SCHEMBL3137458

SCHEMBL3137458

Nc1ccc(Oc2cc(-c3c(F)c(F)c(F)c(F)c3F)c(F)c(F)c2F)cc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.43
TDP1 Q9NUW8 3/20 0.43
TSHR P16473 2/20 0.43
CYP3A4 P08684 1/20 0.43
NCOA1 Q15788 1/20 0.41
NCOA3 Q9Y6Q9 1/20 0.41
MAPT P10636 5/20 0.40
MEN1 O00255 5/20 0.40
KMT2A Q03164 5/20 0.40
SMN1; SMN2 Q16637 3/20 0.40
MITF O75030 1/20 0.40
GAA P10253 1/20 0.40
GFER P55789 1/20 0.40
NLRP1 Q9C000 1/20 0.40
NOD2 Q9HC29 1/20 0.40
MAOA P21397 2/20 0.38
TEAD4 Q15561 1/20 0.37
MAOB P27338 1/20 0.37
POLB P06746 1/20 0.36
NPC1 O15118 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28338526 0.80 MMP2 (0.34) TSHRCYP3A4MAPTMEN1KMT2A
SCHEMBL28336685 0.80 ALDH1A1 (0.42) ALDH1A1TDP1MAPTMEN1KMT2A
SCHEMBL29092496 0.76 HSPB1 (0.55) ALDH1A1TSHRCYP3A4MAPTMEN1
SCHEMBL8552556 0.75 GAA (0.45) ALDH1A1TSHRMEN1KMT2AGAA
SCHEMBL3143336 0.74 MAPT (0.39) MAPTPOLBKDM4E
SCHEMBL23170641 0.71 ALDH1A1 (0.46) ALDH1A1TDP1TSHRCYP3A4NCOA1
SCHEMBL3563719 0.71 ALDH1A1 (0.50) ALDH1A1TDP1TSHRCYP3A4NCOA1
SCHEMBL1334036 0.70 ALDH1A1 (0.54) ALDH1A1TDP1TSHRCYP3A4MAPT
SCHEMBL30681849 0.69 ALDH1A1 (0.48) ALDH1A1TDP1TSHRCYP3A4MAPT
SCHEMBL21104547 0.68 ALDH1A1 (0.52) ALDH1A1TDP1TSHRCYP3A4NCOA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117202984-A Polyimide porous film 东京应化工业株式会社 2023-12-08 CN disclosed
CN-117203264-A Polyimide precursor composition and polyimide 杰富意化学株式会社 2023-12-08 CN disclosed
CN-116891570-A Polyamic acid, polyimide, metal-clad laminate, and circuit board 日铁化学材料株式会社 2023-10-17 CN disclosed
WO-2023195206-A1 POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE JFEケミカル株式会社 2023-10-12 WO disclosed
CN-116353168-A Resin laminate, circuit board, electronic component, and electronic device 日铁化学材料株式会社 2023-06-30 CN disclosed
CN-116367413-A Metal-clad laminate and circuit board 日铁化学材料株式会社 2023-06-30 CN disclosed
CN-113874420-A Resin film, metal-clad laminate, and method for producing same 日铁化学材料株式会社 2021-12-31 CN disclosed
CN-107531999-B Thermally conductive silicone grease composition 信越化学工业株式会社 2020-10-27 CN disclosed
EP-1782881-B1 Membrane and associated method GEN ELECTRIC (US) 2010-02-10 EP disclosed
EP-1783147-B1 Composition and associated method GEN ELECTRIC (US) 2009-05-13 EP disclosed
EP-1782881-A1 Membrane and associated method General Electric Company (US) 2007-05-09 EP disclosed
EP-1783147-A1 Composition and associated method GENERAL ELECTRIC COMPANY (US) 2007-05-09 EP disclosed