Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 2/20 | 0.44 |
| ▸ | CASP1 | P29466 | 1/20 | 0.44 |
| ▸ | RECQL | P46063 | 1/20 | 0.44 |
| ▸ | CYP19A1 | P11511 | 2/20 | 0.39 |
| ▸ | HTR6 | P50406 | 1/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 7/20 | 0.37 |
| ▸ | CA12 | O43570 | 1/20 | 0.37 |
| ▸ | CA1 | P00915 | 1/20 | 0.37 |
| ▸ | CA2 | P00918 | 1/20 | 0.37 |
| ▸ | CA7 | P43166 | 1/20 | 0.37 |
| ▸ | CA9 | Q16790 | 1/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.37 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.37 |
| ▸ | MEN1 | O00255 | 4/20 | 0.36 |
| ▸ | MAPT | P10636 | 3/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.36 |
| ▸ | LMNA | P02545 | 2/20 | 0.36 |
| ▸ | GLA | P06280 | 1/20 | 0.36 |
| ▸ | HPGD | P15428 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL143288 | 0.91 | CYP3A4 (0.52) | CYP3A4CASP1RECQLCYP19A1ALDH1A1 | |
| SCHEMBL22164561 | 0.84 | MAOA (0.52) | CYP3A4CASP1RECQLCYP19A1ALDH1A1 | |
| SCHEMBL25128812 | 0.82 | ALDH1A1 (0.44) | ALDH1A1MEN1MAPTKMT2AHPGD | |
| SCHEMBL5549480 | 0.82 | TSHR (0.48) | CYP3A4CYP19A1ALDH1A1TDP1MEN1 | |
| SCHEMBL310582 | 0.82 | MEN1 (0.50) | CYP3A4CASP1HTR6ALDH1A1CA12 | |
| Hydrochloric Acid SCHEMBL5187735 | 0.77 | NFE2L2 (0.44) | CYP19A1MAPTMAOAGFER | |
| SCHEMBL13591681 | 0.76 | CYP3A4 (0.50) | CYP3A4CASP1RECQLCYP19A1ALDH1A1 | |
| SCHEMBL9246793 | 0.75 | MAOB (0.60) | CYP3A4CASP1RECQLALDH1A1MEN1 | |
| SCHEMBL487319 | 0.74 | CYP3A4 (0.48) | CYP3A4CASP1RECQLCYP19A1ALDH1A1 | |
| SCHEMBL13513756 | 0.74 | CYP3A4 (0.48) | CYP3A4CASP1RECQLCYP19A1ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 567 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240218126-A1 | POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-07-04 | — | — | US | claimed |
| EP-4393981-A1 | POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF | PI Advanced Materials Co., Ltd. (KR) | 2024-07-03 | — | — | EP | claimed |
| WO-2024117669-A1 | POLYIMIDE VARNISH FOR COATING CONDUCTOR WITH IMPROVED HEAT DISSIPATION FOR COATING CONDUCTOR AND POLYIMIDE COATING MATERIAL COMPRISING THE SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-06-06 | — | — | WO | claimed |
| WO-2024112104-A1 | POLYIMIDE FILM COMPRISING ADDITIVE AND GRAPHITE SHEET PREPARED BY USING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-05-30 | — | — | WO | claimed |
| WO-2024076094-A1 | BLACK POLYIMIDE FILM AND THE MANUFACTURING METHOD THEREOF | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-04-11 | — | — | WO | claimed |
| US-20240026098-A1 | POLYIMIDE FILM HAVING HIGH DIMENSIONAL STABILITY AND MANUFACTURING METHOD THEREFOR | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-01-25 | — | — | US | claimed |
| WO-2024005508-A1 | SELF-LUBRICATING POLYIMIDE VARNISH AND POLYIMIDE COATING PREPARED THEREFROM | 피아이첨단소재 주식회사 | 2024-01-04 | — | — | WO | claimed |
| WO-2023243967-A1 | BLACK POLYIMIDE FILM AND MANUFACTURING METHOD THEREOF | PI ADVANCED MATERIALS CO., LTD. (KR) | 2023-12-21 | — | — | WO | claimed |
| WO-2023200191-A1 | MANUFACTURING METHOD OF POLYIMIDE POWDER AND POLYIMIDE POWDER MANUFACTURED BY THE SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2023-10-19 | — | — | WO | claimed |
| WO-2023191434-A1 | POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR | 피아이첨단소재 주식회사 | 2023-10-05 | — | — | WO | claimed |
| CN-116406395-A | Polyimide film having high dimensional stability and method for producing same | 聚酰亚胺先端材料有限公司 | 2023-07-07 | — | — | CN | claimed |
| CN-112585195-B | Polyimide film having improved alkali resistance and method for preparing the same | 聚酰亚胺先端材料有限公司 | 2023-03-28 | — | — | CN | claimed |
| US-20230002613-A1 | LOW-DIELECTRIC-CONSTANT POLYIMIDE COMPOSITE POWDER, AND METHOD FOR PRODUCING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2023-01-05 | — | — | US | claimed |
| CN-112996664-A | Polyimide composite film having excellent dielectric characteristics and method for preparing same | 聚酰亚胺先端材料有限公司 | 2021-06-18 | — | — | CN | claimed |
| CN-112955497-A | Ultrathin polyimide film with improved dimensional stability and preparation method thereof | 聚酰亚胺先端材料有限公司 | 2021-06-11 | — | — | CN | claimed |
| CN-112585195-A | Polyimide film having improved alkali resistance and method for preparing the same | 聚酰亚胺先端材料有限公司 | 2021-03-30 | — | — | CN | claimed |
| WO-2020040347-A1 | POLYIMIDE FILM HAVING IMPROVED ALKALI RESISTANCE AND METHOD FOR MANUFACTURING SAME | 에스케이씨코오롱피아이 주식회사 | 2020-02-27 | — | — | WO | claimed |
| US-5459233-A | High temperature engineering aromatic polyimides | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1995-10-17 | — | — | US | claimed |
| US-5288843-A | Polymerizing 4,4'-bis(3-aminophenoxy)biphenyl, pyromellitic dianhydride and a different aromaticdiamine; engineering plastics; molding mateials; aerospace; heat resistance; melt processibility | MITSUI TOATSU CHEMICALS, INC. (JP) | 1994-02-22 | — | — | US | claimed |
| EP-4401112-A1 | SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | University of Tsukuba (JP) | 2024-07-17 | — | — | EP | disclosed |
| US-20240227363-A1 | LAMINATE OF INORGANIC SUBSTRATE AND HEAT-RESISTANT POLYMER FILM | TOYOBO CO., LTD. (JP) | 2024-07-11 | — | — | US | disclosed |
| US-20240227373-A1 | MULTILAYER BODY OF INORGANIC SUBSTRATE AND TRANSPARENT HEAT-RESISTANT POLYMER FILM | TOYOBO CO., LTD. (JP) | 2024-07-11 | — | — | US | disclosed |
| US-20240228792-A1 | BLACK VARNISH AND FILM CONTAINING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-07-11 | — | — | US | disclosed |
| CN-114746491-B | Prepreg, laminate, and integrated molded article | 东丽株式会社 | 2024-07-05 | — | — | CN | disclosed |
| US-20240218126-A1 | POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-07-04 | — | — | US | disclosed |
| EP-4393981-A1 | POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF | PI Advanced Materials Co., Ltd. (KR) | 2024-07-03 | — | — | EP | disclosed |
| CN-114072451-B | Polyamic acid composition, method for preparing the same, and polyimide containing the same | PI尖端素材株式会社 | 2024-07-02 | — | — | CN | disclosed |
| CN-113950409-B | Laminate body | 东洋纺株式会社 | 2024-06-28 | — | — | CN | disclosed |
| CN-118255988-A | Polyimide molded article and method for producing same | 聚酰亚胺先端材料有限公司 | 2024-06-28 | — | — | CN | disclosed |
| WO-2024135780-A1 | POLYIMIDE FILM, MULTILAYER BODY, FLEXIBLE ELECTRONIC DEVICE AND METHOD FOR PRODUCING FLEXIBLE ELECTRONIC DEVICE | 東洋紡株式会社 | 2024-06-27 | — | — | WO | disclosed |
| EP-4389419-A1 | TRANSPARENT HEAT-RESISTANT LAMINATED FILM | TOYOBO CO., LTD. (JP) | 2024-06-26 | — | — | EP | disclosed |
| CN-118159599-A | Polyamic acid composition and preparation method thereof | PI尖端素材株式会社 | 2024-06-07 | — | — | CN | disclosed |
| CN-118159600-A | Polyamic acid composition and preparation method thereof | PI尖端素材株式会社 | 2024-06-07 | — | — | CN | disclosed |
| US-20240182765-A1 | POLYAMIC ACID COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE AND LAMINATE | MITSUI CHEMICALS, INC. (JP) | 2024-06-06 | — | — | US | disclosed |
| WO-2024117669-A1 | POLYIMIDE VARNISH FOR COATING CONDUCTOR WITH IMPROVED HEAT DISSIPATION FOR COATING CONDUCTOR AND POLYIMIDE COATING MATERIAL COMPRISING THE SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-06-06 | — | — | WO | disclosed |
| CN-118119507-A | Laminate of inorganic substrate with protective film and heat-resistant polymer film | 东洋纺株式会社 | 2024-05-31 | — | — | CN | disclosed |
| WO-2024112104-A1 | POLYIMIDE FILM COMPRISING ADDITIVE AND GRAPHITE SHEET PREPARED BY USING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-05-30 | — | — | WO | disclosed |
| EP-4375333-A1 | POLYIMIDE COATING MATERIAL | PI Advanced Materials Co., Ltd. (KR) | 2024-05-29 | — | — | EP | disclosed |
| EP-4375332-A1 | POLYAMIC ACID COMPOSITION AND POLYIMIDE COATING MATERIAL COMPRISING SAME | PI Advanced Materials Co., Ltd. (KR) | 2024-05-29 | — | — | EP | disclosed |
| CN-118076482-A | Laminate with protective film-assisted release tape | 东洋纺株式会社 | 2024-05-24 | — | — | CN | disclosed |
| EP-4371767-A1 | MULTILAYER BODY OF INORGANIC SUBSTRATE AND TRANSPARENT HEAT-RESISTANT POLYMER FILM | TOYOBO CO., LTD. (JP) | 2024-05-22 | — | — | EP | disclosed |
| EP-4371766-A1 | LAMINATE OF INORGANIC SUBSTRATE AND HEAT-RESISTANT POLYMER FILM | TOYOBO CO., LTD. (JP) | 2024-05-22 | — | — | EP | disclosed |
| US-20240150611-A1 | POLYAMIC ACID VARNISH | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-05-09 | — | — | US | disclosed |
| EP-4360873-A1 | LAMINATE | TOYOBO CO., LTD. (JP) | 2024-05-01 | — | — | EP | disclosed |
| CN-114174422-B | Resin composition and use thereof | DIC株式会社 | 2024-04-30 | — | — | CN | disclosed |
| EP-4357392-A1 | POLYAMIC ACID VARNISH | PI Advanced Materials Co., Ltd. (KR) | 2024-04-24 | — | — | EP | disclosed |
| CN-117916856-A | Semiconductor device and method for manufacturing semiconductor device | 国立大学法人筑波大学 | 2024-04-19 | — | — | CN | disclosed |
| CN-117866200-A | Polybenzoxazole precursor, process for producing the same, and photosensitive resin composition | 上海交通大学 | 2024-04-12 | — | — | CN | disclosed |
| WO-2024076094-A1 | BLACK POLYIMIDE FILM AND THE MANUFACTURING METHOD THEREOF | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-04-11 | — | — | WO | disclosed |
| US-20240116274-A1 | LAMINATE OF INORGANIC SUBSTRATE/POLYMER FILM LAYER WITH ATTACHED PROTECTIVE FILM, LAMINATE STACK, LAMINATE STORAGE METHOD, AND LAMINATE TRANSPORT METHOD | TOYOBO CO., LTD. (JP) | 2024-04-11 | — | — | US | disclosed |
| EP-3489291-B1 | POROUS POLYIMIDE FILM PRODUCTION METHOD AND POROUS POLYIMIDE FILM PRODUCED USING SAID METHOD | UBE CORP (JP) | 2024-04-03 | — | — | EP | disclosed |
| CN-117813200-A | Transparent high heat-resistant laminated film | 东洋纺株式会社 | 2024-04-02 | — | — | CN | disclosed |
| US-11932841-B2 | Cell cultivation module | UBE CORPORATION (JP) | 2024-03-19 | — | — | US | disclosed |
| CN-117677497-A | Laminate of inorganic substrate and heat-resistant polymer film | 东洋纺株式会社 | 2024-03-08 | — | — | CN | disclosed |
| CN-117656622-A | Polyimide film and method for producing same | 东洋纺株式会社 | 2024-03-08 | — | — | CN | disclosed |
| CN-117677673-A | Polyamic acid composition and polyimide cover comprising same | PI尖端素材株式会社 | 2024-03-08 | — | — | CN | disclosed |
| CN-115175816-B | Laminate body | 东洋纺株式会社 | 2024-03-08 | — | — | CN | disclosed |
| CN-117677496-A | Laminate of inorganic substrate and transparent heat-resistant polymer film | 东洋纺株式会社 | 2024-03-08 | — | — | CN | disclosed |
| US-20240075718-A1 | LAMINATE | TOYOBO CO., LTD. (JP) | 2024-03-07 | — | — | US | disclosed |
| CN-117651739-A | Polyimide cover | PI尖端素材株式会社 | 2024-03-05 | — | — | CN | disclosed |
| CN-117642286-A | Laminate roll | 东洋纺株式会社 | 2024-03-01 | — | — | CN | disclosed |
| CN-117642285-A | Laminate body | 东洋纺株式会社 | 2024-03-01 | — | — | CN | disclosed |
| CN-117616882-A | Method for producing circuit board, circuit board precursor with release film, and circuit board precursor with inorganic substrate | 东洋纺株式会社 | 2024-02-27 | — | — | CN | disclosed |
| US-20240059057-A1 | LAMINATED FILM, LAMINATED FILM MANUFACTURING METHOD, LAMINATE, AND LAMINATE MANUFACTURING METHOD | TOYOBO CO., LTD. (JP) | 2024-02-22 | — | — | US | disclosed |
| US-11905431-B2 | Polyimide varnish comprising aromatic carboxylic acid for conductor coating and manufacturing method therefor | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-02-20 | — | — | US | disclosed |
| CN-117534836-A | Polybenzoxazole precursor, process for producing the same, and photosensitive resin composition | 上海交通大学 | 2024-02-09 | — | — | CN | disclosed |
