SCHEMBL3142984

SCHEMBL3142984

O=c1c2ccccc2[s+](-c2ccccc2)c2ccccc12

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.39
LMNA P02545 4/20 0.39
MAPT P10636 4/20 0.39
GLA P06280 3/20 0.39
HPGD P15428 3/20 0.39
KDM4E B2RXH2 3/20 0.39
HTT P42858 3/20 0.39
SMN1; SMN2 Q16637 2/20 0.39
ATM Q13315 2/20 0.39
GAA P10253 1/20 0.39
CYP3A4 P08684 1/20 0.39
PGAM1 P18669 1/20 0.39
MAOA P21397 1/20 0.39
CASP1 P29466 1/20 0.39
CASP7 P55210 1/20 0.39
HSD17B10 Q99714 1/20 0.39
P2RX4 Q99571 2/20 0.35
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
MAPK1 P28482 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13326153 0.95 ALDH1A1 (0.39) ALDH1A1LMNAMAPTGLAHPGD
SCHEMBL30118169 0.92 GLA (0.34) ALDH1A1LMNAMAPTGLAHPGD
SCHEMBL1059475 0.92 GLA (0.34) ALDH1A1LMNAMAPTGLAHPGD
SCHEMBL47563 0.87 ALDH1A1 (0.30) ALDH1A1HSD17B10TDP1
SCHEMBL12256973 0.87 LMNA (0.38) ALDH1A1LMNAMAPTGLAHPGD
SCHEMBL13326072 0.86 P2RX4 (0.41) ALDH1A1LMNAMAPTHPGDKDM4E
SCHEMBL13088245 0.86 MAOA (0.40) ALDH1A1GLAHPGDKDM4ESMN1; SMN2
SCHEMBL13088309 0.86 KDM4E (0.40) ALDH1A1LMNAMAPTGLAHPGD
SCHEMBL13326100 0.85 AKR1B1 (0.33) ALDH1A1LMNAMAPTGLAHPGD
SCHEMBL13326151 0.81 P2RX4 (0.38) ALDH1A1LMNAMAPTHPGDKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 127 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023127797-A1 PHOTOCURABLE RESIN COMPOSITION, CURED PRODUCT OF SAME, AND ELECTRONIC CIRCUIT BOARD PROVIDED WITH SAID CURED PRODUCT 太陽ホールディングス株式会社 2023-07-06 WO disclosed
CN-111978898-B Method for producing pressure-sensitive adhesive reactive adhesive tape 德莎欧洲股份公司 2022-09-09 CN disclosed
CN-114380929-A Functionalized (co) polymers for adhesive systems 德莎欧洲股份公司 2022-04-22 CN disclosed
CN-111548746-B UV curable adhesive tape and method for sheathing elongated objects, in particular wires 德莎欧洲股份公司 2022-04-12 CN disclosed
CN-109219624-B Functionalized (co) polymers for adhesive systems 德莎欧洲股份公司 2022-01-14 CN disclosed
CN-108884363-B Radiation-activatable pressure-sensitive adhesive tapes with dark reaction and use thereof 德莎欧洲股份公司 2021-10-15 CN disclosed
CN-109994288-B Forming rigid armored cables with curable jacket 德莎欧洲股份公司 2021-02-26 CN disclosed
CN-109071728-B Water vapor barrier adhesive compositions with highly functionalized poly (meth) acrylates 德莎欧洲股份公司 2021-02-19 CN disclosed
CN-111978898-A Method for producing pressure-sensitive adhesive reactive adhesive tape 德莎欧洲股份公司 2020-11-24 CN disclosed
EP-3714001-A1 PROCESS FOR PRODUCING PRESSURE-SENSITIVE REACTIVE ADHESIVE TAPES TESA SE (DE) 2020-09-30 EP disclosed
EP-2151443-A1 POLYHEDRAL POLYSILOXANE MODIFIED PRODUCT AND COMPOSITION USING THE MODIFIED PRODUCT Kaneka Corporation (JP) 2010-02-10 EP disclosed
US-7615330-B2 Positive resist composition and pattern formation method using the same FUJIFILM CORPORATION (JP) 2009-11-10 US disclosed
US-7541131-B2 Resist composition, compound for use in the resist composition and pattern forming method using the resist composition FUJIFILM CORPORATION (JP) 2009-06-02 US disclosed
WO-2009048705-A1 HIGHLY FUNCTIONAL MULTIPHOTON CURABLE REACTIVE SPECIES 3M INNOVATIVE PROPERTIES COMPANY (US) 2009-04-16 WO disclosed
US-20080268169-A1 Cationically Curable Coating Compositions SUN CHEMICAL CORPORATION (US) 2008-10-30 US disclosed
US-7374860-B2 Positive resist composition and pattern forming method using the same FUJI FILM CORPORATION (JP) 2008-05-20 US disclosed
US-20080085468-A1 microlithography; ultrafine processing of semiconductor using electron beam, X-ray or deep UV; high sensitivity, high resolution and good line edge roughness; suppression of vaporized outgas; a polystyrene with an acid-decomposable group; 10-tolyl-9-oxothioxanthenium nonafluorobutanesulfonate FUJIFILM CORPORATION (JP) 2008-04-10 US disclosed
US-20070224540-A1 Positive resist composition and pattern formation method using the same FUJIFILM CORPORATION (JP) 2007-09-27 US disclosed
EP-0931103-B1 MONOMERS, OLIGOMERS AND POLYMERS WITH TERMINAL OXIRANE GROUPS, METHOD OF PREPARATION AND POLYMERISATION UNDER RADIATION EXPOSURE UCB SA (BE) 2004-06-09 EP disclosed
US-6417243-B1 POLYESTERURETHANE BLOCKS UCB, S.A. (BE) 2002-07-09 US disclosed