SCHEMBL31169459

SCHEMBL31169459

C=CC(=O)Oc1ccc(C(=O)c2ccc(OC(=O)C=C)cc2O)c(O)c1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 2/20 0.58
RAB9A P51151 2/20 0.58
HPGD P15428 5/20 0.50
LMNA P02545 5/20 0.50
CYP3A4 P08684 4/20 0.50
CYP2C19 P33261 3/20 0.50
CYP1A2 P05177 2/20 0.50
PGR P06401 2/20 0.50
SLC6A2 P23975 2/20 0.50
ALOX15 P16050 2/20 0.50
ADORA3 P0DMS8 1/20 0.50
AR P10275 1/20 0.50
CHRM1 P11229 1/20 0.50
TBXA2R P21731 1/20 0.50
ADRA1A P35348 1/20 0.50
HIF1A Q16665 1/20 0.50
MAPK1 P28482 4/20 0.45
ALDH1A1 P00352 4/20 0.45
CYP2D6 P10635 1/20 0.45
PDE4A P27815 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8512513 1.00 NPC1 (0.58) NPC1RAB9AHPGDLMNACYP3A4
SCHEMBL28847034 0.89 HPGD (0.50) NPC1RAB9AHPGDLMNACYP3A4
SCHEMBL9138399 0.88 ALDH1A1 (0.53) NPC1RAB9AHPGDLMNACYP3A4
SCHEMBL989072 0.88 HPGD (0.64) NPC1RAB9AHPGDLMNACYP3A4
SCHEMBL30173685 0.88 HPGD (0.64) NPC1RAB9AHPGDLMNACYP3A4
SCHEMBL29895892 0.87 RAB9A (0.48) NPC1RAB9AHPGDLMNACYP3A4
SCHEMBL17090862 0.87 RAB9A (0.48) NPC1RAB9AHPGDLMNACYP3A4
SCHEMBL14889207 0.86 ALDH1A1 (0.62) NPC1RAB9AHPGDCYP3A4MAPK1
SCHEMBL11225929 0.83 THRB (0.47) NPC1RAB9AHPGDCYP3A4ALOX15
SCHEMBL21170004 0.83 THRB (0.47) NPC1RAB9AHPGDLMNACYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4660266-A1 COMPOSITION FOR TEMPORARY FIXING, ADHESIVE FOR TEMPORARY FIXING, AND THIN WAFER PRODUCTION METHOD Denka Company Limited (JP) 2025-12-10 EP disclosed
US-20250215289-A1 COMPOSITION FOR TEMPORARY FIXATION DENKA COMPANY LIMITED (JP) 2025-07-03 US disclosed
EP-4502093-A1 COMPOSITION FOR TEMPORARY FIXATION Denka Company Limited (JP) 2025-02-05 EP disclosed
CN-118804961-A Temporary fixing composition, adhesive for temporary fixing, and method for producing thin wafer 电化株式会社 2024-10-18 CN disclosed