| US-20240026098-A1 | POLYIMIDE FILM HAVING HIGH DIMENSIONAL STABILITY AND MANUFACTURING METHOD THEREFOR | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-01-25 | — | — | US | disclosed |
| US-20240018307-A1 | POLYAMIC ACID COMPOSITION, AND POLYIMIDE COMPRISING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-01-18 | — | — | US | disclosed |
| WO-2024010418-A1 | POLYIMIDE FILM FOR GRAPHITE SHEET, AND GRAPHITE SHEET PREPARED THEREFROM | 피아이첨단소재 주식회사 | 2024-01-11 | — | — | WO | disclosed |
| WO-2024009853-A1 | LAYERED PRODUCT AND METHOD FOR PRODUCING LAYERED PRODUCT | 東洋紡株式会社 | 2024-01-11 | — | — | WO | disclosed |
| EP-4302990-A1 | LAMINATE OF INORGANIC SUBSTRATE/POLYMER FILM LAYER WITH ATTACHED PROTECTIVE FILM, LAMINATE STACK, LAMINATE STORAGE METHOD, AND LAMINATE TRANSPORT METHOD | TOYOBO CO., LTD. (JP) | 2024-01-10 | — | — | EP | disclosed |
| EP-4302994-A1 | LAMINATED FILM, LAMINATED FILM MANUFACTURING METHOD, LAMINATE, AND LAMINATE MANUFACTURING METHOD | TOYOBO CO., LTD. (JP) | 2024-01-10 | — | — | EP | disclosed |
| US-20240002601-A1 | POLYAMIC ACID COMPOSITION, AND POLYIMIDE COMPRISING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-01-04 | — | — | US | disclosed |
| US-20240002600-A1 | POLYAMIC ACID COMPOSITION, AND POLYIMIDE COMPRISING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2024-01-04 | — | — | US | disclosed |
| CN-115461221-B | Polyimide film and method for producing same | 东洋纺株式会社 | 2023-12-29 | — | — | CN | disclosed |
| WO-2023249053-A1 | METHOD FOR PRODUCING FILM | 東洋紡株式会社 | 2023-12-28 | — | — | WO | disclosed |
| US-20230416465-A1 | POLYAMIC ACID COMPOSITION, AND POLYIMIDE COMPRISING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2023-12-28 | — | — | US | disclosed |
| US-20230416464-A1 | POLYAMIC ACID COMPOSITION, AND POLYIMIDE COMPRISING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2023-12-28 | — | — | US | disclosed |
| WO-2023243693-A1 | LAMINATE | 東洋紡株式会社 | 2023-12-21 | — | — | WO | disclosed |
| WO-2023243967-A1 | BLACK POLYIMIDE FILM AND MANUFACTURING METHOD THEREOF | PI ADVANCED MATERIALS CO., LTD. (KR) | 2023-12-21 | — | — | WO | disclosed |
| CN-117241942-A | Laminate body | 东洋纺株式会社 | 2023-12-15 | — | — | CN | disclosed |
| US-11833795-B2 | Multilayer body and method for producing flexible device | TOYOBO CO., LTD. (JP) | 2023-12-05 | — | — | US | disclosed |
| US-11825673-B2 | Display device | SAMSUNG DISPLAY CO., LTD. (KR) | 2023-11-21 | — | — | US | disclosed |
| CN-117043231-A | Polyamic acid composition, polyimide composition, adhesive, and laminate | 三井化学株式会社 | 2023-11-10 | — | — | CN | disclosed |
| CN-116964131-A | Polyamic acid, polyimide, and use thereof | 东洋纺株式会社 | 2023-10-27 | — | — | CN | disclosed |
| CN-116940420-A | Method for producing resin film and film before cutting | 东洋纺株式会社 | 2023-10-24 | — | — | CN | disclosed |
| CN-116917124-A | Laminate of inorganic substrate/polymer film layer with protective film, laminate set, laminate storage method, and laminate transportation method | 东洋纺株式会社 | 2023-10-20 | — | — | CN | disclosed |
| WO-2023200191-A1 | MANUFACTURING METHOD OF POLYIMIDE POWDER AND POLYIMIDE POWDER MANUFACTURED BY THE SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2023-10-19 | — | — | WO | disclosed |
| CN-116887981-A | Laminated film, method for producing laminated film, laminated body, and method for producing laminated body | 东洋纺株式会社 | 2023-10-13 | — | — | CN | disclosed |
| WO-2023191434-A1 | POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR | 피아이첨단소재 주식회사 | 2023-10-05 | — | — | WO | disclosed |
| US-20230312852-A1 | LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT | TOYOBO CO., LTD. (JP) | 2023-10-05 | — | — | US | disclosed |
| WO-2023189719-A1 | LAMINATE AND METHOD FOR PRODUCING LAMINATE | 東洋紡株式会社 | 2023-10-05 | — | — | WO | disclosed |
| US-20230271367-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE | TOYOBO CO., LTD. (JP) | 2023-08-31 | — | — | US | disclosed |
| CN-116648475-A | Polyamic acid composition and polyimide containing same | PI尖端素材株式会社 | 2023-08-25 | — | — | CN | disclosed |
| WO-2023157839-A1 | LAMINATE | 東洋紡株式会社 | 2023-08-24 | — | — | WO | disclosed |
| EP-3756892-B1 | INKJET HEAD AND METHOD FOR PRODUCING SAME | KONICA MINOLTA INC (JP) | 2023-08-23 | — | — | EP | disclosed |
| CN-113518792-B | Polybenzoxazole precursor containing ester diamine, photosensitive resin composition, dry film, cured product, and electronic component | 太阳控股株式会社 | 2023-08-15 | — | — | CN | disclosed |
| WO-2023149581-A1 | SURFACE TREATMENT SOLUTION, AND METHOD FOR MANUFACTURING SURFACE-TREATED RESIN AND RESIN FILM LAMINATE | 豊光社テクノロジーズ株式会社 | 2023-08-10 | — | — | WO | disclosed |
| EP-4223521-A1 | LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT | TOYOBO CO., LTD. (JP) | 2023-08-09 | — | — | EP | disclosed |
| CN-116568736-A | Polyamic acid composition and polyimide containing same | PI尖端素材株式会社 | 2023-08-08 | — | — | CN | disclosed |
| CN-116568735-A | Polyamic acid composition and polyimide containing same | PI尖端素材株式会社 | 2023-08-08 | — | — | CN | disclosed |
| CN-114953744-B | Ink jet head and method for manufacturing the same | 柯尼卡美能达株式会社 | 2023-08-04 | — | — | CN | disclosed |
| CN-116529294-A | Polyamic acid composition and polyimide containing same | PI尖端素材株式会社 | 2023-08-01 | — | — | CN | disclosed |
| CN-116438257-A | Polyamic acid composition and polyimide containing same | PI尖端素材株式会社 | 2023-07-14 | — | — | CN | disclosed |
| CN-112955497-B | Ultrathin polyimide film with improved dimensional stability and preparation method thereof | 聚酰亚胺先端材料有限公司 | 2023-07-11 | — | — | CN | disclosed |
| CN-116406395-A | Polyimide film having high dimensional stability and method for producing same | 聚酰亚胺先端材料有限公司 | 2023-07-07 | — | — | CN | disclosed |
| US-20230211584-A1 | LAYERED PRODUCT INCLUDING HIGH TEMPERATURE-RESISTANT TRANSPARENT FILM | TOYOBO CO., LTD. (JP) | 2023-07-06 | — | — | US | disclosed |
| CN-113166450-B | Polyimide film including at least two sets of fillers having different diameters and electronic device including the same | 聚酰亚胺先端材料有限公司 | 2023-06-27 | — | — | CN | disclosed |
| EP-4197779-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE | TOYOBO CO., LTD. (JP) | 2023-06-21 | — | — | EP | disclosed |
| US-20230173800-A1 | MULTILAYER BODY COMPRISING HIGHLY HEAT-RESISTANT TRANSPARENT FILM | TOYOBO CO., LTD. (JP) | 2023-06-08 | — | — | US | disclosed |
| EP-4186695-A1 | MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE DEVICE | TOYOBO CO., LTD. (JP) | 2023-05-31 | — | — | EP | disclosed |
| WO-2023090838-A1 | POLYIMIDE FILM FOR GRAPHITE SHEET, AND GRAPHITE SHEET PREPARED THEREFROM | 피아이첨단소재 주식회사 | 2023-05-25 | — | — | WO | disclosed |
| CN-116137837-A | Polyimide film and method for producing same | 东洋纺株式会社 | 2023-05-19 | — | — | CN | disclosed |
| US-20230150252-A1 | MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE DEVICE | TOYOBO CO., LTD. (JP) | 2023-05-18 | — | — | US | disclosed |
| CN-116133854-A | Polyimide film and method for producing same | 东洋纺株式会社 | 2023-05-16 | — | — | CN | disclosed |
| WO-2023075411-A1 | POLYAMIC ACID COMPOSITION AND METHOD FOR PREPARING SAME | 피아이첨단소재 주식회사 | 2023-05-04 | — | — | WO | disclosed |
| WO-2023074909-A1 | POLYIMIDE POROUS FILM, ELECTRODE STRUCTURE, AND POWER STORAGE DEVICE | 株式会社スリーダムアライアンス | 2023-05-04 | — | — | WO | disclosed |
| WO-2023075413-A1 | POLYAMIC ACID COMPOSITION AND METHOD FOR PREPARING SAME | 피아이첨단소재 주식회사 | 2023-05-04 | — | — | WO | disclosed |
| WO-2023074536-A1 | PROTECTIVE FILM-EQUIPPED LAMINATE OF INORGANIC SUBSTRATE AND HEAT-RESISTANT POLYMER FILM | 東洋紡株式会社 | 2023-05-04 | — | — | WO | disclosed |
| CN-115996840-A | Laminate and method for manufacturing flexible device | 东洋纺株式会社 | 2023-04-21 | — | — | CN | disclosed |
| EP-4159431-A1 | MULTILAYER BODY COMPRISING HIGHLY HEAT-RESISTANT TRANSPARENT FILM | TOYOBO CO., LTD. (JP) | 2023-04-05 | — | — | EP | disclosed |
| EP-4159440-A1 | LAYERED PRODUCT INCLUDING HIGH TEMPERATURE-RESISTANT TRANSPARENT FILM | TOYOBO CO., LTD. (JP) | 2023-04-05 | — | — | EP | disclosed |
| WO-2023037774-A1 | SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | 国立大学法人 筑波大学 | 2023-03-16 | — | — | WO | disclosed |
| WO-2023038321-A1 | POLYAMIC ACID COMPOSITION, AND POLYIMIDE PRODUCED THEREFROM | 피아이첨단소재 주식회사 | 2023-03-16 | — | — | WO | disclosed |
| WO-2023032521-A1 | LAMINATE | 東洋紡株式会社 | 2023-03-09 | — | — | WO | disclosed |
| CN-115667379-A | Resin film and method for producing resin film | 东洋纺株式会社 | 2023-01-31 | — | — | CN | disclosed |
| WO-2023003363-A1 | POLYIMIDE COATING MATERIAL | 피아이첨단소재 주식회사 | 2023-01-26 | — | — | WO | disclosed |
| WO-2023002919-A1 | LAMINATE | 東洋紡株式会社 | 2023-01-26 | — | — | WO | disclosed |
| WO-2023003362-A1 | POLYAMIC ACID COMPOSITION AND POLYIMIDE COATING MATERIAL COMPRISING SAME | 피아이첨단소재 주식회사 | 2023-01-26 | — | — | WO | disclosed |
| WO-2023002920-A1 | LAMINATE ROLL | 東洋紡株式会社 | 2023-01-26 | — | — | WO | disclosed |
| WO-2023286685-A1 | LAMINATE OF INORGANIC SUBSTRATE AND HEAT-RESISTANT POLYMER FILM | 東洋紡株式会社 | 2023-01-19 | — | — | WO | disclosed |
| WO-2023286686-A1 | MULTILAYER BODY OF INORGANIC SUBSTRATE AND TRANSPARENT HEAT-RESISTANT POLYMER FILM | 東洋紡株式会社 | 2023-01-19 | — | — | WO | disclosed |
| WO-2023286429-A1 | METHOD FOR MANUFACTURING CIRCUIT BOARD, CIRCUIT BOARD PRECURSOR WITH RELEASE FILM, AND CIRCUIT BOARD PRECURSOR WITH INORGANIC SUBSTRATE | 東洋紡株式会社 | 2023-01-19 | — | — | WO | disclosed |
| US-20230017689-A1 | PREPREG, LAMINATE, AND INTEGRATED PRODUCT | TORAY INDUSTRIES, INC. (JP) | 2023-01-19 | — | — | US | disclosed |
| US-20230002613-A1 | LOW-DIELECTRIC-CONSTANT POLYIMIDE COMPOSITE POWDER, AND METHOD FOR PRODUCING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2023-01-05 | — | — | US | disclosed |
| WO-2023276864-A1 | SILSESQUIOXANE COMPOUND AND METHOD FOR PRODUCING SAME | 東洋紡株式会社 | 2023-01-05 | — | — | WO | disclosed |
| WO-2023276880-A1 | POLYAMIC ACID, POLYIMIDE, AND USE THEREOF | 東洋紡株式会社 | 2023-01-05 | — | — | WO | disclosed |
| WO-2023276887-A1 | POLY(AMIC ACID), POLYIMIDE, AND USES THEREOF | 東洋紡株式会社 | 2023-01-05 | — | — | WO | disclosed |
| CN-115551714-A | Laminate comprising transparent highly heat-resistant film | 东洋纺株式会社 | 2022-12-30 | — | — | CN | disclosed |
| CN-115515790-A | Colorless multilayer polyimide film, laminate, and method for manufacturing flexible electronic device | 东洋纺株式会社 | 2022-12-23 | — | — | CN | disclosed |
| CN-115461221-A | Polyimide film and method for producing same | 东洋纺株式会社 | 2022-12-09 | — | — | CN | disclosed |
| WO-2022202416-A1 | POLYAMIDE ACID COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE AND LAMINATE | 三井化学株式会社 | 2022-09-29 | — | — | WO | disclosed |
| WO-2022185606-A1 | LAMINATED FILM, LAMINATED FILM MANUFACTURING METHOD, LAMINATE, AND LAMINATE MANUFACTURING METHOD | 東洋紡株式会社 | 2022-09-09 | — | — | WO | disclosed |
| WO-2022186002-A1 | LAMINATE OF INORGANIC SUBSTRATE/POLYMER FILM LAYER WITH ATTACHED PROTECTIVE FILM, LAMINATE STACK, LAMINATE STORAGE METHOD, AND LAMINATE TRANSPORT METHOD | 東洋紡株式会社 | 2022-09-09 | — | — | WO | disclosed |
| CN-114953744-A | Ink jet head and method of manufacturing the same | 柯尼卡美能达株式会社 | 2022-08-30 | — | — | CN | disclosed |
| US-20220267528-A1 | POLYAMIC ACID COMPOSITION, METHOD FOR PREPARING POLYAMIC ACID COMPOSITION, POLYIMIDE COMPRISING THE SAME AND COATING MATERIAL COMPRISING THE SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2022-08-25 | — | — | US | disclosed |
