SCHEMBL324893

SCHEMBL324893

Nc1ccc(S(=O)(=O)c2ccc(S(=O)(=O)c3ccc(N)cc3)cc2)cc1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTR6 P50406 4/20 1.00
TSHR P16473 3/20 1.00
CYP3A4 P08684 2/20 1.00
LMNA P02545 2/20 1.00
MPO P05164 1/20 1.00
CYP2C9 P11712 1/20 1.00
MEN1 O00255 1/20 0.76
KMT2A Q03164 1/20 0.76
ALDH1A1 P00352 3/20 0.70
PKM P14618 2/20 0.70
CA1 P00915 3/20 0.65
CA2 P00918 3/20 0.65
CA12 O43570 2/20 0.65
CA9 Q16790 2/20 0.65
CA14 Q9ULX7 2/20 0.65
USP2 O75604 1/20 0.65
CA4 P22748 1/20 0.65
CA6 P23280 1/20 0.65
CA5A P35218 1/20 0.65
CA7 P43166 1/20 0.65

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Dapsone SCHEMBL21428 1.00 HTR6 (1.00) HTR6TSHRCYP3A4LMNAMPO
SCHEMBL10596934 1.00 HTR6 (1.00) HTR6TSHRCYP3A4LMNAMPO
Dapsone SCHEMBL5055312 1.00 HTR6 (1.00) HTR6TSHRCYP3A4LMNAMPO
Dapsone SCHEMBL1219599 1.00 HTR6 (1.00) HTR6TSHRCYP3A4LMNAMPO
Dapsone SCHEMBL9690514 0.97 HTR6 (0.94) HTR6TSHRCYP3A4LMNAMPO
Dapsone SCHEMBL11745790 0.97 HTR6 (0.94) HTR6TSHRCYP3A4LMNAMPO
Dapsone SCHEMBL28520980 0.97 HTR6 (0.94) HTR6TSHRCYP3A4LMNAMPO
Dapsone SCHEMBL27664082 0.97 HTR6 (0.94) HTR6TSHRCYP3A4LMNAMPO
Dapsone SCHEMBL2203636 0.97 HTR6 (0.94) HTR6TSHRCYP3A4LMNAMPO
Dapsone SCHEMBL9690505 0.97 HTR6 (0.94) HTR6TSHRCYP3A4LMNAMPO

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 338 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122074082-A Polyimide film having improved breakdown characteristics and method for producing same 聚酰亚胺尖端素材株式会社 2026-05-22 CN claimed
US-20240218126-A1 POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF PI ADVANCED MATERIALS CO., LTD. (KR) 2024-07-04 US claimed
EP-4393981-A1 POLYIMIDE MOLDED PRODUCT AND MANUFACTURING METHOD THEREOF PI Advanced Materials Co., Ltd. (KR) 2024-07-03 EP claimed
WO-2024117669-A1 POLYIMIDE VARNISH FOR COATING CONDUCTOR WITH IMPROVED HEAT DISSIPATION FOR COATING CONDUCTOR AND POLYIMIDE COATING MATERIAL COMPRISING THE SAME PI ADVANCED MATERIALS CO., LTD. (KR) 2024-06-06 WO claimed
WO-2024112104-A1 POLYIMIDE FILM COMPRISING ADDITIVE AND GRAPHITE SHEET PREPARED BY USING SAME PI ADVANCED MATERIALS CO., LTD. (KR) 2024-05-30 WO claimed
WO-2024076094-A1 BLACK POLYIMIDE FILM AND THE MANUFACTURING METHOD THEREOF PI ADVANCED MATERIALS CO., LTD. (KR) 2024-04-11 WO claimed
US-20240026098-A1 POLYIMIDE FILM HAVING HIGH DIMENSIONAL STABILITY AND MANUFACTURING METHOD THEREFOR PI ADVANCED MATERIALS CO., LTD. (KR) 2024-01-25 US claimed
WO-2023243967-A1 BLACK POLYIMIDE FILM AND MANUFACTURING METHOD THEREOF PI ADVANCED MATERIALS CO., LTD. (KR) 2023-12-21 WO claimed
WO-2023200191-A1 MANUFACTURING METHOD OF POLYIMIDE POWDER AND POLYIMIDE POWDER MANUFACTURED BY THE SAME PI ADVANCED MATERIALS CO., LTD. (KR) 2023-10-19 WO claimed
WO-2023191434-A1 POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR 피아이첨단소재 주식회사 2023-10-05 WO claimed
EP-2063002-B1 Method for depositing and patterning carbon nanotubes using chemical self-assembly process SAMSUNG ELECTRONICS CO LTD (KR) 2011-11-23 EP claimed
EP-1455007-B1 Method for depositing and patterning carbon nanotubes using chemical self-assembly process SAMSUNG ELECTRONICS CO LTD (KR) 2010-06-02 EP claimed
EP-2063002-A2 Method for depositing and patterning carbon nanotubes using chemical self-assembly process Samsung Electronics Co., Ltd. (KR) 2009-05-27 EP claimed
US-20060004180-A1 Solution compositions of block copolyimides comprising pyromellitic dianhydride and process for production thereof PI R&D CO., LTD. (JP) 2006-01-05 US claimed
US-6960425-B2 Method for laminating and patterning carbon nanotubes using chemical self-assembly process SAMSUNG ELECTRONICS CO., LTD. (KR) 2005-11-01 US claimed
EP-1561786-A1 SOLUTION COMPOSITIONS OF BLOCK COPOLYIMIDES COMPRISING PYROMELLITIC DIANHYDRIDE AND PROCESS FOR PRODUCTION THEREOF PI R & D Co., Ltd. (JP) 2005-08-10 EP claimed
EP-1455007-A2 Method for depositing and patterning carbon nanotubes using chemical self-assembly process SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-09-08 EP claimed
US-20040142285-A1 Method for laminating and patterning carbon nanotubes using chemical self-assembly process SAMSUNG ELECTRONICS CO., LTD. 2004-07-22 US claimed
US-6541178-B2 An sulfonium(-) and iodonium(+)ion-type photoacid generator containing a naphthol structure, and photosensitive polyimide resin using photoacid generator SAMSUNG ELECTRONICS CO., LTD. (KR) 2003-04-01 US claimed
US-20020048719-A1 Ion-type photoacid generator containing naphthol and photosensitive polyimide composition prepared by using the same SAMSUNG ELECTRONICS CO., LTD. 2002-04-25 US claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20020048719-A1 Ion-type photoacid generator containing naphthol and photosensitive polyimide composition prepared by using the same ASIC1, H1-0, RER1 HTR6 2742/4885TSHR 3446/4885CYP3A4 1426/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.