2002-03-20 EP claimed
US-6045975-A A CURABLE VARNISH BLENDS COMPRISING A NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR, A (METH)ACRYLATE ESTER POLYMERIZABLE MONOMER OR OLIGOMER, A PHOTOINITIATOR; USE IN THE PRODUCTION OF CIRCUIT BOARDS AND SEMICONDUCTOR DEVICES FUJITSU LIMITED (JP) 2000-04-04 US claimed
US-6013419-A POLYIMIDE RESIN FILMS, COATING ON THE SURFACE WITH CYCLODEHYDRATION AND PHOTOPOLYMERIZATION FUJITSU LIMITED (JP) 2000-01-11 US claimed