| US-11420440-B2 | Inkjet head and method for producing same | Konica Minolta, Inc. (JP) | 2022-08-23 | — | — | US | disclosed |
| CN-111867843-B | Ink jet head and method of manufacturing the same | 柯尼卡美能达株式会社 | 2022-07-22 | — | — | CN | disclosed |
| US-20220227941-A1 | POLYIMIDE AND MANUFACTURING METHOD THEREFOR | PI ADVANCED MATERIALS CO., LTD. (KR) | 2022-07-21 | — | — | US | disclosed |
| CN-114746491-A | Prepreg, laminate, and integrated molded article | 东丽株式会社 | 2022-07-12 | — | — | CN | disclosed |
| CN-109477055-B | Cell preparation method, cell culture device, and kit | 宇部兴产株式会社 | 2022-06-21 | — | — | CN | disclosed |
| EP-4012016-A1 | CELL CULTURING METHOD USING SMALL-PIECE POROUS MEMBRANE | Ube Industries, Ltd. (JP) | 2022-06-15 | — | — | EP | disclosed |
| EP-4012014-A1 | METHOD FOR PRODUCING EXOSOME | Ube Industries, Ltd. (JP) | 2022-06-15 | — | — | EP | disclosed |
| US-20220143964-A1 | HEAT-RESISTANT POLYMER FILM LAMINATE AND METHOD FOR PRODUCING HEAT-RESISTANT POLYMER FILM LAMINATE | TOYOBO CO., LTD. (JP) | 2022-05-12 | — | — | US | disclosed |
| US-20220119676-A1 | POLYAMIC ACID COMPOSITION FOR MANUFACTURING DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING SUBSTRATE FOR DISPLAY BY USING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2022-04-21 | — | — | US | disclosed |
| CN-114174422-A | Resin composition, semiconductor sealing material using same, and dipping base material, circuit board, build-up film, prepreg, carbon fiber composite material, solder resist, dry film, and printed wiring board | DIC株式会社 | 2022-03-11 | — | — | CN | disclosed |
| US-11267216-B2 | Polymer film laminated substrate and method for producing flexible electronic device | TOYOBO CO., LTD. (JP) | 2022-03-08 | — | — | US | disclosed |
| CN-114096588-A | Polyimide and method for producing same | PI尖端素材株式会社 | 2022-02-25 | — | — | CN | disclosed |
| CN-114096587-A | Polyamic acid composition, method for preparing polyamic acid composition, polyimide comprising the composition, and coating material comprising the composition | PI尖端素材株式会社 | 2022-02-25 | — | — | CN | disclosed |
| CN-114072451-A | Polyamic acid composition, method for preparing polyamic acid composition, and polyimide comprising polyamic acid composition | PI尖端素材株式会社 | 2022-02-18 | — | — | CN | disclosed |
| CN-114072452-A | Polyamic acid composition, method for preparing polyamic acid composition, polyimide comprising the composition, and coating material comprising the composition | PI尖端素材株式会社 | 2022-02-18 | — | — | CN | disclosed |
| EP-3950273-A1 | HEAT-RESISTANT POLYMER FILM LAMINATE AND METHOD FOR PRODUCING HEAT-RESISTANT POLYMER FILM LAMINATE | TOYOBO CO., LTD. (JP) | 2022-02-09 | — | — | EP | disclosed |
| CN-110225820-B | Method for manufacturing polymer film laminated substrate and flexible electronic device | 东洋纺株式会社 | 2022-01-28 | — | — | CN | disclosed |
| EP-3489342-B1 | SIPHON TYPE CULTIVATION METHOD | UBE INDUSTRIES (JP) | 2022-01-26 | — | — | EP | disclosed |
| US-20220017371-A1 | GRAPHITE SHEET PRODUCED FROM POLYIMIDE FILM HAVING EXCELLENT ORIENTATION PROPERTIES, AND METHOD FOR PRODUCING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2022-01-20 | — | — | US | disclosed |
| US-20220017711-A1 | POLYIMIDE FILM COMPRISING AT LEAST TWO FILLERS HAVING DIFFERENT DIAMETERS, AND ELECTRONIC DEVICE COMPRISING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2022-01-20 | — | — | US | disclosed |
| US-20220017710-A1 | POLYIMIDE FILM COMPRISING TWO OR MORE FILLERS WITH DIFFERENT PARTICLE DIAMETERS AND ELECTRONIC APPARATUS COMPRISING SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2022-01-20 | — | — | US | disclosed |
| CN-113950409-A | Laminated body | 东洋纺株式会社 | 2022-01-18 | — | — | CN | disclosed |
| US-20220009143-A1 | POLYIMIDE COMPOSITE FILM HAVING IMPROVED SURFACE ADHESIVE STRENGTH WITH METAL LAYER AND METHOD FOR PREPARING THE SAME | PI ADVANCED MATERIALS CO., LTD. (KR) | 2022-01-13 | — | — | US | disclosed |
| US-20220013743-A1 | DISPLAY DEVICE | SAMSUNG DISPLAY CO., LTD. (KR) | 2022-01-13 | — | — | US | disclosed |
| CN-113921560-A | Display device | 三星显示有限公司 | 2022-01-11 | — | — | CN | disclosed |
| WO-2022004852-A1 | RESIN FILM AND PRODUCTION METHOD THEREOF | 東洋紡株式会社 | 2022-01-06 | — | — | WO | disclosed |
| WO-2021256367-A1 | POLYGUANAMINE, POLYGUANAMINE FILM, AND METHOD FOR PRODUCING POLYGUANAMINE | 国立大学法人岩手大学 | 2021-12-23 | — | — | WO | disclosed |
| WO-2021256298-A1 | COLORLESS MULTILAYER POLYIMIDE FILM, MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE ELECTRONIC DEVICE | 東洋紡株式会社 | 2021-12-23 | — | — | WO | disclosed |
| WO-2021241573-A1 | POLYIMIDE FILM AND METHOD FOR PRODUCING SAME | 東洋紡株式会社 | 2021-12-02 | — | — | WO | disclosed |
| WO-2021241574-A1 | LAMINATE INCLUDING TRANSPARENT FILM WITH HIGH HEAT RESISTANCE | 東洋紡株式会社 | 2021-12-02 | — | — | WO | disclosed |
| WO-2021241570-A1 | MULTILAYER BODY COMPRISING HIGHLY HEAT-RESISTANT TRANSPARENT FILM | 東洋紡株式会社 | 2021-12-02 | — | — | WO | disclosed |
| WO-2021241571-A1 | LAYERED PRODUCT INCLUDING HIGH TEMPERATURE-RESISTANT TRANSPARENT FILM | 東洋紡株式会社 | 2021-12-02 | — | — | WO | disclosed |
| WO-2021241572-A1 | POLYIMIDE FILM AND METHOD FOR PRODUCING SAME | 東洋紡株式会社 | 2021-12-02 | — | — | WO | disclosed |
| EP-3026108-B1 | CELL CULTURING METHOD, CELL CULTURING APPARATUS AND KIT | UBE INDUSTRIES (JP) | 2021-11-10 | — | — | EP | disclosed |
| WO-2021215182-A1 | METHOD FOR MANUFACTURING RESIN FILM, AND PRE-CUT FILM | 東洋紡株式会社 (JP) | 2021-10-28 | — | — | WO | disclosed |
| EP-3252150-B1 | CELL CULTURE METHOD USING BONE MARROW-LIKE STRUCTURE, AND POLYIMIDE POROUS MEMBRANE FOR TREATING BONE DAMAGE SITE | UBE INDUSTRIES (JP) | 2021-10-27 | — | — | EP | disclosed |
| CN-109476912-B | Composition for forming release layer | 日产化学株式会社 | 2021-10-08 | — | — | CN | disclosed |
| CN-113402882-A | Composition for forming release layer | 日产化学工业株式会社 | 2021-09-17 | — | — | CN | disclosed |
| CN-113061340-B | Display device, polyimide precursor composition, polyimide film, and laminate | 武汉柔显科技股份有限公司 | 2021-08-20 | — | — | CN | disclosed |
| CN-110709245-B | Laminate of polyimide film and inorganic substrate | 东洋纺株式会社 | 2021-08-06 | — | — | CN | disclosed |
| CN-107250277-B | Composition for forming release layer | 日产化学工业株式会社 | 2021-07-30 | — | — | CN | disclosed |
| CN-113166453-A | Graphite sheet prepared from polyimide film having excellent orientation properties and method for preparing same | 聚酰亚胺先端材料有限公司 | 2021-07-23 | — | — | CN | disclosed |
| US-11065853-B2 | Polyimide film layered body | TOYOBO CO., LTD. (JP) | 2021-07-20 | — | — | US | disclosed |
| CN-109563300-B | Method for producing porous polyimide film and porous polyimide film produced by the method | 宇部兴产株式会社 | 2021-07-16 | — | — | CN | disclosed |
| EP-3450164-B1 | POLYIMIDE FILM LAYERED BODY | TOYO BOSEKI (JP) | 2021-07-14 | — | — | EP | disclosed |
| CN-113061340-A | Display device, polyimide precursor composition, polyimide film, and laminate | 武汉柔显科技股份有限公司 | 2021-07-02 | — | — | CN | disclosed |
| US-20210198521-A1 | POLYIMIDE VARNISH COMPRISING AROMATIC CARBOXYLIC ACID FOR CONDUCTOR COATING AND MANUFACTURING METHOD THEREFOR | PI ADVANCED MATERIALS CO., LTD. (KR) | 2021-07-01 | — | — | US | disclosed |
| EP-3842500-A1 | POLYIMIDE VARNISH COMPRISING AROMATIC CARBOXYLIC ACID FOR CONDUCTOR COATING AND MANUFACTURING METHOD THEREFOR | PI Advanced Materials Co., Ltd. (KR) | 2021-06-30 | — | — | EP | disclosed |
| WO-2021125308-A1 | RELEASE LAYER FORMING COMPOSITION | 日産化学株式会社 | 2021-06-24 | — | — | WO | disclosed |
| US-20210189126-A1 | DETACHABLE LAYER-FORMING COMPOSITION AND DETACHABLE LAYER | NISSAN CHEMICAL CORPORATION (JP) | 2021-06-24 | — | — | US | disclosed |
| CN-112996664-A | Polyimide composite film having excellent dielectric characteristics and method for preparing same | 聚酰亚胺先端材料有限公司 | 2021-06-18 | — | — | CN | disclosed |
| WO-2021117465-A1 | PREPREG, LAMINATE AND INTEGRATED MOLDED ARTICLE | 東レ株式会社 | 2021-06-17 | — | — | WO | disclosed |
| CN-112955497-A | Ultrathin polyimide film with improved dimensional stability and preparation method thereof | 聚酰亚胺先端材料有限公司 | 2021-06-11 | — | — | CN | disclosed |
| US-20210122143-A1 | LAMINATE OF POLYIMIDE FILM AND INORGANIC SUBSTRATE | TOYOBO CO., LTD. (JP) | 2021-04-29 | — | — | US | disclosed |
| US-10988647-B2 | Semiconductor substrate manufacturing method, semiconductor device, and method for manufacturing same | MITSUI CHEMICALS, INC. (JP) | 2021-04-27 | — | — | US | disclosed |
| CN-112689656-A | Method for producing polyamideimide film and polyamideimide film produced thereby | 聚酰亚胺先端材料有限公司 | 2021-04-20 | — | — | CN | disclosed |
| US-10982186-B2 | Cell culturing method and kit | UBE INDUSTRIES, LTD. (JP) | 2021-04-20 | — | — | US | disclosed |
| WO-2021070719-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE | 東洋紡株式会社 | 2021-04-15 | — | — | WO | disclosed |
| WO-2021065101-A1 | APPARATUS FOR MANUFACTURING LAMINATE AND METHOD FOR MANUFACTURING LAMINATE | 東洋紡株式会社 | 2021-04-08 | — | — | WO | disclosed |
| US-10968328-B2 | Porous polyimide film production method and porous polyimide film produced using said method | UBE INDUSTRIES, LTD. (JP) | 2021-04-06 | — | — | US | disclosed |
| CN-112585195-A | Polyimide film having improved alkali resistance and method for preparing the same | 聚酰亚胺先端材料有限公司 | 2021-03-30 | — | — | CN | disclosed |
| CN-112512792-A | Laminate and method for producing laminate | 东洋纺株式会社 | 2021-03-16 | — | — | CN | disclosed |
| WO-2021039111-A1 | RESIN COMPOSITION AND SEMICONDUCTOR SEALING MATERIAL USING SAME, IMPREGNATED BASE MATERIAL, CIRCUIT BASE BOARD, BUILD-UP FILM, PREPREG, CARBON FIBER COMPOSITE MATERIAL, SOLDER RESIST, DRY FILM, AND PRINTED CIRCUIT BOARD | DIC株式会社 | 2021-03-04 | — | — | WO | disclosed |
| WO-2021029409-A1 | CELL CULTURING METHOD USING SMALL-PIECE POROUS MEMBRANE | 宇部興産株式会社 | 2021-02-18 | — | — | WO | disclosed |
| WO-2021029408-A1 | METHOD FOR PRODUCING EXOSOME | 宇部興産株式会社 | 2021-02-18 | — | — | WO | disclosed |
| WO-2021028960-A1 | COLORED RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE | 太陽ホールディングス株式会社 | 2021-02-18 | — | — | WO | disclosed |
| WO-2021029243-A1 | COLORED RESIN COMPOSITION, CURED PRODUCT AND LAMINATE | 太陽ホールディングス株式会社 | 2021-02-18 | — | — | WO | disclosed |
| US-20210047595-A1 | CELL CULTURE DEVICE, AND CELL CULTURE METHOD USING SAME | UBE INDUSTRIES, LTD. (JP) | 2021-02-18 | — | — | US | disclosed |
| US-20210040430-A1 | CELL CULTURE MODULE | UBE INDUSTRIES, LTD. (JP) | 2021-02-11 | — | — | US | disclosed |
| US-20210016572-A1 | INKJET HEAD AND METHOD FOR PRODUCING SAME | Konica Minolta, Inc. (JP) | 2021-01-21 | — | — | US | disclosed |
| EP-3756892-A1 | INKJET HEAD AND METHOD FOR PRODUCING SAME | KONICA MINOLTA, INC. (JP) | 2020-12-30 | — | — | EP | disclosed |
| EP-3406272-B1 | CELL CULTURE METHOD USING BONE MARROW-LIKE STRUCTURE, AND POROUS POLYMIDE FILM FOR HEALING BONE INJURY SITE | UBE INDUSTRIES (JP) | 2020-12-30 | — | — | EP | disclosed |
| US-10857762-B2 | Polymer film coated with a layer of silane coupling agent | TOYOBO CO., LTD. (JP) | 2020-12-08 | — | — | US | disclosed |
| CN-112055724-A | Polyimide film containing bismaleimide resin and carbon black and preparation method thereof | 聚酰亚胺先端材料有限公司 | 2020-12-08 | — | — | CN | disclosed |
| US-20200377772-A1 | SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME | MITSUI CHEMICALS, INC. (JP) | 2020-12-03 | — | — | US | disclosed |
| EP-3744826-A1 | CELL CULTURE MODULE | Ube Industries, Ltd. (JP) | 2020-12-02 | — | — | EP | disclosed |
