Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | CA1 | P00915 | 1/20 | 0.30 |
| ▸ | CA2 | P00918 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9098380 | 0.81 | ALDH1A1 (0.39) | ALDH1A1L3MBTL1TSHRTDP1CA1 | |
| SCHEMBL4376440 | 0.81 | ALDH1A1 (0.39) | ALDH1A1L3MBTL1TSHRTDP1CA1 | |
| SCHEMBL3184068 | 0.76 | — | — | |
| SCHEMBL1304612 | 0.76 | — | — | |
| SCHEMBL3179759 | 0.75 | ALDH1A1 (0.39) | ALDH1A1L3MBTL1TSHRTDP1CA1 | |
| SCHEMBL3681571 | 0.75 | CA2 (0.39) | ALDH1A1L3MBTL1CA1CA2 | |
| SCHEMBL3204705 | 0.75 | ALDH1A1 (0.35) | ALDH1A1L3MBTL1 | |
| SCHEMBL11867986 | 0.73 | — | — | |
| SCHEMBL11863245 | 0.73 | — | — | |
| SCHEMBL3673939 | 0.73 | CA2 (0.41) | ALDH1A1L3MBTL1CA1CA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7669752-B2 | Flux for soldering and circuit board | HARIMA CHEMICALS, INC. (JP) | 2010-03-02 | — | — | US | disclosed |
| US-20070241170-A1 | FLUX FOR SOLDERING AND CIRCUIT BOARD | HARIMA CHEMICALS, INC. | 2007-10-18 | — | — | US | disclosed |
| US-7166152-B2 | Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method | DAIWA FINE CHEMICALS CO., LTD. (JP) | 2007-01-23 | — | — | US | disclosed |
| US-20060147683-A1 | Flux for soldering and circuit board | HARIMA CHEMICALS, INC. | 2006-07-06 | — | — | US | disclosed |
| EP-1342726-B1 | Solder precipitating composition and solder precipitation method | HARIMA CHEMICALS INC (JP) | 2005-08-17 | — | — | EP | disclosed |
| US-6923875-B2 | Solder precipitating composition | HARIMA CHEMICALS, INC. (JP) | 2005-08-02 | — | — | US | disclosed |
| US-20040043153-A1 | Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method | DAIWA FINE CHEMICALS CO., LTD. | 2004-03-04 | — | — | US | disclosed |
| EP-1342726-A1 | Solder precipitating composition and solder precipitation method | Harima Chemicals, Inc. (JP) | 2003-09-10 | — | — | EP | disclosed |
| US-20030159761-A1 | Solder precipitating composition and solder precipitation method | HARIMA CHEMICALS, INC. | 2003-08-28 | — | — | US | disclosed |