SCHEMBL31028355

SCHEMBL31028355

CCO[Si](CCCNC=O)(OCC)OC(C)Cc1ccccc1

nearest known ligand 0.40

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 2/20 0.40
KMT2A Q03164 2/20 0.40
TAAR1 Q96RJ0 1/20 0.40
ADH1B P00325 1/20 0.39
ADH1C P00326 1/20 0.39
ADH1A P07327 1/20 0.39
ADH7 P40394 1/20 0.39
CTSK P43235 2/20 0.37
ALDH1A1 P00352 2/20 0.37
CTSL P07711 1/20 0.37
CTSB P07858 1/20 0.37
CTSH P09668 1/20 0.37
CYP3A4 P08684 2/20 0.36
TSHR P16473 2/20 0.36
EPHX1 P07099 1/20 0.36
SIGMAR1 Q99720 7/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1519047 0.88 SIGMAR1 (0.35) MEN1KMT2ATAAR1CTSKCTSL
SCHEMBL28233865 0.84 CHRNB2 (0.39) TAAR1ALDH1A1CYP3A4TSHRSIGMAR1
SCHEMBL614550 0.79 TAAR1 (0.39) TAAR1ALDH1A1SIGMAR1
SCHEMBL31028386 0.79 SIGMAR1 (0.40) TAAR1ALDH1A1CYP3A4TSHRSIGMAR1
SCHEMBL28854442 0.78 TSHR (0.38) CTSKALDH1A1CTSLCTSBCTSH
SCHEMBL31258157 0.76 TAAR1 (0.34) MEN1KMT2ATAAR1ALDH1A1CYP3A4
SCHEMBL555288 0.75 ADH1B (0.50) ADH1BADH1CADH1AADH7EPHX1
SCHEMBL9860909 0.72 MAOA (0.41) MEN1KMT2AALDH1A1SIGMAR1
SCHEMBL5810211 0.71 MEN1 (0.38) MEN1KMT2ASIGMAR1
SCHEMBL31028360 0.71 MEN1 (0.42) MEN1KMT2AADH1BADH1CADH1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118460065-A Arc breakdown resistant insulating paint and preparation method and application thereof 信和新材料股份有限公司 2024-08-09 CN claimed
CN-118460065-A Arc breakdown resistant insulating paint and preparation method and application thereof 信和新材料股份有限公司 2024-08-09 CN disclosed