| WO-2020218695-A1 | POLYIMIDE FILM FOR GRAPHITE SHEET, AND GRAPHITE SHEET MANUFACTURED USING SAME | 피아이첨단소재 주식회사 | 2020-10-29 | — | — | WO | disclosed |
| US-20200317963-A1 | DETACHABLE LAYER-FORMING COMPOSITION AND DETACHABLE LAYER | NISSAN CHEMICAL CORPORATION (JP) | 2020-10-08 | — | — | US | disclosed |
| US-20200317915-A1 | DETACHABLE LAYER-FORMING COMPOSITION AND DETACHABLE LAYER | NISSAN CHEMICAL CORPORATION (JP) | 2020-10-08 | — | — | US | disclosed |
| WO-2020188921-A1 | ESTER-DIAMINE-CONTAINING POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT | 太陽ホールディングス株式会社 | 2020-09-24 | — | — | WO | disclosed |
| US-10738277-B2 | Cell culturing method and kit | UBE INDUSTRIES, LTD. (JP) | 2020-08-11 | — | — | US | disclosed |
| EP-3406705-B1 | CELL CULTURING METHOD AND KIT | UBE INDUSTRIES (JP) | 2020-08-05 | — | — | EP | disclosed |
| EP-3231777-B1 | GLASS PANEL UNIT | PANASONIC IP MAN CO LTD (JP) | 2020-08-05 | — | — | EP | disclosed |
| EP-3252141-B1 | CELL CULTURING METHOD AND KIT | UBE INDUSTRIES (JP) | 2020-07-29 | — | — | EP | disclosed |
| US-10716203-B2 | Adhesive film and flexible metal laminate | AGC Inc. (JP) | 2020-07-14 | — | — | US | disclosed |
| WO-2020138687-A1 | POLYAMIC ACID COMPOSITION FOR MANUFACTURING DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING DISPLAY SUBSTRATE BY USING SAME | 에스케이씨코오롱피아이 주식회사 | 2020-07-02 | — | — | WO | disclosed |
| WO-2020138743-A1 | POLYAMIC ACID COMPOSITION FOR MANUFACTURING DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING SUBSTRATE FOR DISPLAY BY USING SAME | 에스케이씨코오롱피아이 주식회사 | 2020-07-02 | — | — | WO | disclosed |
| US-10696943-B2 | Method, device and kit for mass cultivation of cells using polyimide porous membrane | UBE INDUSTRIES, LTD. (JP) | 2020-06-30 | — | — | US | disclosed |
| US-20200181308-A1 | SOLID ELECTROLYTE COMPOSITION, BINDER FOR ALL-SOLID-STATE SECONDARY BATTERIES, AND ELECTRODE SHEET FOR BATTERIES AND ALL-SOLID-STATE SECONDARY BATTERY EACH USING SAID SOLID ELECTROLYTE COMPOSITION | FUJIFILM CORPORATION (JP) | 2020-06-11 | — | — | US | disclosed |
| US-20200180259-A1 | POLYMER FILM LAMINATED SUBSTRATE AND METHOD FOR PRODUCING FLEXIBLE ELECTRONIC DEVICE | TOYOBO CO., LTD. (JP) | 2020-06-11 | — | — | US | disclosed |
| CN-111234217-A | Composition for forming release layer | 日产化学工业株式会社 | 2020-06-05 | — | — | CN | disclosed |
| EP-3339955-B1 | PELLICLE FRAME, PELLICLE CONTAINING SAME, METHOD FOR PRODUCING PELLICLE FRAME, AND METHOD FOR PRODUCING PELLICLE | MITSUI CHEMICALS INC (JP) | 2020-05-20 | — | — | EP | disclosed |
| US-10654963-B2 | Solid electrolyte composition, binder for all-solid-state secondary batteries, and electrode sheet for batteries and all-solid-state secondary battery each using said solid electrolyte composition | FUJIFILM CORPORATION (JP) | 2020-05-19 | — | — | US | disclosed |
| US-10647956-B2 | Method for isolating, removing and analyzing cells | UBE INDUSTRIES, LTD. (JP) | 2020-05-12 | — | — | US | disclosed |
| CN-108291010-B | Epoxy resin composition, prepreg, and fiber-reinforced composite material | 东丽株式会社 | 2020-05-08 | — | — | CN | disclosed |
| US-10626365-B2 | Long-term cell-cultivation using polyimide porous membrane and cell-cryopreservation method using polyimide porous membrane | UBE INDUSTRIES, LTD. (JP) | 2020-04-21 | — | — | US | disclosed |
| WO-2020071588-A1 | METHOD FOR PRODUCING POLYAMIDEIMIDE FILM, AND POLYAMIDEIMIDE FILM PRODUCED THEREFROM | 에스케이씨코오롱피아이 주식회사 | 2020-04-09 | — | — | WO | disclosed |
| US-10606169-B2 | Pellicle frame, pellicle containing same, method for producing pellicle frame, and method for producing pellicle | MITSUI CHEMICALS, INC. (JP) | 2020-03-31 | — | — | US | disclosed |
| WO-2020059508-A1 | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT | 太陽ホールディングス株式会社 | 2020-03-26 | — | — | WO | disclosed |
| US-10590388-B2 | Cell culture method using bone marrow-like structure, and porous polyimide film for healing bone injury site | UBE INDUSTRIES, LTD. (JP) | 2020-03-17 | — | — | US | disclosed |
| CN-110869848-A | Laminated structure, dry film, and flexible printed circuit board | 太阳油墨制造株式会社 | 2020-03-06 | — | — | CN | disclosed |
| US-20200071665-A1 | METHOD FOR INHIBITING DIFFERENTIATION OF NEURAL STEM CELL, METHOD FOR PREPARING NEURAL STEM CELL, AND METHOD FOR DIFFERENTIATING AND INDUCING NEURAL STEM CELL | NATIONAL UNIVERSITY CORPORATION CHIBA UNIVERSITY (JP) | 2020-03-05 | — | — | US | disclosed |
| WO-2020040356-A1 | POLYIMIDE VARNISH COMPRISING AROMATIC CARBOXYLIC ACID FOR CONDUCTOR COATING AND MANUFACTURING METHOD THEREFOR | 에스케이씨코오롱피아이 주식회사 | 2020-02-27 | — | — | WO | disclosed |
| WO-2020040347-A1 | POLYIMIDE FILM HAVING IMPROVED ALKALI RESISTANCE AND METHOD FOR MANUFACTURING SAME | 에스케이씨코오롱피아이 주식회사 | 2020-02-27 | — | — | WO | disclosed |
| WO-2020039928-A1 | LAMINATE, AND METHOD FOR PRODUCING LAMINATE | 東洋紡株式会社 | 2020-02-27 | — | — | WO | disclosed |
| WO-2020040527-A1 | POLYIMIDE FILM COMPRISING CRYSTALLINE POLYIMIDE RESIN AND THERMAL CONDUCTIVE FILLER AND MANUFACTURING METHOD THEREFOR | 에스케이씨코오롱피아이 주식회사 | 2020-02-27 | — | — | WO | disclosed |
| EP-3409706-B1 | EPOXY RESIN COMPOSITION, PREPREG AND FIBER REINFORCED COMPOSITE MATERIAL | TORAY INDUSTRIES (JP) | 2020-02-19 | — | — | EP | disclosed |
| EP-3604501-A1 | METHOD FOR INHIBITING DIFFERENTIATION OF NEURAL STEM CELL, METHOD FOR PREPARING NEURAL STEM CELL, AND METHOD FOR DIFFERENTIATING AND INDUCING NEURAL STEM CELL | UBE Industries, Ltd. (JP) | 2020-02-05 | — | — | EP | disclosed |
| WO-2020022564-A1 | POLYIMIDE PRECURSOR COMPOSITION COMPRISING AROMATIC CARBOXYLIC ACID AND POLYIMIDE FILM MANUFACTURED USING SAME | 에스케이씨코오롱피아이 주식회사 | 2020-01-30 | — | — | WO | disclosed |
| WO-2020017697-A1 | POLYIMIDE FILM INCLUDING FLUORINE-CONTAINING SILANE ADDITIVE AND CARBON BLACK, AND METHOD FOR PRODUCING SAME | 에스케이씨코오롱피아이 주식회사 | 2020-01-23 | — | — | WO | disclosed |
| WO-2020017699-A1 | POLYAMIC ACID HAVING SILANE-BASED COMPOUND BOUND THERETO, POLYIMIDE FILM MANUFACTURED THEREOF, AND MANUFACTURING METHOD THEREFOR | 에스케이씨코오롱피아이 주식회사 | 2020-01-23 | — | — | WO | disclosed |
| WO-2020017692-A1 | POLYIMIDE FILM COMPRISING CLAY PARTICLES AND CARBON BLACK AND MANUFACTURING METHOD THEREFOR | 에스케이씨코오롱피아이 주식회사 | 2020-01-23 | — | — | WO | disclosed |
| CN-110709245-A | Laminate of polyimide film and inorganic substrate | 东洋纺株式会社 | 2020-01-17 | — | — | CN | disclosed |
| US-10508264-B2 | Cell culture method using bone marrow-like structure, and porous polyimide film for healing bone injury site | UBE INDUSTRIES, LTD. (JP) | 2019-12-17 | — | — | US | disclosed |
| US-10479974-B2 | Method, device and kit for mass cultivation of cells using polyimide porous membrane | UBE INDUSTRIES, LTD. (JP) | 2019-11-19 | — | — | US | disclosed |
| US-20190330581-A1 | CELL CULTIVATION MODULE | UBE CORPORATION (JP) | 2019-10-31 | — | — | US | disclosed |
| US-10450792-B2 | Glass panel unit | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2019-10-22 | — | — | US | disclosed |
| US-10443037-B2 | Long-term cell-cultivation using polyimide porous membrane and cell-cryopreservation method using polyimide porous membrane | UBE INDUSTRIES, LTD. (JP) | 2019-10-15 | — | — | US | disclosed |
| US-20190276788-A1 | CELL CULTIVATION DEVICE AND CELL CULTIVATION METHOD USING SAME | UBE INDUSTRIES, LTD. (JP) | 2019-09-12 | — | — | US | disclosed |
| US-20190270969-A1 | METHOD TO SUPPRESS DEDIFFERENTIATION OF CELLS THAT READILY DEDIFFERENTIATE, METHOD FOR PREPARING SAID CELLS, AND METHOD FOR PRODUCING SUBSTANCE | UBE CORPORATION (JP) | 2019-09-05 | — | — | US | disclosed |
| US-20190270956-A1 | MULTIPLE FLOW PATH CELL CULTIVATION METHOD | UBE INDUSTRIES, LTD. (JP) | 2019-09-05 | — | — | US | disclosed |
| US-20190269828-A1 | IMPLANT AND KIT FOR TREATMENT OF BONE LESION SITE, AS WELL AS METHOD FOR TREATING BONE LESION SITE | UBE INDUSTRIES, LTD. (JP) | 2019-09-05 | — | — | US | disclosed |
| US-20190270963-A1 | METHOD TO SUPPRESS STEM CELL DIFFERENTIATION, METHOD TO PREPARE STEM CELLS, AND METHOD TO INDUCE DIFFERENTIATION OF STEM CELLS | UBE INDUSTRIES, LTD. (JP) | 2019-09-05 | — | — | US | disclosed |
| US-20190264150-A1 | CELL CULTIVATION METHOD, SUSPENDED CELL ELIMINATION METHOD, AND METHOD TO KILL SUSPENDED CELLS | UBE INDUSTRIES, LTD. (JP) | 2019-08-29 | — | — | US | disclosed |
| US-20190264156-A1 | SIPHON TYPE CULTIVATION METHOD | UBE INDUSTRIES, LTD. (JP) | 2019-08-29 | — | — | US | disclosed |
| US-20190263997-A1 | POROUS POLYIMIDE FILM PRODUCTION METHOD AND POROUS POLYIMIDE FILM PRODUCED USING SAID METHOD | UBE INDUSTRIES, LTD. (JP) | 2019-08-29 | — | — | US | disclosed |
| US-20190249146-A1 | CELL PREPARATION METHOD, CELL CULTIVATION DEVICE, AND KIT | UBE CORPORATION (JP) | 2019-08-15 | — | — | US | disclosed |
| EP-3216823-B1 | RESIN-CONTAINING SHEET, AND STRUCTURE AND WIRING BOARD USING SAME | ASAHI CHEMICAL IND (JP) | 2019-08-14 | — | — | EP | disclosed |
| US-20190241854-A1 | CELL CULTIVATION DEVICE AND CELL CULTIVATION METHOD USING SAME | UBE INDUSTRIES, LTD. (JP) | 2019-08-08 | — | — | US | disclosed |
| CN-110050013-A | The manufacturing method of peeling layer | 日产化学株式会社 | 2019-07-23 | — | — | CN | disclosed |
| US-10344132-B2 | Epoxy resin composition, prepreg and fiber reinforced composite material | TORAY INDUSTRIES, INC. (JP) | 2019-07-09 | — | — | US | disclosed |
| EP-3493317-A1 | SOLID ELECTROLYTE COMPOSITION, SOLID-ELECTROLYTE-CONTAINING SHEET AND ALL-SOLID-STATE SECONDARY BATTERY, PRODUCTION METHOD FOR SOLID-ELECTROLYTE-CONTAINING SHEET AND ALL-SOLID-STATE SECONDARY BATTERY, SEGMENTED POLYMER, AND NON-AQUEOUS-SOLVENT DISPERSION OF POLYMER AND SEGMENTED POLYMER | Fujifilm Corporation (JP) | 2019-06-05 | — | — | EP | disclosed |
| EP-3489346-A1 | CELL CULTIVATION DEVICE AND CELL CULTIVATION METHOD USING SAME | UBE Industries, Ltd. (JP) | 2019-05-29 | — | — | EP | disclosed |
| EP-3489348-A1 | CELL CULTIVATION MODULE | UBE Industries, Ltd. (JP) | 2019-05-29 | — | — | EP | disclosed |
| EP-3489342-A1 | SIPHON TYPE CULTIVATION METHOD | UBE Industries, Ltd. (JP) | 2019-05-29 | — | — | EP | disclosed |
| EP-3489347-A1 | CELL CULTIVATION DEVICE AND CELL CULTIVATION METHOD USING SAME | UBE Industries, Ltd. (JP) | 2019-05-29 | — | — | EP | disclosed |
| EP-3489343-A1 | CELL PREPARATION METHOD, CELL CULTIVATION DEVICE, AND KIT | UBE Industries, Ltd. (JP) | 2019-05-29 | — | — | EP | disclosed |
| EP-3489291-A1 | POROUS POLYIMIDE FILM PRODUCTION METHOD AND POROUS POLYIMIDE FILM PRODUCED USING SAID METHOD | UBE Industries, Ltd. (JP) | 2019-05-29 | — | — | EP | disclosed |
| EP-3489351-A1 | CELL CULTIVATION METHOD, SUSPENDED CELL ELIMINATION METHOD, AND METHOD TO KILL SUSPENDED CELLS | UBE Industries, Ltd. (JP) | 2019-05-29 | — | — | EP | disclosed |
| EP-3488877-A1 | IMPLANT AND KIT FOR TREATMENT OF BONE LESION SITE, AS WELL AS METHOD FOR TREATING BONE LESION SITE | UBE Industries, Ltd. (JP) | 2019-05-29 | — | — | EP | disclosed |
| US-10304583-B2 | Insulating tape for covering, and method for producing structure | AGC Inc. (JP) | 2019-05-28 | — | — | US | disclosed |
| US-20190157710-A1 | SOLID ELECTROLYTE COMPOSITION, SOLID ELECTROLYTE-CONTAINING SHEET, ALL-SOLID STATE SECONDARY BATTERY, METHODS FOR MANUFACTURING SOLID ELECTROLYTE-CONTAINING SHEET AND ALL-SOLID STATE SECONDARY BATTERY, SEGMENTED POLYMER, AND NON-AQUEOUS SOLVENT DISPERSION OF POLYMER AND SEGMENTED POLYMER | FUJIFILM CORPORATION (JP) | 2019-05-23 | — | — | US | disclosed |
| US-20190134963-A1 | POLYIMIDE FILM LAYERED BODY | TOYOBO CO., LTD. (JP) | 2019-05-09 | — | — | US | disclosed |
