Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 2/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.47 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.35 |
| ▸ | KCNH3 | Q9ULD8 | 3/20 | 0.34 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.34 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.34 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.34 |
| ▸ | HTR2A | P28223 | 1/20 | 0.33 |
| ▸ | HRH1 | P35367 | 1/20 | 0.33 |
| ▸ | PSEN1 | P49768 | 1/20 | 0.33 |
| ▸ | PSEN2 | P49810 | 1/20 | 0.33 |
| ▸ | APH1B | Q8WW43 | 1/20 | 0.33 |
| ▸ | NCSTN | Q92542 | 1/20 | 0.33 |
| ▸ | APH1A | Q96BI3 | 1/20 | 0.33 |
| ▸ | PSENEN | Q9NZ42 | 1/20 | 0.33 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | PPARG | P37231 | 1/20 | 0.31 |
| ▸ | NPC1 | O15118 | 1/20 | 0.31 |
| ▸ | RAB9A | P51151 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28658048 | 0.85 | MAPT (0.44) | MAPTALDH1A1L3MBTL1KCNH3CYP1A2 | |
| SCHEMBL3195231 | 0.84 | MAPT (0.50) | MAPTALDH1A1L3MBTL1KCNH3CYP1A2 | |
| SCHEMBL3188639 | 0.84 | GAA (0.51) | MAPTALDH1A1L3MBTL1NPSR1TDP1 | |
| SCHEMBL16192536 | 0.81 | MAPT (0.44) | MAPTALDH1A1NPSR1TDP1SMN1; SMN2 | |
| SCHEMBL15643120 | 0.78 | ALDH1A1 (0.43) | MAPTALDH1A1PSEN1PSEN2APH1B | |
| SCHEMBL2255790 | 0.75 | ALDH1A1 (0.64) | MAPTALDH1A1L3MBTL1KCNH3CYP3A4 | |
| SCHEMBL483772 | 0.74 | ALDH1A1 (0.53) | MAPTALDH1A1L3MBTL1KCNH3CYP1A2 | |
| SCHEMBL10606669 | 0.74 | ALDH1A1 (0.57) | MAPTALDH1A1L3MBTL1KCNH3CYP1A2 | |
| SCHEMBL722359 | 0.73 | ALDH1A1 (0.52) | MAPTALDH1A1L3MBTL1KCNH3CYP1A2 | |
| SCHEMBL3340543 | 0.72 | SMN1; SMN2 (0.43) | MAPTALDH1A1CYP1A2CYP2C19SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023097771-A1 | EPOXY MOLDING COMPOUND OF MODIFIED SILICON DIOXIDE GRAFTED EPOXY RESIN, AND PREPARATION METHOD THEREFOR | 中国科学院深圳先进技术研究院 | 2023-06-08 | — | — | WO | disclosed |
| US-20140113230-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED THEREFROM | ROHM & HAAS ELECT MAT (KR) | 2014-04-24 | — | — | US | disclosed |
| US-7846998-B2 | nonhalogenated and non-antimony sealant epoxy-resin molding material superior in flame resistance and still retaining reliability, for example, of moldability, reflow resistance, moisture resistance and high-temperature storage | HITACHI CHEMICAL CO., LTD. (JP) | 2010-12-07 | — | — | US | disclosed |
| US-7666953-B2 | Phosphine-protonated haloaromatic compound accelerator with curing resin and curing agent | HITACHI CHEMICAL CO, LTD. (JP) | 2010-02-23 | — | — | US | disclosed |
| US-20090143511-A1 | ENCAPSULATED EPOXY-RESIN MOLDING COMPOUND, AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-06-04 | — | — | US | disclosed |
| US-20090137717-A1 | ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-05-28 | — | — | US | disclosed |
| US-20090062430-A1 | Epoxy Resin Composition for Sealing and Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2009-03-05 | — | — | US | disclosed |
| US-20090005480-A1 | REACTION PRODUCT OF PHOSPHINE AND PROTONATED HALOARYL COMPOUND AND USE AS EPOXY CURING ACCELERATOR | NAKAMURA SHINYA | 2009-01-01 | — | — | US | disclosed |
| US-20080262135-A1 | REACTION PRODUCT OF PHOSPHINE AND PROTONATED HALOARYL COMPOUND AND USE AS EPOXY CURING ACCELERATOR | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2008-10-23 | — | — | US | disclosed |
| US-20080234409-A1 | nonhalogenated and non-antimony sealant epoxy-resin molding material superior in flame resistance and still retaining reliability, for example, of moldability, reflow resistance, moisture resistance and high-temperature storage | HITACHI CHEMICAL CO., LTD. (JP) | 2008-09-25 | — | — | US | disclosed |
| US-7397139-B2 | Containing a curing agent and an inorganic filler, especially silica having a maximum diameter size of at least 32 mu m, an average particle size of 12 mu m or less and a specific surface area of 3.0 m2/g or more | HITACHI CHEMICAL CO., LTD. (JP) | 2008-07-08 | — | — | US | disclosed |
| US-20080039556-A1 | Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2008-02-14 | — | — | US | disclosed |
| US-20060214153-A1 | Containing a curing agent and an inorganic filler, especially silica having a maximum diameter size of at least 32 mu m, an average particle size of 12 mu m or less and a specific surface area of 3.0 m2/g or more | HITACHI CHEMICAL CO., LTD. (JP) | 2006-09-28 | — | — | US | disclosed |
| US-20060014873-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2006-01-19 | — | — | US | disclosed |
| US-20050267286-A1 | Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative | HITACHI CHEMICAL CO., LTD. (JP) | 2005-12-01 | — | — | US | disclosed |
| US-20050222300-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2005-10-06 | — | — | US | disclosed |
| US-20050165202-A1 | Curing accelerator for curing resin, curing resin composition and electronic component device | HITACHI CHEMICAL CO., LTD. (JP) | 2005-07-28 | — | — | US | disclosed |
| WO-2003072655-A1 | ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-04 | — | — | WO | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20090005480-A1 | REACTION PRODUCT OF PHOSPHINE AND PROTONATED HALOARYL COMPOUND AND USE AS EPOXY CURING ACCELERATOR | HDHD5, EHMT2, HRH2 | MAPT 4473/4885ALDH1A1 839/4885L3MBTL1 4020/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.