Predicted protein targets (top 2)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | IAPP | P10997 | 6/20 | 0.53 |
| ▸ | PRKCI | P41743 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31383411 | 0.89 | IAPP (0.55) | IAPPPRKCI | |
| SCHEMBL28467454 | 0.84 | IAPP (0.49) | IAPPPRKCI | |
| SCHEMBL31618870 | 0.83 | SELL (0.44) | — | |
| SCHEMBL22982305 | 0.83 | SELL (0.44) | — | |
| SCHEMBL31536310 | 0.78 | TYR (0.53) | IAPP | |
| SCHEMBL29191322 | 0.77 | AKR1B1 (0.59) | IAPP | |
| SCHEMBL29719025 | 0.77 | GABRA1 (0.56) | PRKCI | |
| SCHEMBL2475390 | 0.77 | GABRA1 (0.56) | PRKCI | |
| SCHEMBL5614092 | 0.76 | PKM (0.45) | — | |
| SCHEMBL660344 | 0.75 | IAPP (0.46) | IAPPPRKCI |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119968421-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-05-09 | — | — | CN | disclosed |
| CN-119731595-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-03-28 | — | — | CN | disclosed |
| CN-119731225-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2025-03-28 | — | — | CN | disclosed |