| EP-3467039-A1 | DETACHABLE LAYER-FORMING COMPOSITION AND DETACHABLE LAYER | Nissan Chemical Corporation (JP) | 2019-04-10 | — | — | EP | disclosed |
| EP-3467040-A1 | DETACHABLE LAYER-FORMING COMPOSITION AND DETACHABLE LAYER | Nissan Chemical Corporation (JP) | 2019-04-10 | — | — | EP | disclosed |
| EP-2380732-B1 | LAMINATED BODY, MANUFACTURING METHOD THEREOF, AND LAMINATED CIRCUIT BOARD | TOYO BOSEKI (JP) | 2019-02-06 | — | — | EP | disclosed |
| US-20190031847-A1 | EPOXY RESIN COMPOSITION, PREPREG AND FIBER REINFORCED COMPOSITE MATERIAL | TORAY INDUSTRIES, INC. (JP) | 2019-01-31 | — | — | US | disclosed |
| EP-3117993-B1 | LAMINATED BODY, MANUFACTURING METHOD THEREOF, AND LAMINATED CIRCUIT BOARD | TOYO BOSEKI (JP) | 2019-01-30 | — | — | EP | disclosed |
| EP-3409706-A1 | EPOXY RESIN COMPOSITION, PREPREG AND FIBER REINFORCED COMPOSITE MATERIAL | Toray Industries, Inc. (JP) | 2018-12-05 | — | — | EP | disclosed |
| EP-3406705-A1 | CELL CULTURING METHOD AND KIT | Ube Industries, Ltd. (JP) | 2018-11-28 | — | — | EP | disclosed |
| EP-3406272-A1 | CELL CULTURE METHOD USING BONE MARROW-LIKE STRUCTURE, AND POROUS POLYMIDE FILM FOR HEALING BONE INJURY SITE | Ube Industries, Ltd. (JP) | 2018-11-28 | — | — | EP | disclosed |
| EP-3406707-A1 | LONG-TERM CELL-CULTIVATION USING POLYIMIDE POROUS MEMBRANE AND CELL-CRYOPRESERVATION METHOD USING POLYIMIDE POROUS MEMBRANE | Ube Industries, Ltd. (JP) | 2018-11-28 | — | — | EP | disclosed |
| EP-3406710-A1 | METHOD, DEVICE AND KIT FOR MASS CULTIVATION OF CELLS USING POLYIMIDE POROUS MEMBRANE | UBE Industries, Ltd. (JP) | 2018-11-28 | — | — | EP | disclosed |
| US-20180239242-A1 | PELLICLE FRAME, PELLICLE CONTAINING SAME, METHOD FOR PRODUCING PELLICLE FRAME, AND METHOD FOR PRODUCING PELLICLE | MITSUI CHEMICALS, INC. (JP) | 2018-08-23 | — | — | US | disclosed |
| US-20180241076-A1 | NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, LITHIUM ION SECONDARY BATTERY COMPRISING SAME, AND METHOD FOR PRODUCING NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY | MITSUI CHEMICALS, INC. (JP) | 2018-08-23 | — | — | US | disclosed |
| US-20180237750-A1 | CELL CULTURE METHOD USING BONE MARROW-LIKE STRUCTURE, AND POROUS POLYIMIDE FILM FOR HEALING BONE INJURY SITE | UBE CORPORATION (JP) | 2018-08-23 | — | — | US | disclosed |
| US-20180208887-A1 | LONG-TERM CELL-CULTIVATION USING POLYIMIDE POROUS MEMBRANE AND CELL-CRYOPRESERVATION METHOD USING POLYIMIDE POROUS MEMBRANE | UBE CORPORATION (JP) | 2018-07-26 | — | — | US | disclosed |
| EP-3339955-A1 | PELLICLE FRAME, PELLICLE CONTAINING SAME, METHOD FOR PRODUCING PELLICLE FRAME, AND METHOD FOR PRODUCING PELLICLE | Mitsui Chemicals, Inc. (JP) | 2018-06-27 | — | — | EP | disclosed |
| US-20180163174-A1 | METHOD, DEVICE AND KIT FOR MASS CULTIVATION OF CELLS USING POLYIMIDE POROUS MEMBRANE | UBE CORPORATION (JP) | 2018-06-14 | — | — | US | disclosed |
| EP-3333942-A1 | NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, LITHIUM ION SECONDARY BATTERY COMPRISING SAME, AND METHOD FOR PRODUCING NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY | Mitsui Chemicals, Inc. (JP) | 2018-06-13 | — | — | EP | disclosed |
| US-20180155679-A1 | CELL CULTURING METHOD AND KIT | UBE CORPORATION (JP) | 2018-06-07 | — | — | US | disclosed |
| EP-2865523-B1 | PROCESS FOR PRODUCING LAYERED PRODUCT AND LAYERED PRODUCT | TOYO BOSEKI (JP) | 2018-06-06 | — | — | EP | disclosed |
| US-20180148693-A1 | CELL CULTURE METHOD USING BONE MARROW-LIKE STRUCTURE, AND POLYIMIDE POROUS MEMBRANE FOR TREATING BONE DAMAGE SITE | UBE CORPORATION (JP) | 2018-05-31 | — | — | US | disclosed |
| EP-2498136-B1 | Intermediate transfer belt and image forming apparatus using the same | RICOH CO LTD (JP) | 2018-05-02 | — | — | EP | disclosed |
| US-9957390-B2 | Resin composition for pigment-containing insulating film, and use thereof | KANEKA CORPORATION (JP) | 2018-05-01 | — | — | US | disclosed |
| US-9902824-B2 | Colored polyimide molded article, and process for production thereof | UBE INDUSTRIES, LTD. (JP) | 2018-02-27 | — | — | US | disclosed |
| US-9895868-B2 | Method for producing layered product, layered product, method for producing layered product with device using said layered product, and layered product with device | TOYOBO CO., LTD. (JP) | 2018-02-20 | — | — | US | disclosed |
| US-20180016611-A1 | METHOD OF PRODUCING SUBSTANCE | UBE INDUSTRIES, LTD. (JP) | 2018-01-18 | — | — | US | disclosed |
| US-20180016547-A1 | METHOD, DEVICE AND KIT FOR MASS CULTIVATION OF CELLS USING POLYIMIDE POROUS MEMBRANE | UBE INDUSTRIES, LTD. (JP) | 2018-01-18 | — | — | US | disclosed |
| US-20180016542-A1 | METHOD FOR ISOLATING, REMOVING AND ANALYZING CELLS | UBE CORPORATION (JP) | 2018-01-18 | — | — | US | disclosed |
| EP-2487196-B1 | PROCESS FOR THE PRODUCTION OF A COLORED POLYIMIDE MOLDED ARTICLE | UBE INDUSTRIES (JP) | 2018-01-17 | — | — | EP | disclosed |
| US-9868933-B2 | Cell culturing method, cell culturing apparatus and kit comprising a porous polyimide film | UBE INDUSTRIES, LTD. (JP) | 2018-01-16 | — | — | US | disclosed |
| US-20180002659-A1 | CELL CULTURING METHOD AND KIT | UBE CORPORATION (JP) | 2018-01-04 | — | — | US | disclosed |
| US-20170369838-A1 | LONG-TERM CELL-CULTIVATION USING POLYIMIDE POROUS MEMBRANE AND CELL-CRYOPRESERVATION METHOD USING POLYIMIDE POROUS MEMBRANE | UBE CORPORATION (JP) | 2017-12-28 | — | — | US | disclosed |
| EP-2708958-B1 | INTERMEDIATE TRANSFER BELT AND A METHOD FOR PRODUCING THE SAME, AND IMAGE FORMING APPARATUS | RICOH CO LTD (JP) | 2017-12-20 | — | — | EP | disclosed |
| EP-3252141-A1 | CELL CULTURING METHOD AND KIT | UBE Industries, Ltd. (JP) | 2017-12-06 | — | — | EP | disclosed |
| EP-3252150-A1 | CELL CULTURE METHOD USING BONE MARROW-LIKE STRUCTURE, AND POLYIMIDE POROUS MEMBRANE FOR TREATING BONE DAMAGE SITE | UBE Industries, Ltd. (JP) | 2017-12-06 | — | — | EP | disclosed |
| EP-3252148-A1 | METHOD, DEVICE AND KIT FOR MASS CULTIVATION OF CELLS USING POLYIMIDE POROUS MEMBRANE | UBE Industries, Ltd. (JP) | 2017-12-06 | — | — | EP | disclosed |
| EP-3252163-A1 | METHOD OF PRODUCING SUBSTANCE | UBE Industries, Ltd. (JP) | 2017-12-06 | — | — | EP | disclosed |
| EP-3252145-A1 | LONG-TERM CELL-CULTIVATION USING POLYIMIDE POROUS MEMBRANE AND CELL-CRYOPRESERVATION METHOD USING POLYIMIDE POROUS MEMBRANE | UBE Industries, Ltd. (JP) | 2017-12-06 | — | — | EP | disclosed |
| EP-3252164-A1 | METHOD FOR ISOLATING, REMOVING AND ANALYZING CELLS | UBE Industries, Ltd. (JP) | 2017-12-06 | — | — | EP | disclosed |
| US-9835942-B2 | Photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2017-12-05 | — | — | US | disclosed |
| US-20170321471-A1 | GLASS PANEL UNIT | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2017-11-09 | — | — | US | disclosed |
| US-20170313831-A1 | RESIN-CONTAINING SHEET, AND STRUCTURE AND WIRING BOARD USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-11-02 | — | — | US | disclosed |
| EP-3231777-A1 | GLASS PANEL UNIT | Panasonic Intellectual Property Management Co., Ltd. (JP) | 2017-10-18 | — | — | EP | disclosed |
| US-9791808-B2 | Intermediate transfer belt, method for producing the same, and image forming apparatus | RICOH COMPANY, LTD. (JP) | 2017-10-17 | — | — | US | disclosed |
| US-20170288144-A1 | ALL SOLID STATE SECONDARY BATTERY, SOLID ELECTROLYTE COMPOSITION USED THEREFOR, ELECTRODE SHEET FOR BATTERY, AND METHOD FOR MANUFACTURING ELECTRODE SHEET FOR BATTERY AND ALL SOLID STATE SECONDARY BATTERY | FUJIFILM CORPORATION (JP) | 2017-10-05 | — | — | US | disclosed |
| EP-3216823-A1 | RESIN-CONTAINING SHEET, AND STRUCTURE AND WIRING BOARD USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-09-13 | — | — | EP | disclosed |
| US-9735429-B2 | Lithium ion secondary battery | HITACHI, LTD. (JP) | 2017-08-15 | — | — | US | disclosed |
| US-20170225433-A1 | POLYMER FILM COATED WITH A LAYER OF SILANE COUPLING AGENT | TOYOBO CO., LTD. (JP) | 2017-08-10 | — | — | US | disclosed |
| US-9723708-B2 | Conductive-layer-integrated flexible printed circuit board | KANEKA CORPORATION (JP) | 2017-08-01 | — | — | US | disclosed |
| EP-3187331-A1 | POLYMER FILM COATED WITH LAYER OF SILANE COUPLING AGENT | Toyobo Co., Ltd. (JP) | 2017-07-05 | — | — | EP | disclosed |
| US-9604391-B2 | Laminate, production method for same, and method of creating device structure using laminate | TOYOBO CO., LTD. (JP) | 2017-03-28 | — | — | US | disclosed |
| EP-2858150-B1 | LITHIUM ION SECONDARY BATTERY | HITACHI LTD (JP) | 2017-03-15 | — | — | EP | disclosed |
| US-20170037365-A1 | CELL CULTURING METHOD, CELL CULTURING APPARATUS AND KIT | UBE INDUSTRIES, LTD. (JP) | 2017-02-09 | — | — | US | disclosed |
| US-20170029766-A1 | CELL CULTURING METHOD, CELL CULTURING APPARATUS AND KIT | UBE INDUSTRIES, LTD. (JP) | 2017-02-02 | — | — | US | disclosed |
| US-9556312-B2 | Polyimide precursor, polyimide, polyimide film, polyimide metal laminate, and polyimide solution | NATIONAL UNIVERSITY CORPORATION IWATE UNIVERSITY (JP) | 2017-01-31 | — | — | US | disclosed |
| EP-3117993-A1 | LAMINATED BODY, MANUFACTURING METHOD THEREOF, AND LAMINATED CIRCUIT BOARD | Toyobo Co., Ltd. (JP) | 2017-01-18 | — | — | EP | disclosed |
| US-9511565-B2 | Polyimide precursor, polyimide, polyimide film, and method for manufacturing triazine compound used for manufacturing same | UBE INDUSTRIES, LTD. (JP) | 2016-12-06 | — | — | US | disclosed |
| US-20160242274-A1 | ADHESIVE FILM AND FLEXIBLE METAL LAMINATE | ASAHI GLASS COMPANY, LIMITED (JP) | 2016-08-18 | — | — | US | disclosed |
| US-20160221279-A1 | COLORED POLYIMIDE MOLDED ARTICLE, AND PROCESS FOR PRODUCTION THEREOF | UBE INDUSTRIES, LTD. (JP) | 2016-08-04 | — | — | US | disclosed |
| US-9394638-B2 | Polyimide nonwoven fabric and process for production thereof | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2016-07-19 | — | — | US | disclosed |
| US-9393720-B2 | Polyimide film and process for producing polyimide film | UBE INDUSTRIES, LTD. (JP) | 2016-07-19 | — | — | US | disclosed |
| US-20160204468-A1 | SOLID ELECTROLYTE COMPOSITION, BINDER FOR ALL-SOLID-STATE SECONDARY BATTERIES, AND ELECTRODE SHEET FOR BATTERIES AND ALL-SOLID-STATE SECONDARY BATTERY EACH USING SAID SOLID ELECTROLYTE COMPOSITION | FUJIFILM CORPORATION (JP) | 2016-07-14 | — | — | US | disclosed |
| US-9375877-B2 | Method for manufacturing polyimide metal laminate | UBE INDUSTRIES, LTD. (JP) | 2016-06-28 | — | — | US | disclosed |
| US-20160168560-A1 | CELL CULTURING METHOD, CELL CULTURING APPARATUS AND KIT | UBE CORPORATION (JP) | 2016-06-16 | — | — | US | disclosed |
| EP-3026108-A1 | CELL CULTURING METHOD, CELL CULTURING APPARATUS AND KIT | UBE Industries, Ltd. (JP) | 2016-06-01 | — | — | EP | disclosed |
| EP-2354180-B1 | POROUS POLYIMIDE MEMBRANE AND PROCESS FOR PRODUCTION OF SAME | UBE INDUSTRIES (JP) | 2016-05-25 | — | — | EP | disclosed |
| US-9346927-B2 | Colored polyimide molded article, and process for production thereof | UBE INDUSTRIES, LTD. (JP) | 2016-05-24 | — | — | US | disclosed |
| US-9342007-B2 | Polyimide seamless belt for image forming apparatus | RICOH COMPANY, LTD. (JP) | 2016-05-17 | — | — | US | disclosed |
| US-9332653-B2 | Resin composition for insulating film, and use thereof | KANEKA CORPORATION (JP) | 2016-05-03 | — | — | US | disclosed |
| EP-2357535-B1 | Intermediate transfer belt, method for producing the same, and image forming apparatus | RICOH CO LTD (JP) | 2016-03-30 | — | — | EP | disclosed |
| US-20160078979-A1 | INSULATING TAPE FOR COVERING, AND METHOD FOR PRODUCING STRUCTURE | ASAHI GLASS COMPANY, LIMITED (JP) | 2016-03-17 | — | — | US | disclosed |
