SCHEMBL143288

SCHEMBL143288

Nc1cccc([S+]([O-])c2cccc(N)c2)c1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 2/20 0.52
CASP1 P29466 1/20 0.52
RECQL P46063 1/20 0.52
ALDH1A1 P00352 5/20 0.42
CA12 O43570 2/20 0.42
CA1 P00915 2/20 0.42
CA2 P00918 2/20 0.42
CA9 Q16790 2/20 0.42
TDP1 Q9NUW8 2/20 0.42
CA14 Q9ULX7 2/20 0.42
CA7 P43166 1/20 0.42
MAOA P21397 3/20 0.41
MAP4K4 O95819 1/20 0.39
LMNA P02545 2/20 0.38
KDM4E B2RXH2 2/20 0.38
TSHR P16473 1/20 0.38
MAPK1 P28482 1/20 0.38
ENPP2 Q13822 1/20 0.38
MEN1 O00255 2/20 0.38
PSIP1 O75475 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL310261 0.91 CYP3A4 (0.44) CYP3A4CASP1RECQLALDH1A1CA12
SCHEMBL13591681 0.83 CYP3A4 (0.50) CYP3A4CASP1RECQLALDH1A1CA12
SCHEMBL9246793 0.82 MAOB (0.60) CYP3A4CASP1RECQLALDH1A1TSHR
SCHEMBL9301864 0.81 CYP3A4 (0.48) CYP3A4CASP1RECQLALDH1A1CA12
SCHEMBL487319 0.81 CYP3A4 (0.48) CYP3A4CASP1RECQLALDH1A1CA12
SCHEMBL13513756 0.81 CYP3A4 (0.48) CYP3A4CASP1RECQLALDH1A1CA12
Hydrochloric Acid SCHEMBL5187735 0.77 NFE2L2 (0.44) MAOAMAOBMAPTGFERCYP19A1
SCHEMBL22964657 0.76 CYP3A4 (0.42) CYP3A4CASP1RECQLALDH1A1CA12
SCHEMBL4282024 0.76 TSHR (0.45) CYP3A4CASP1RECQLALDH1A1CA12
SCHEMBL29446069 0.76 CYP3A4 (0.42) CYP3A4CASP1RECQLALDH1A1CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 679 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240218126-A1 POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF PI ADVANCED MATERIALS CO., LTD. (KR) 2024-07-04 US claimed
EP-4393981-A1 POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF PI Advanced Materials Co., Ltd. (KR) 2024-07-03 EP claimed
WO-2024117669-A1 POLYIMIDE VARNISH FOR COATING CONDUCTOR WITH IMPROVED HEAT DISSIPATION FOR COATING CONDUCTOR AND POLYIMIDE COATING MATERIAL COMPRISING THE SAME PI ADVANCED MATERIALS CO., LTD. (KR) 2024-06-06 WO claimed
WO-2024112104-A1 POLYIMIDE FILM COMPRISING ADDITIVE AND GRAPHITE SHEET PREPARED BY USING SAME PI ADVANCED MATERIALS CO., LTD. (KR) 2024-05-30 WO claimed
WO-2024076094-A1 BLACK POLYIMIDE FILM AND THE MANUFACTURING METHOD THEREOF PI ADVANCED MATERIALS CO., LTD. (KR) 2024-04-11 WO claimed
US-20240026098-A1 POLYIMIDE FILM HAVING HIGH DIMENSIONAL STABILITY AND MANUFACTURING METHOD THEREFOR PI ADVANCED MATERIALS CO., LTD. (KR) 2024-01-25 US claimed
WO-2024005508-A1 SELF-LUBRICATING POLYIMIDE VARNISH AND POLYIMIDE COATING PREPARED THEREFROM 피아이첨단소재 주식회사 2024-01-04 WO claimed
WO-2023243967-A1 BLACK POLYIMIDE FILM AND MANUFACTURING METHOD THEREOF PI ADVANCED MATERIALS CO., LTD. (KR) 2023-12-21 WO claimed
WO-2023200191-A1 MANUFACTURING METHOD OF POLYIMIDE POWDER AND POLYIMIDE POWDER MANUFACTURED BY THE SAME PI ADVANCED MATERIALS CO., LTD. (KR) 2023-10-19 WO claimed
WO-2023191434-A1 POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR 피아이첨단소재 주식회사 2023-10-05 WO claimed
CN-112955497-A Ultrathin polyimide film with improved dimensional stability and preparation method thereof 聚酰亚胺先端材料有限公司 2021-06-11 CN claimed
CN-112585195-A Polyimide film having improved alkali resistance and method for preparing the same 聚酰亚胺先端材料有限公司 2021-03-30 CN claimed
WO-2020040347-A1 POLYIMIDE FILM HAVING IMPROVED ALKALI RESISTANCE AND METHOD FOR MANUFACTURING SAME 에스케이씨코오롱피아이 주식회사 2020-02-27 WO claimed
US-20180066110-A1 NOVEL POLYAMIDEIMIDE HAVING LOW THERMAL EXPANSION COEFFICIENT KOREA ADVANCED INST SCI & TECH (KR) 2018-03-08 US claimed
US-20160194449-A1 NOVEL POLYAMIDEIMIDE HAVING LOW THERMAL EXPANSION COEFFICIENT KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2016-07-07 US claimed
EP-2940015-A1 NOVEL POLYAMIDEIMIDE HAVING LOW THERMAL EXPANSION COEFFICIENT Korea Advanced Institute of Science and Technology (KR) 2015-11-04 EP claimed
US-20150045481-A1 Asymmetric Diamine Compounds Containing Two Functional Groups and Polymers Therefrom KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2015-02-12 US claimed
WO-1996001862-A1 METHODS FOR THE PREPARATION OF INHERENTLY METAL BINDING POLY-AMINE-QUINONE POLYMERS ERHAN SEMIH (US) 1996-01-25 WO claimed
US-5288843-A Polymerizing 4,4'-bis(3-aminophenoxy)biphenyl, pyromellitic dianhydride and a different aromaticdiamine; engineering plastics; molding mateials; aerospace; heat resistance; melt processibility MITSUI TOATSU CHEMICALS, INC. (JP) 1994-02-22 US claimed
EP-0202259-B1 SILOXANE-CONTAINING POLYMERS NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION (US) 1990-07-18 EP claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20150045481-A1 Asymmetric Diamine Compounds Containing Two Functional Groups and Polymers Therefrom AOC1, INMT, PRMT6 CYP3A4 4558/4885CASP1 4288/4885RECQL 2125/4885
US-20180066110-A1 NOVEL POLYAMIDEIMIDE HAVING LOW THERMAL EXPANSION COEFFICIENT RICTOR, SGTA, SLC43A1 CYP3A4 4322/4885CASP1 4157/4885RECQL 2611/4885
US-20160194449-A1 NOVEL POLYAMIDEIMIDE HAVING LOW THERMAL EXPANSION COEFFICIENT SGTA, RICTOR, SLC43A1 CYP3A4 4328/4885CASP1 4317/4885RECQL 2057/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.