| US-9267004-B2 | Polyimide precursor composition and use thereof | KANEKA CORPORATION (JP) | 2016-02-23 | — | — | US | disclosed |
| US-20160041513-A1 | POLYIMIDE SEAMLESS BELT FOR IMAGE FORMING APPARATUS | RICOH COMPANY, LTD. (JP) | 2016-02-11 | — | — | US | disclosed |
| US-9237645-B2 | Flexible printed circuit integrated with conductive layer | KANEKA CORPORATION (JP) | 2016-01-12 | — | — | US | disclosed |
| US-9229375-B2 | Intermediate transfer belt and method of preparing the same, and image forming apparatus | RICOH COMPANY, LTD. (JP) | 2016-01-05 | — | — | US | disclosed |
| US-9223256-B2 | Intermediate transfer belt method for producing intermediate transfer belt, and image forming apparatus | RICOH COMPANY, LTD. (JP) | 2015-12-29 | — | — | US | disclosed |
| US-9204528-B2 | Flexible printed circuit integrated with stiffener | KANEKA CORPORATION (JP) | 2015-12-01 | — | — | US | disclosed |
| US-9081276-B2 | Photosensitive resin composition production kit, and use thereof | KANEKA CORPORATION (JP) | 2015-07-14 | — | — | US | disclosed |
| US-20150195899-A1 | CONDUCTIVE-LAYER-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD | KANEKA CORPORATION (JP) | 2015-07-09 | — | — | US | disclosed |
| EP-2557110-B1 | POROUS POLYIMIDE MEMBRANE AND PROCESS FOR PRODUCTION THEREOF | UBE INDUSTRIES (JP) | 2015-06-17 | — | — | EP | disclosed |
| US-20150155563-A1 | LITHIUM ION SECONDARY BATTERY | HITACHI, LTD., (JP) | 2015-06-04 | — | — | US | disclosed |
| US-20150132591-A1 | POLYIMIDE PRECURSOR, POLYIMIDE, POLYIMIDE FILM, POLYIMIDE METAL LAMINATE, AND POLYIMIDE SOLUTION | UBE CORPORATION (JP) | 2015-05-14 | — | — | US | disclosed |
| US-20150125665-A1 | METHOD FOR PRODUCING LAYERED PRODUCT, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT WITH DEVICE USING SAID LAYERED PRODUCT, AND LAYERED PRODUCT WITH DEVICE | TOYOBO CO., LTD. (JP) | 2015-05-07 | — | — | US | disclosed |
| EP-2865523-A1 | PROCESS FOR PRODUCING LAYERED PRODUCT, LAYERED PRODUCT, PROCESS FOR PRODUCING LAYERED PRODUCT WITH DEVICE USING SAID LAYERED PRODUCT, AND LAYERED PRODUCT WITH DEVICE | Toyobo Co., Ltd. (JP) | 2015-04-29 | — | — | EP | disclosed |
| EP-2858150-A1 | LITHIUM ION SECONDARY BATTERY | Hitachi, Ltd. (JP) | 2015-04-08 | — | — | EP | disclosed |
| US-8980421-B2 | Porous polyimide membrane and process for production thereof | UBE INDUSTRIES, LTD. (JP) | 2015-03-17 | — | — | US | disclosed |
| US-8980409-B2 | Laminate, method for producing same, and method for producing device structure using same | TOYOBO CO., LTD. (JP) | 2015-03-17 | — | — | US | disclosed |
| US-20140370301-A1 | NOVEL RESIN COMPOSITION FOR PIGMENT-CONTAINING INSULATING FILM, AND USE THEREOF | KANEKA CORPORATION (JP) | 2014-12-18 | — | — | US | disclosed |
| US-20140363639-A1 | NOVEL RESIN COMPOSITION FOR INSULATING FILM, AND USE THEREOF | KANEKA CORPORATION (JP) | 2014-12-11 | — | — | US | disclosed |
| US-8889250-B2 | Plating target material, polyamic solution and polyimide resin solution which are used to form the plating target material, and printed-wiring board using them | KANEKA CORPORATION (JP) | 2014-11-18 | — | — | US | disclosed |
| CN-102481764-B | Glass/resin laminate and electronic device using same | ASAHI GLASS CO LTD | 2014-11-05 | — | — | CN | disclosed |
| EP-2037029-B1 | POLYIMIDE NONWOVEN FABRIC AND PROCESS FOR PRODUCTION THEREOF | TOYO BOSEKI (JP) | 2014-10-22 | — | — | EP | disclosed |
| US-20140290853-A1 | METHOD FOR MANUFACTURING POLYIMIDE METAL LAMINATE | UBE INDUSTRIES, LTD. (JP) | 2014-10-02 | — | — | US | disclosed |
| US-20140255710-A1 | POLYIMIDE PRECURSOR, POLYIMIDE, POLYIMIDE FILM, AND METHOD FOR MANUFACTURING TRIAZINE COMPOUND USED FOR MANUFACTURING SAME | NATIONAL UNIVERSITY CORPORATION IWATE UNIVERSITY (JP) | 2014-09-11 | — | — | US | disclosed |
| US-8828475-B2 | Image forming method | RICOH COMPANY, LTD. (JP) | 2014-09-09 | — | — | US | disclosed |
| US-20140248070-A1 | INTERMEDIATE TRANSFER BELT AND METHOD OF PREPARING THE SAME, AND IMAGE FORMING APPARATUS | RICOH COMPANY, LTD. (JP) | 2014-09-04 | — | — | US | disclosed |
| US-20140248069-A1 | IMAGE FORMING APPARATUS, AND METHOD OF PRODUCING BELT MEMBER USED IN THE APPARATUS | RICOH COMPANY, LTD. (JP) | 2014-09-04 | — | — | US | disclosed |
| US-8754186-B2 | Polyimide precursor composition, use thereof and production method thereof | KANEKA CORPORATION (JP) | 2014-06-17 | — | — | US | disclosed |
| US-8729402-B2 | Polyimide precursor composition, use of the of the same, and production method of the same | KANEKA CORPORATION (JP) | 2014-05-20 | — | — | US | disclosed |
| US-8718520-B2 | Intermediate transfer belt and image forming apparatus | RICOH COMPANY, LTD. (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20140079445-A1 | INTERMEDIATE TRANSFER BELT AND PRODUCING METHOD THE SAME, AND IMAGE FORMING APPARATUS | RICOH COMPANY, LTD. (JP) | 2014-03-20 | — | — | US | disclosed |
| EP-2708958-A1 | Intermediate transfer belt and producing method the same, and image forming apparatus | Ricoh Company, Ltd. (JP) | 2014-03-19 | — | — | EP | disclosed |
| US-20140054081-A1 | NOVEL FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH CONDUCTIVE LAYER | KANEKA CORPORATION (JP) | 2014-02-27 | — | — | US | disclosed |
| US-20140048314-A1 | FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH REINFORCING PLATE | KANEKA CORPORATION (JP) | 2014-02-20 | — | — | US | disclosed |
| US-20140041800-A1 | LAMINATE, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING DEVICE STRUCTURE USING SAME | TOYOBO CO., LTD. (JP) | 2014-02-13 | — | — | US | disclosed |
| US-20140042662-A1 | LAMINATE, PRODUCTION METHOD FOR SAME, AND METHOD OF CREATING DEVICE STRUCTURE USING LAMINATE | TOYOBO CO., LTD. (JP) | 2014-02-13 | — | — | US | disclosed |
| US-8609229-B2 | Glass/resin laminate, and electronic device using same | ASAHI GLASS COMPANY, LIMITED (JP) | 2013-12-17 | — | — | US | disclosed |
| US-20130288120-A1 | POLYIMIDE RESIN COMPOSITION AND LAMINATE INCLUDING POLYIMIDE RESIN COMPOSITION | MITSUI CHEMICALS INC. (JP) | 2013-10-31 | — | — | US | disclosed |
| US-20130264099-A1 | NOVEL PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF | KANEKA CORPORATION (JP) | 2013-10-10 | — | — | US | disclosed |
| US-8521073-B2 | Intermediate transfer member and image forming apparatus using the same | RICOH COMPANY, LTD. (JP) | 2013-08-27 | — | — | US | disclosed |
| US-8501874-B2 | Thermosetting resin composition, multilayer body using same, and circuit board | KANEKA CORPORATION (JP) | 2013-08-06 | — | — | US | disclosed |
| US-20130189624-A1 | NOVEL PHOTOSENSITIVE RESIN COMPOSITION PRODUCTION KIT, AND USE THEREOF | KANEKA CORPORATION (JP) | 2013-07-25 | — | — | US | disclosed |
| EP-2612879-A1 | POLYIMIDE RESIN COMPOSITION AND LAMINATE INCLUDING SAME | Mitsui Chemicals, Inc. (JP) | 2013-07-10 | — | — | EP | disclosed |
| US-8463165-B2 | Intermediate transfer belt, image forming method, for use in electrophotography | RICOH COMPANY, LTD. (JP) | 2013-06-11 | — | — | US | disclosed |
| US-8420211-B2 | Porous polyimide membrane and process for production of same | UBE INDUSTRIES, LTD. (JP) | 2013-04-16 | — | — | US | disclosed |
| US-20130045355-A1 | POROUS POLYIMIDE MEMBRANE AND PROCESS FOR PRODUCTION THEREOF | UBE INDUSTRIES, LTD (JP) | 2013-02-21 | — | — | US | disclosed |
| EP-2557110-A1 | POROUS POLYIMIDE MEMBRANE AND PROCESS FOR PRODUCTION THEREOF | Ube Industries, Ltd. (JP) | 2013-02-13 | — | — | EP | disclosed |
| US-20130004212-A1 | INTERMEDIATE TRANSFER BELT AND IMAGE FORMING APPARATUS | RICOH COMPANY, LTD. (JP) | 2013-01-03 | — | — | US | disclosed |
| EP-2535367-A1 | POLYIMIDE FILM, POLYIMIDE LAMINATE COMPRISING SAME, AND POLYIMIDE/METAL LAMINATE COMPRISING SAME | Ube Industries, Ltd. (JP) | 2012-12-19 | — | — | EP | disclosed |
| US-20120308816-A1 | POLYIMIDE FILM, POLYIMIDE LAMINATE COMPRISING SAME, AND POLYIMIDE/METAL LAMINATE COMPRISING SAME | UBE INDUSTRIES, LTD. (JP) | 2012-12-06 | — | — | US | disclosed |
| EP-2530103-A1 | POLYIMIDE RESIN COMPOSITION, ADHESIVE AGENT AND LAMINATE EACH COMPRISING SAME, AND DEVICE | Mitsui Chemicals, Inc. (JP) | 2012-12-05 | — | — | EP | disclosed |
| US-20120301718-A1 | METAL-RESIN COMPOSITE | MITSUI CHEMICALS, INC. (JP) | 2012-11-29 | — | — | US | disclosed |
| US-8314203-B2 | Polyimide film | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2012-11-20 | — | — | US | disclosed |
| CN-102741352-A | Metal-resin composite | MITSUI CHEMICALS INC | 2012-10-17 | — | — | CN | disclosed |
| US-20120244352-A1 | PROCESS FOR PRODUCING POLYIMIDE FILM, AND POLYIMIDE FILM | UBE INDUSTRIES, LTD. (JP) | 2012-09-27 | — | — | US | disclosed |
| US-20120230740-A1 | INTERMEDIATE TRANSFER BELT AND IMAGE FORMING APPARATUS USING THE SAME | RICOH COMPANY, LTD. (JP) | 2012-09-13 | — | — | US | disclosed |
| EP-2498136-A1 | Intermediate transfer belt and image forming apparatus using the same | Ricoh Company, Ltd. (JP) | 2012-09-12 | — | — | EP | disclosed |
| US-20120207999-A1 | COLORED POLYIMIDE MOLDED ARTICLE, AND PROCESS FOR PRODUCTION THEREOF | UBE INDUSTRIES, LTD. (JP) | 2012-08-16 | — | — | US | disclosed |
| EP-2487196-A1 | COLORED POLYIMIDE MOLDED ARTICLE, AND PROCESS FOR PRODUCTION THEREOF | Ube Industries, Ltd. (JP) | 2012-08-15 | — | — | EP | disclosed |
| US-20120177425-A1 | GLOSSY SURFACE FORMING APPARATUS AND GLOSSY SURFACE FORMING METHOD | KONICA MINOLTA BUSINESS TECHNOLOGIES, INC. (JP) | 2012-07-12 | — | — | US | disclosed |
| US-20120171454-A1 | GLASS/RESIN LAMINATE, AND ELECTRONIC DEVICE USING SAME | ASAHI GLASS COMPANY, LIMITED | 2012-07-05 | — | — | US | disclosed |
| US-20120156482-A1 | POLYMIDE FILM AND PROCESS FOR PRODUCING POLYIMIDE FILM | UBE INDUSTRIES, LTD. (JP) | 2012-06-21 | — | — | US | disclosed |
| US-8173229-B2 | Intermediate transfer medium, and image forming apparatus using the intermediate transfer medium | RICOH COMPANY, LTD. (JP) | 2012-05-08 | — | — | US | disclosed |
| US-20120082488-A1 | INTERMEDIATE TRANSFER MEMBER AND IMAGE FORMING APPARATUS USING THE SAME | RICOH COMPANY, LTD. (JP) | 2012-04-05 | — | — | US | disclosed |
| US-8093349-B2 | Terminally modified polybranched polyimide, metal-plated terminally modified polybranched polyimide, and method for producing the same | UBE INDUSTRIES, LTD. (JP) | 2012-01-10 | — | — | US | disclosed |
| US-20110318556-A1 | POROUS POLYIMIDE MEMBRANE AND PROCESS FOR PRODUCTION OF SAME | UBE INDUSTRIES, LTD. (JP) | 2011-12-29 | — | — | US | disclosed |
| EP-2380732-A1 | LAMINATED BODY, MANUFACTURING METHOD THEREOF, AND LAMINATED CIRCUIT BOARD | Toyo Boseki Kabushiki Kaisha (JP) | 2011-10-26 | — | — | EP | disclosed |
| EP-2357535-A1 | Intermediate transfer belt, method for producing the same, and image forming apparatus | Ricoh Company, Ltd (JP) | 2011-08-17 | — | — | EP | disclosed |
| EP-2354180-A1 | POROUS POLYIMIDE MEMBRANE AND PROCESS FOR PRODUCTION OF SAME | Ube Industries, Ltd. (JP) | 2011-08-10 | — | — | EP | disclosed |
| US-20110177238-A1 | INTERMEDIATE TRANSFER BELT, METHOD FOR PRODUCING THE SAME, AND IMAGE FORMING APPARATUS | RICOH COMPANY, LTD. (JP) | 2011-07-21 | — | — | US | disclosed |
| EP-1700874-B1 | CURABLE COMPOSITION | TOYO BOSEKI (JP) | 2011-05-25 | — | — | EP | disclosed |
| US-20110083884-A1 | NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF | KANEKA CORPORATION (JP) | 2011-04-14 | — | — | US | disclosed |
| US-20110061914-A1 | NOVEL POLYIMIDE PRECURSOR COMPOSITION, USE OF THE SAME, AND PRODUCTION METHOD OF THE SAME | KANEKA CORPORATION (JP) | 2011-03-17 | — | — | US | disclosed |
| US-20110052928-A1 | IMAGE FORMING METHOD | RICOH COMPANY, LTD. (JP) | 2011-03-03 | — | — | US | disclosed |
| US-20110042856-A1 | ELECTROPHOTOGRAPHIC INTERMEDIATE TRANSFER BELT AND METHOD FOR PRODUCING THE SAME, AND ELECTROPHOTOGRAPHIC APPARATUS | RICOH COMPANY, LTD. (JP) | 2011-02-24 | — | — | US | disclosed |
| US-20110003955-A1 | Imide Oligomer And Polyimide Resin Obtained By Thermal Curing Thereof | DAIWA CAN COMPANY (JP) | 2011-01-06 | — | — | US | disclosed |
| EP-2246383-A1 | IMIDE OLIGOMER AND POLYIMIDE RESIN OBTAINED BY THERMAL CURING THEREOF | DAIWA CAN COMPANY (JP) | 2010-11-03 | — | — | EP | disclosed |
| US-20100203324-A1 | LAMINATE OF HEAT RESISTANT FILM AND METAL FOIL, AND METHOD FOR PRODUCTION THEREOF | UBE INDUSTRIES, LTD. (JP) | 2010-08-12 | — | — | US | disclosed |
| US-20100196062-A1 | INTERMEDIATE TRANSFER BELT, IMAGE FORMING METHOD, AND IMAGE FORMING APPARATUS FOR USE IN ELECTROPHOTOGRAPHY | RICOH COMPANY, LTD. (JP) | 2010-08-05 | — | — | US | disclosed |
| US-20100178830-A1 | POLYIMIDE NONWOVEN FABRIC AND PROCESS FOR PRODUCTION THEREOF | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2010-07-15 | — | — | US | disclosed |
| US-20100132989-A1 | NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF | KANEKA CORPORATION (JP) | 2010-06-03 | — | — | US | disclosed |
| US-20100084171-A1 | NOVEL POLYIMIDE PRECURSOR COMPOSITION, USE THEREOF AND PRODUCTION METHOD THEREOF | KANEKA CORPORATION (JP) | 2010-04-08 | — | — | US | disclosed |
| US-20100009206-A1 | TERMINALLY MODIFIED POLYBRANCHED POLYIMIDE, METAL-PLATED TERMINALLY MODIFIED POLYBRANCHED POLYIMIDE, AND METHOD FOR PRODUCING THE SAME | UBE INDUSTRIES, LTD. (JP) | 2010-01-14 | — | — | US | disclosed |
| US-20090281267-A1 | Material for planting and use thereof | KANEKA CORPORATION (JP) | 2009-11-12 | — | — | US | disclosed |
| US-20090208258-A1 | INTERMEDIATE TRANSFER MEDIUM, AND IMAGE FORMING APPARATUS USING THE INTERMEDIATE TRANSFER MEDIUM | RICOH COMPANY, LTD. (JP) | 2009-08-20 | — | — | US | disclosed |
| US-7521511-B2 | Thermosetting resin composition, multilayer body using same, and circuit board | KANEKA CORPORATION (JP) | 2009-04-21 | — | — | US | disclosed |
| CN-100478719-C | Polymer photoconducting material | NITTO DENKO CORP (JP) | 2009-04-15 | — | — | CN | disclosed |
| EP-2037029-A1 | POLYIMIDE NONWOVEN FABRIC AND PROCESS FOR PRODUCTION THEREOF | Toyo Boseki Kabushiki Kaisha (JP) | 2009-03-18 | — | — | EP | disclosed |
| US-20090056981-A1 | THIN FILM-LAMINATED POLYIMIDE FILM AND FLEXIBLE PRINTED WIRING BOARD | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2009-03-05 | — | — | US | disclosed |
| US-20090056995-A1 | ADHESIVE SHEET, METAL-LAMINATED SHEET AND PRINTED WIRING BOARD | TOYO BOSEKI KABUSHIKI KASIHA (JP) | 2009-03-05 | — | — | US | disclosed |
| US-20080306220-A1 | Thermosetting Resin Composition, Multilayer Body Using Same, and Circuit Board | KANEKA CORPORATION (JP) | 2008-12-11 | — | — | US | disclosed |
| EP-1707590-B1 | POLYIMIDE FILM | TOYO BOSEKI (JP) | 2008-12-10 | — | — | EP | disclosed |
| US-20080268266-A1 | Polyimide Metal Laminate and Suspension for Hard Disk Using Same | MITSUI CHEMICALS, INC. (JP) | 2008-10-30 | — | — | US | disclosed |
| US-20080261060-A1 | PROCESS FOR PRODUCING POLYIMIDE FILM, AND POLYIMIDE FILM | UBE INDUSTRIES, LTD (JP) | 2008-10-23 | — | — | US | disclosed |
| US-20080230261-A1 | Thermosetting Resin Composition and Use Thereof | KANEKA CORPORATION (JP) | 2008-09-25 | — | — | US | disclosed |
| EP-1872940-A1 | ADHESIVE SHEET, METAL-LAMINATED SHEET AND PRINTED WIRING BOARD | Toyo Boseki Kabushiki Kasisha (JP) | 2008-01-02 | — | — | EP | disclosed |
| EP-1872941-A1 | THIN FILM-LAMINATED POLYIMIDE FILM AND FLEXIBLE PRINTED WIRING BOARD | Toyo Boseki Kabushiki Kasisha (JP) | 2008-01-02 | — | — | EP | disclosed |
| US-20070293588-A1 | Curable Composition | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2007-12-20 | — | — | US | disclosed |
| US-20070272124-A1 | Polyimide film | TOYO BOSEKI KABUSHIKI KAISHA (JP) | 2007-11-29 | — | — | US | disclosed |
| US-20070264490-A1 | Plating Target Material, Polyamic Solution And Polyimide Resin Solution Which Are Used To Form The Plating Target Material, And Printed-Wiring Board Using THem | KANEKA CORPORATION (JP) | 2007-11-15 | — | — | US | disclosed |
| US-7215912-B2 | Intermediate transfer medium and image forming apparatus using the intermediate transfer medium | RICOH COMPANY LIMITED (JP) | 2007-05-08 | — | — | US | disclosed |
| US-7160949-B2 | Olefin block copolymers, processes for producing the same and uses thereof | MITSUI CHEMICALS, INC. (JP) | 2007-01-09 | — | — | US | disclosed |
| EP-1707590-A1 | POLYIMIDE FILM | Toyo Boseki Kabushiki Kaisha (JP) | 2006-10-04 | — | — | EP | disclosed |
| US-7115681-B2 | polyimide resin and a thermosetting resin; can be bonded and cured at a comparatively low temperature, is soluble in a solvent and has excellent heat resistance and adhesion | KANEKA CORPORATION (JP) | 2006-10-03 | — | — | US | disclosed |
| US-20060205891-A1 | Thermosetting resin composition, multilayer body using same, and circuit board | KANEKA CORPORATION (JP) | 2006-09-14 | — | — | US | disclosed |
| EP-1700874-A1 | CURABLE COMPOSITION | Toyo Boseki Kabushiki Kaisha (JP) | 2006-09-13 | — | — | EP | disclosed |
| US-20060127685-A1 | Layered polyimide/metal product | MITSUI CHEMICALS, INC. (JP) | 2006-06-15 | — | — | US | disclosed |
| US-20050207800-A1 | Intermediate transfer medium and image forming apparatus using the intermediate transfer medium | RICOH COMPANY LIMITED (JP) | 2005-09-22 | — | — | US | disclosed |
| US-6933411-B2 | Aromatic diamine and polyimide thereof | MITSUI CHEMICALS, INC. (JP) | 2005-08-23 | — | — | US | disclosed |
| EP-1275670-B1 | OLEFIN BLOCK COPOLYMERS, PRODUCTION PROCESSES OF THE SAME AND USE THEREOF | MITSUI CHEMICALS INC (JP) | 2005-08-10 | — | — | EP | disclosed |
| US-20050136245-A1 | Intermediate transfer medium, film forming liquid for the intermediate transfer medium and image forming apparatus using intermediate transfer medium | RICOH COMPANY LIMITED (JP) | 2005-06-23 | — | — | US | disclosed |
| US-6842576-B2 | Polymer lightguide | NITTO DENKO CORPORATION (JP) | 2005-01-11 | — | — | US | disclosed |
| CN-1550801-A | Polymer photoconducting material | 日东电工株式会社 | 2004-12-01 | — | — | CN | disclosed |
| US-20040234228-A1 | Polymer lightguide | NITTO DENKO CORPORATION | 2004-11-25 | — | — | US | disclosed |
| US-6737503-B2 | LOW TEMPERATURE ADHESIVE BONDING | MITSUI CHEMICALS, INC. (JP) | 2004-05-18 | — | — | US | disclosed |
| US-20040082754-A1 | Novel aromatic diamine and polyimide thereof | MITSUI CHEMICALS, INC. (JP) | 2004-04-29 | — | — | US | disclosed |
| US-20030092870-A1 | Novel aromatic diamine and polyimide thereof | MITSUI CHEMICALS, INC. (JP) | 2003-05-15 | — | — | US | disclosed |
| US-20030055179-A1 | Olefin block copolymers processes for producing the same and uses thereof | MITSUI CHEMICALS, INC. (JP) | 2003-03-20 | — | — | US | disclosed |
| EP-1288191-A2 | Novel aromatic diamine and polyimide thereof | Mitsui Chemicals, Inc. (JP) | 2003-03-05 | — | — | EP | disclosed |
| EP-1275670-A1 | OLEFIN BLOCK COPOLYMERS, PRODUCTION PROCESSES OF THE SAME AND USE THEREOF | Mitsui Chemicals, Inc. (JP) | 2003-01-15 | — | — | EP | disclosed |
| EP-0738746-B1 | Liquid crystal polyamide-imide copolymer | MITSUI CHEMICALS INC (JP) | 2002-07-24 | — | — | EP | disclosed |
| EP-0518571-B1 | Favorably processable polyimide and process for preparing polyimide | MITSUI CHEMICALS INC (JP) | 2002-01-23 | — | — | EP | disclosed |
| US-6307008-B1 | CYCLIC TETRAACIDS WITH AROMATIC DIAMINES AS ADHESIVES FOR SEMICONDUCTORS AND ADHESIVES | SAEHAN INDUSTRIES CORPORATION (KR) | 2001-10-23 | — | — | US | disclosed |
| EP-0769512-B1 | Process for preparing polycondensation polymers using haloiminium salts as condensation agents | MITSUI CHEMICALS INC (JP) | 2001-07-18 | — | — | EP | disclosed |
| EP-0693518-B1 | Readily processable polyimide and preparation process of the same | MITSUI CHEMICALS INC (JP) | 2001-04-11 | — | — | EP | disclosed |
| US-6103860-A | LOW DIELECTRIC CONSTANT, EXCELLENT TRANSPARENCY, LOW HYGROSCOPICITY AND EXCELLENT PROCESSABILITY; SUBSTRATE FOR AN OPTICAL DISK, A PICK-UP LENS, A PLASTIC SUBSTRATE FOR A LIQUID CELL AND A PRISM | MITSUI CHEMICALS, INC. (JP) | 2000-08-15 | — | — | US | disclosed |
| US-6080833-A | BIS(HYDROXYALKOXYLATED) 1,1'-SPIROBIINDAN POLYCARBONATES AND POLYESTERS POLYMERS AND CURABLE COMPOUNDS SUCH AS BIS(ACRYLATED ALKOXY)SPIROBIINDANS; ALSO POLYAMIDES AND POLYIMIDES CONTAINING SPIROBIINDAN GROUPS | MITSUI CHEMICALS, INC. (JP) | 2000-06-27 | — | — | US | disclosed |
| EP-0661347-B1 | Polyimide resin composition having excellent fatigue resistance and injection molded article of same | MITSUI CHEMICALS INC (JP) | 2000-03-08 | — | — | EP | disclosed |
| US-5990261-A | Organic optical component | MITSUI CHEMICALS, INC. (JP) | 1999-11-23 | — | — | US | disclosed |
| EP-0605112-B1 | Use of an insulating adhesive tape, lead frame and semiconductor device employing the tape | MITSUI CHEMICALS INC (JP) | 1999-03-17 | — | — | EP | disclosed |
| US-5821319-A | COMPRISING STRUCTURAL UNITS DERIVED FROM PYROMELLITIC ANHYDRIDE, TEREPHTHALOYL CHLORIDE, 1,3-BIS/4-(4-AMINOPHENOXY)-ALPHA,ALPHA-DIMETHYLBENZYL/BENZENE | MITSUI CHEMICALS, INC. (JP) | 1998-10-13 | — | — | US | disclosed |
| EP-0633294-B1 | Polyimide based resin composition | MITSUI CHEMICALS INC (JP) | 1998-06-10 | — | — | EP | disclosed |
| EP-0826717-A1 | An organic optical component | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1998-03-04 | — | — | EP | disclosed |
| US-5719256-A | CONDENSING CARBOXYL GROUP CONTAINING COMPOUND AND ACTIVE HYDROGEN CONTAINING COMPOUND IN PRESENCE OF HALOIMINIUM SALT AS POLYMERIZATION CATALYST | MITSU TOATSU CHEMICALS, INC. (JP) | 1998-02-17 | — | — | US | disclosed |
| EP-0822545-A2 | Optical component and spirobiindan polymer therefor | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1998-02-04 | — | — | EP | disclosed |
| US-5710334-A | PENDANT ETHER GROUPS, POLYIMIDES WITH IMPROVED SOLUBILITY, MELT FLOW STABILITY, PROCESSABILITY | MITSUI TOATSU CHEMICALS, INC. (JP) | 1998-01-20 | — | — | US | disclosed |
| EP-0812885-A2 | Polyimide based resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1997-12-17 | — | — | EP | disclosed |
| EP-0636661-B1 | Polyimide resin composition | MITSUI TOATSU CHEMICALS (JP) | 1997-11-05 | — | — | EP | disclosed |
| EP-0572196-B1 | Polyimide, and preparation process of same | MITSUI TOATSU CHEMICALS (JP) | 1997-08-06 | — | — | EP | disclosed |
| EP-0459801-B1 | Readily processable polyimide and preparation process of same | MITSUI TOATSU CHEMICALS (JP) | 1997-08-06 | — | — | EP | disclosed |
| EP-0565352-B1 | Aromatic diamine and polyimide, and preparation process of same | MITSUI TOATSU CHEMICALS (JP) | 1997-07-30 | — | — | EP | disclosed |
| US-5650463-A | Carbon fiber-reinforced polimide resin composition | MITSUI TOATSU CHEMICALS, INC. (JP) | 1997-07-22 | — | — | US | disclosed |
| EP-0769512-A2 | Process for preparing polycondensation polymers | MITSUI TOATSU CHEMICALS, INC. (JP) | 1997-04-23 | — | — | EP | disclosed |
| EP-0518543-B1 | Polyimide and process for the preparation thereof | MITSUI TOATSU CHEMICALS (JP) | 1997-03-12 | — | — | EP | disclosed |
| EP-0751168-A1 | Linear polyamic acid, linear polyimide and thermoset polyimide | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1997-01-02 | — | — | EP | disclosed |
| US-5571875-A | BLEND WITH FLUOROPOLYMER, GRAPHITE, POLYAMIDE AND LIQUID CRYSTAL POLYMER | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-11-05 | — | — | US | disclosed |
| EP-0738746-A1 | Liquid crystal polyamide-imide copolymer | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1996-10-23 | — | — | EP | disclosed |
| US-5554765-A | HEAT RESISTANCE | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-09-10 | — | — | US | disclosed |
| EP-0728792-A2 | Heat-resistant adhesive and method of adhesion by using adhesive | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1996-08-28 | — | — | EP | disclosed |
| EP-0462282-B1 | POLYIMIDE MOLDING | MITSUI TOATSU CHEMICALS (JP) | 1996-06-26 | — | — | EP | disclosed |
| US-5516837-A | FLUOROPOLYMER, CARBON FIBERS, AROMATIC POLYESTER LIQUID CRYSTAL POLYMER | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-05-14 | — | — | US | disclosed |
| US-5514748-A | POLYMER FOR SLIDING CONTAINING PHENOLIC RESINS AND LUBRICANTS WITH POLYIMIDES | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-05-07 | — | — | US | disclosed |
| US-5506291-A | FORMED BY REACTING ONE OR MORE DIAMINES WITH PYROMLLITIC ACID OR BIPHENYLTETRACARBOXYLIC ACID/3,3',4,4'-/ AND ENDCAPPED BY ANHYDRIDE OR AROMATIC MONOAMINE; USED FOR ELECTRONICS, AIRCRAFT, AND ELECTRICAL APPLIANCES | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-04-09 | — | — | US | disclosed |
| EP-0430640-B1 | Polyimide based resin composition | MITSUI TOATSU CHEMICALS (JP) | 1996-03-27 | — | — | EP | disclosed |
| EP-0523240-B1 | BISIMIDE COMPOUNDS, POLYIMIDE RESIN COMPOSITION PREPARED THEREFROM, AND CARBON FIBER-REINFORCED POLYIMIDE RESIN COMPOSITION | MITSUI TOATSU CHEMICALS (JP) | 1996-03-20 | — | — | EP | disclosed |
| US-5494996-A | MELT PROCESSABILITY, HEAT AND AGING RESISTANCE | MITSUI TOATSU CHEMICALS INC. (JP) | 1996-02-27 | — | — | US | disclosed |
| EP-0474501-B1 | Aromatic diamine compound, preparation process of same and polyimide prepared from same | MITSUI TOATSU CHEMICALS (JP) | 1996-02-14 | — | — | EP | disclosed |
| EP-0693518-A2 | Readily processable polyimide and preparation process of the same | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1996-01-24 | — | — | EP | disclosed |
| US-5480965-A | BASED ON A NOVEL DIAMINO COMPOUND DERIVED FROM BENZOPHENONE STRUCTURE; FIBER REINFORCEMENT | MITSUI TOATSU CHEMICALS, INC. (JP) | 1996-01-02 | — | — | US | disclosed |
| US-5459233-A | High temperature engineering aromatic polyimides | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1995-10-17 | — | — | US | disclosed |
| US-5457154-A | Melt processability | MITSUI TOATSU CHEMICALS, INC. (JP) | 1995-10-10 | — | — | US | disclosed |
| EP-0661347-A1 | Polyimide resin composition having excellent fatigue resistance and injection molded article of same | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1995-07-05 | — | — | EP | disclosed |
| US-5406124-A | Thermoplastic polyimides | MITSUI TOATSU CHEMICALS, INC. (JP) | 1995-04-11 | — | — | US | disclosed |
| EP-0639621-A2 | Polyimide-based resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1995-02-22 | — | — | EP | disclosed |
| EP-0636661-A1 | Polyimide resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1995-02-01 | — | — | EP | disclosed |
| EP-0431789-B1 | Preparation process of polyimide | MITSUI TOATSU CHEMICALS (JP) | 1995-01-25 | — | — | EP | disclosed |
| EP-0633294-A2 | Polyimide based resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1995-01-11 | — | — | EP | disclosed |
| US-5380820-A | Heat resistance | MITSUI TOATSU CHEMICALS, INC. (JP) | 1995-01-10 | — | — | US | disclosed |
| US-5371168-A | From 3,3',4,4',benzophenonetetracarboxylic acid and 3,3'-diaminobenzophenone with phthalic anhydride end groups; high tensile shear adhesive strength | MITSUI TOATSU CHEMICALS, INC. (JP) | 1994-12-06 | — | — | US | disclosed |
| US-5354839-A | Low dielectric constant, colorless, transparent and excellent in processability and heat resistance | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1994-10-11 | — | — | US | disclosed |
| US-5354890-A | Aromatic diamine intermediates useful in the preparation of polyimides | MITSUI TOATSU CHEMICALS, INC. (JP) | 1994-10-11 | — | — | US | disclosed |
| EP-0367482-B1 | Polyimides and process for the preparation thereof | MITSUI TOATSU CHEMICALS (JP) | 1994-09-21 | — | — | EP | disclosed |
| EP-0430430-B1 | Polyimide | MITSUI TOATSU CHEMICALS (JP) | 1994-09-21 | — | — | EP | disclosed |
| EP-0605112-A2 | Insulating adhesive tape, and lead frame and semiconductor device employing the tape | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1994-07-06 | — | — | EP | disclosed |
| US-5312866-A | Contains polyether ketone resin and/or polyester which forms anisotropic molten phase; additional polyimide compositions containing carbon fiber reinforcement, potassium titanate fiber or crystallization accelerator | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1994-05-17 | — | — | US | disclosed |
| US-5300620-A | Polyamic acids and/or polyimides are blocked with aromatic amine; performing adhesion under low temperature, low pressure | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1994-04-05 | — | — | US | disclosed |
| US-5288843-A | Polymerizing 4,4'-bis(3-aminophenoxy)biphenyl, pyromellitic dianhydride and a different aromaticdiamine; engineering plastics; molding mateials; aerospace; heat resistance; melt processibility | MITSUI TOATSU CHEMICALS, INC. (JP) | 1994-02-22 | — | — | US | disclosed |
| US-5286840-A | Reacting in presence of a dicarboxylic acid anhydride | MITSUI TOATSU CHEMICALS, INC. (JP) | 1994-02-15 | — | — | US | disclosed |
| US-5283313-A | Blocked with dicarboxylic acid anhydride | MITSUI TOATSU CHEMICALS, INC. (JP) | 1994-02-01 | — | — | US | disclosed |
| US-5276133-A | Heat resistant, dimensionaly stable polymers for molding materials used in electronics | MITSUI TOATSU CHEMICALS, INC. (JP) | 1994-01-04 | — | — | US | disclosed |
| US-5268446-A | Melt processable; end blocked with phthalic anhydride | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1993-12-07 | — | — | US | disclosed |
| US-5268447-A | End blocked with phthalic anhydride | MITSUI TOATSU CHEMICALS, INC. (JP) | 1993-12-07 | — | — | US | disclosed |
| EP-0572196-A1 | Polyimide, and preparation process of same | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-12-01 | — | — | EP | disclosed |
| EP-0294195-B1 | Polyimide resin composition | MITSUI TOATSU CHEMICALS (JP) | 1993-11-24 | — | — | EP | disclosed |
| US-5260388-A | Reacting aromatic diamine with tetracarboxylic anhydride in presence of aromatic dicarboxylic anhydride or monoamine, imidizing; low dielectric characteristics; electronics | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1993-11-09 | — | — | US | disclosed |
| EP-0565352-A2 | Aromatic diamine and polyimde, and preparation process of same | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-10-13 | — | — | EP | disclosed |
| US-5252700-A | Polyamic acid or polyimide endblocked with aromatic dicarboxylic anhydrides | MITSUI TOATSU CHEMICALS, INC. (JP) | 1993-10-12 | — | — | US | disclosed |
| US-5231160-A | AROMATIC DIAMINE COMPOUND, PREPARATION PROCESS OF SAME AND POLYIMIDE PREPARED FROM SAME | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1993-07-27 | — | — | US | disclosed |
| US-5210174-A | Solution polymerization of diamine with tetracarboxylic acid | MITSUI TOATSU CHEMICALS, INC. (JP) | 1993-05-11 | — | — | US | disclosed |
| US-5196506-A | Heat resistance | MITSUI TOATSU CHEMICALS, INC. (JP) | 1993-03-23 | — | — | US | disclosed |
| EP-0523240-A1 | BISIMIDE COMPOUNDS, POLYIMIDE RESIN COMPOSITION PREPARED THEREFROM, AND CARBON FIBER-REINFORCED POLYIMIDE RESIN COMPOSITION | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-01-20 | — | — | EP | disclosed |
| EP-0519634-A2 | Amorphous polyimide powder, preparation process of the powder, and heat-resistant adhesive and bonding method by use of the powder | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1992-12-23 | — | — | EP | disclosed |
| EP-0518571-A2 | Favorably processable polyimide and process for preparing polyimide | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1992-12-16 | — | — | EP | disclosed |
| EP-0518543-A2 | Polyimide and process for the preparation thereof | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1992-12-16 | — | — | EP | disclosed |
| EP-0511813-A2 | Heat-resistant adhesive and method of adhesion by using adhesive | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1992-11-04 | — | — | EP | disclosed |
| EP-0488630-A2 | Thermally stable polyimide and preparation process of polyimide | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1992-06-03 | — | — | EP | disclosed |
| EP-0488604-A2 | Readily processable polyimide, preparation process of polyimide, and resin composition of polyimide | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1992-06-03 | — | — | EP | disclosed |
| EP-0474501-A1 | Aromatic diamine compound, preparation process of same and polyimide prepared from same | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1992-03-11 | — | — | EP | disclosed |
| EP-0462282-A1 | POLYIMIDE MOLDING | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1991-12-27 | — | — | EP | disclosed |
| EP-0459801-A2 | Readily processable polyimide and preparation process of same | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1991-12-04 | — | — | EP | disclosed |
| US-5041520-A | Process for preparing polyimide having excellent high temperature stability | MITSUI TOATSU CHEMICALS, INC. (JP) | 1991-08-20 | — | — | US | disclosed |
| EP-0431789-A2 | Preparation process of polyimide | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1991-06-12 | — | — | EP | disclosed |
| EP-0430430-A2 | Polyimide | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1991-06-05 | — | — | EP | disclosed |
| EP-0430640-A1 | Polyimide based resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1991-06-05 | — | — | EP | disclosed |
| US-4931531-A | WORKABILITY, SOLVENT RESISTANCE, NONABSORBENT, TRANSPARENT | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1990-06-05 | — | — | US | disclosed |
| EP-0367482-A1 | Polyimides and process for the preparation thereof | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1990-05-09 | — | — | EP | disclosed |
| EP-0350203-A2 | Process for preparing polyimide having excellent high temperature stability | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1990-01-10 | — | — | EP | disclosed |
| EP-0297808-A1 | Polyimide and high-temperature adhesive thereof | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1989-01-04 | — | — | EP | disclosed |
| EP-0294195-A2 | Polyimide resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1988-12-07 | — | — | EP | disclosed |
| EP-0294195-A2 | Polyimide resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1988-12-07 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20030092870-A1 | Novel aromatic diamine and polyimide thereof | DDT, AOC1, H1-4 | CYP3A4 857/4885CASP1 1401/4885RECQL 1211/4885 |
| US-20110003955-A1 | Imide Oligomer And Polyimide Resin Obtained By Thermal Curing Thereof | PUF60, SMARCC2, SMARCA4 | CYP3A4 2757/4885CASP1 2277/4885RECQL 2539/4885 |
| US-20140255710-A1 | POLYIMIDE PRECURSOR, POLYIMIDE, POLYIMIDE FILM, AND METHOD FOR MANUFACTURING TRIAZINE COMPOUND USED FOR MANUFACTURING SAME | F12, TERB1, PBRM1 | CYP3A4 1175/4885CASP1 3004/4885RECQL 3913/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.